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TPS2375D

Texas Instruments

TPS2375D by Texas Instruments

TPS2375D by Texas Instruments is a Power Management IC with 48V nominal voltage. It has 8 terminals, operates b/w -40 to 85°C, and supports power supply circuits. The package is small outline, surface mountable, with nickel palladium gold finish suitable for industrial applications.

Median Price

$2.298

Lifecycle Status

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21

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1k+

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Chip1Stop

Japan . 1 parts In-Stock

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Texas Instruments

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DigiKey

USA . 963 parts In-Stock

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$3.620

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$2.302

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$2.067

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$1.915

963

$3.620

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$1.915

Mouser Electronics

USA . 410 parts In-Stock

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$3.620

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$2.310

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Arrow

USA . 150 parts In-Stock

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$2.249

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$1.854

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Verical

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Rochester

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$1.510

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Distributors (In-Stock)

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Digiode

USA . 636 parts In-Stock

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Nova Conductors

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Chip Stock

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Vyrian

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ComSIT Distribution GmbH

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TME

Poland . 375 parts In-Stock

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Bas Electronics GmbH & Co. KG

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Bristol Electronics

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Flex Direct, LLC

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Rebound Electronics

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Cyclops Electronics Ltd

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Classic Components Corporation

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Ashlea Components Ltd

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LWI Electronics Inc

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Distributors (Availability)

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Ampacity Inc.

Singapore . 265 parts In-Stock

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$1.370

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$1.370

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Semicontronic

India . 40 parts In-Stock

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$1.370

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$1.336

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$1.329

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$1.370

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Corphita

USA . 4,640 parts In-Stock

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$1.449

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Continental Prestige Electronics

USA . 6,295 parts In-Stock

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$1.680

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$1.646

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Argo Parts USA

USA . 2,510 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Component Stockers USA

USA . 88 parts In-Stock

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Aranea Global

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Parana Technologies

USA . 326 parts In-Stock

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DigiPath Technology Company

USA . 1,578 parts In-Stock

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$15.669

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$14.416

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ChromeModa Solutions

Germany . 5,439 parts In-Stock

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$15.989

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$13.111

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IDEA Electronic Components Group

UK . 1,611 parts In-Stock

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$14.390

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Corohmni

South Africa . 131 parts In-Stock

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Perfect Parts

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Robosynatics

Brazil . 100 parts In-Stock

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$0.239

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Lucentia Tech

USA . 100 parts In-Stock

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$0.239

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$0.239

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$0.239

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Kepictronics

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ChipstoGo Electronic ltd

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Overview

Elevate your power management solutions with the TPS2375D by Texas Instruments, a cutting-edge Power Management IC designed to optimize performance and reliability. Crafted with high-quality materials and advanced technology, this product offers unparalleled efficiency and versatility for a wide range of applications. From industrial settings to consumer electronics, the TPS2375D delivers consistent power supply support with precision and ease. Experience the value of superior engineering and innovation with Texas Instruments, setting new standards in power management ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good thermal and electrical insulation, making the product reliable and safe to use.

Surface Mount: YES

Enables easy installation on circuit boards, saving time and effort in assembly.

Nominal Supply Voltage (Vsup): 48 V

Matches the common voltage requirement in many power management applications, ensuring compatibility.

Maximum Operating Temperature: 85 °C

Allows the product to withstand high temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Ensures the product can operate in low temperature conditions without any issues.

Width (mm): 3.9 mm

Compact size enables space-saving and efficient PCB layout.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Provides additional support and functionality for power supply, enhancing the overall performance of the product.

Maximum Supply Current (Isup): 0.45 mA

Low power consumption helps in reducing energy costs and extends the product's lifespan.

Technical Specifications

Power Management ICs TPS2375D attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.45 mA

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS2375D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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