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LM74502HDDFR

Texas Instruments

LM74502HDDFR by Texas Instruments

LM74502HDDFR by Texas Instruments is a Power Management IC with 8 terminals, operating b/w -40 to 125°C. It supports supply voltages from 3.2V to 65V and has an adjustable threshold of +2.8V, making it ideal for power supply support circuits in various applications.

Median Price

$1.940

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 18,546 parts In-Stock

1+ parts

$1.524

100+ parts

$1.172

1k+ parts

$0.617

10k+ parts

-

18,546

$1.524

$1.172

$0.617

-

Mouser Electronics

USA . 3,968 parts In-Stock

1+ parts

$1.940

100+ parts

$1.170

1k+ parts

$1.030

10k+ parts

$0.959

3,968

$1.940

$1.170

$1.030

$0.959

DigiKey

USA . 3,745 parts In-Stock

1+ parts

$1.940

100+ parts

$1.161

1k+ parts

$1.021

10k+ parts

$0.949

3,745

$1.940

$1.161

$1.021

$0.949

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.076

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$1.076

-

-

-

Digiode

USA . 2,799 parts In-Stock

1+ parts

$1.448

100+ parts

-

1k+ parts

-

10k+ parts

-

2,799

$1.448

-

-

-

Vyrian

USA . 7,805 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,805

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1,554 parts In-Stock

1+ parts

$1.076

100+ parts

-

1k+ parts

-

10k+ parts

$1.054

1,554

$1.076

-

-

$1.054

Argo Parts USA

USA . 229 parts In-Stock

1+ parts

$1.076

100+ parts

-

1k+ parts

-

10k+ parts

-

229

$1.076

-

-

-

Ampacity Inc.

Singapore . 7,763 parts In-Stock

1+ parts

$1.300

100+ parts

-

1k+ parts

-

10k+ parts

-

7,763

$1.300

-

-

-

Semicontronic

India . 7,592 parts In-Stock

1+ parts

$1.300

100+ parts

$1.268

1k+ parts

$1.261

10k+ parts

-

7,592

$1.300

$1.268

$1.261

-

Corphita

USA . 1,715 parts In-Stock

1+ parts

$1.372

100+ parts

-

1k+ parts

-

10k+ parts

-

1,715

$1.372

-

-

-

Corohmni

South Africa . 532 parts In-Stock

1+ parts

$7.814

100+ parts

-

1k+ parts

-

10k+ parts

-

532

$7.814

-

-

-

Parana Technologies

USA . 2,013 parts In-Stock

1+ parts

$9.068

100+ parts

-

1k+ parts

$9.728

10k+ parts

-

2,013

$9.068

-

$9.728

-

DigiPath Technology Company

USA . 1,567 parts In-Stock

1+ parts

$9.985

100+ parts

$9.186

1k+ parts

-

10k+ parts

-

1,567

$9.985

$9.186

-

-

ChromeModa Solutions

Germany . 1,155 parts In-Stock

1+ parts

$10.189

100+ parts

$8.355

1k+ parts

-

10k+ parts

-

1,155

$10.189

$8.355

-

-

IDEA Electronic Components Group

UK . 929 parts In-Stock

1+ parts

$10.189

100+ parts

$9.680

1k+ parts

$9.170

10k+ parts

-

929

$10.189

$9.680

$9.170

-

Advanced Electronics

New Zealand . 214 parts In-Stock

1+ parts

$12.977

100+ parts

$12.328

1k+ parts

$12.328

10k+ parts

-

214

$12.977

$12.328

$12.328

-

QUARKTWIN TECHNOLOGY LTD

USA . 29,840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

29,840

-

-

-

-

Futuretech Components

Singapore . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.054

1k+ parts

$1.022

10k+ parts

$1.001

1,000

-

$1.054

$1.022

$1.001

Overview

Enhance your power management with the LM74502HDDFR by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides customers with exceptional value and benefits. Whether you're looking to optimize performance or streamline efficiency, the LM74502HDDFR delivers the advantages you need to stay ahead in the fast-paced world of technology. Choose Texas Instruments for cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and lightweight design, making it suitable for various applications.

Surface Mount:

YES - Allows for easy and efficient installation on circuit boards, saving time and effort during production.

Package Shape:

RECTANGULAR - Offers a compact and space-saving design for efficient PCB layout and integration.

Nominal Supply Voltage (Vsup):

12 V - Provides a reliable power source for stable operation of connected devices.

No. of Terminals:

8 - Offers flexibility for connecting multiple components in the system.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE - Ideal for space-constrained applications where size is a critical factor.

Maximum Operating Temperature:

125 °C - Ensures reliable performance under varying temperature conditions.

Minimum Operating Temperature:

40 °C - Can withstand extreme cold temperatures, making it suitable for a wide range of environments.

Terminal Finish:

NICKEL PALLADIUM GOLD - Provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position:

DUAL - Allows for versatile mounting options depending on the specific requirements of the application.

Maximum Seated Height:

1.1 mm - Low-profile design for compact devices where space is limited.

Width (mm):

1.6 mm - Slim form factor for efficient use of PCB real estate.

Other IC type:

POWER SUPPLY SUPPORT CIRCUIT - Offers additional support for stable and efficient power management in the system.

Minimum Supply Voltage (Vsup):

3.2 V - Allows for operation in low voltage scenarios while maintaining performance.

Peak Reflow Temperature °C:

260 - Withstands high-temperature reflow soldering processes during assembly.

Length:

2.9 mm - Compact size for fitting into small devices without compromising functionality.

Nominal Threshold Voltage (V):

+2.8V - Provides a reference level for controlling integrated power management functions.

Terminal Form:

GULL WING - Facilitates secure soldering connections for enhanced durability.

Terminal Pitch:

0.65 mm - Allows for precise positioning of terminals for reliable connectivity.

Moisture Sensitivity Level (MSL):

2 - Suitable for a wide range of operating environments with moderate moisture conditions.

Maximum Supply Voltage (Vsup):

65 V - Capable of handling high voltage inputs for versatile applications.

Adjustable Threshold:

YES - Offers flexibility in adjusting voltage thresholds to meet specific system requirements.

Technical Specifications

Power Management ICs LM74502HDDFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.11

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

65 V

Minimum Supply Voltage (Vsup):

3.2 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.8V

Width (mm):

1.6 mm

Trade Compliance

LM74502HDDFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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