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TPS2491DGSRG4

Texas Instruments

TPS2491DGSRG4 by Texas Instruments

TPS2491DGSRG4 by Texas Instruments is a Power Management IC with 48V nominal voltage and 500A max output current. It comes in a small outline, thin profile package suitable for industrial applications requiring power supply support circuits. The IC features dual terminal position, gull wing form, and operates b/w -40 to 85°C temperature range.

Median Price

$1.737

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,500 parts In-Stock

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$1.737

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Chip Stock

USA . 15,540 parts In-Stock

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Digiode

USA . 4,677 parts In-Stock

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Vyrian

USA . 2,389 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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Semicontronic

India . 2,406 parts In-Stock

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$1.210

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$1.180

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$1.174

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-

2,406

$1.210

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$2.556

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$2.429

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$2.429

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40

$2.556

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$2.429

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Ampacity Inc.

Singapore . 2,118 parts In-Stock

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$2.630

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Component Stockers USA

USA . 5,698 parts In-Stock

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$21.470

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$21.470

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$21.470

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$21.470

5,698

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$21.470

$21.470

$21.470

Parana Technologies

USA . 304 parts In-Stock

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$21.675

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$22.096

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Corohmni

South Africa . 197 parts In-Stock

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$23.401

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DigiPath Technology Company

USA . 1,678 parts In-Stock

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$23.867

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$21.958

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1,678

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ChromeModa Solutions

Germany . 782 parts In-Stock

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$24.354

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$19.970

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IDEA Electronic Components Group

UK . 589 parts In-Stock

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$24.354

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$23.136

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$21.919

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Microchip USA

USA . 11,676 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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Lixinc

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A-Z Elektronik GmbH

Germany . 4,860 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Perfect Parts

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Robosynatics

Brazil . 1,836 parts In-Stock

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Lucentia Tech

USA . 1,836 parts In-Stock

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$3.829

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$3.829

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$3.829

1,836

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$3.829

Argo Parts USA

USA . 650 parts In-Stock

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Bastille Electronics

Australia . 89 parts In-Stock

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Modulus Dynamics

Lithuania . 35 parts In-Stock

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iodParts Technologies Inc.

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Overview

Upgrade your power management game with the TPS2491DGSRG4 by Texas Instruments. This high-quality Power Management IC offers unparalleled reliability and performance, making it the perfect choice for a wide range of applications. From industrial to automotive, this versatile product ensures optimal power supply support circuitry while providing maximum output current of 500A. Trust in Texas Instruments to deliver innovative solutions that meet your needs and exceed your expectations. Experience the difference with the TPS2491DGSRG4 – your power management upgrade awaits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to heat, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and secure installation on PCBs, saving space and improving reliability.

Nominal Supply Voltage (Vsup): 48 V

Matches the required voltage for many power management applications, ensuring compatibility.

No. of Terminals: 10

Offers flexibility in connecting to other circuit components, enabling versatile use.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high-temperature environments, increasing reliability and lifespan.

Minimum Supply Voltage (Vsup): 9 V

Provides a wide input voltage range, allowing for compatibility with different power sources.

Maximum Output Current: 500 A

Can handle high current loads, making it suitable for powering various devices and systems.

Technical Specifications

Power Management ICs TPS2491DGSRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

500 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

80 V

Minimum Supply Voltage (Vsup):

9 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS2491DGSRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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