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TPS26631RGER

Texas Instruments

TPS26631RGER by Texas Instruments

TPS26631RGER by Texas Instruments is a Power Management IC with 24V nominal voltage, 6A max output current, and -40 to 125°C operating temperature range. It is ideal for automotive applications due to its compact chip carrier package style and adjustable threshold feature.

Median Price

$3.136

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,784 parts In-Stock

1+ parts

$3.136

100+ parts

$2.590

1k+ parts

$1.400

10k+ parts

-

5,784

$3.136

$2.590

$1.400

-

Distributors (In-Stock)

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Nova Conductors

Japan . 90 parts In-Stock

1+ parts

$1.810

100+ parts

-

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90

$1.810

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Digiode

USA . 4,667 parts In-Stock

1+ parts

$2.979

100+ parts

-

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4,667

$2.979

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Kruse Electronics AG

Switzerland . 75,000 parts In-Stock

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75,000

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Kruse

Germany . 75,000 parts In-Stock

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75,000

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Cyclops Electronics Ltd

UK . 19,373 parts In-Stock

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19,373

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A2Z Electronics, Inc.

USA . 5,948 parts In-Stock

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5,948

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Vyrian

USA . 4,413 parts In-Stock

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4,413

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Chip Stock

USA . 4,280 parts In-Stock

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4,280

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Vectronix, Inc

USA . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,700 parts In-Stock

1+ parts

$1.804

100+ parts

-

1k+ parts

-

10k+ parts

$1.768

5,700

$1.804

-

-

$1.768

Argo Parts USA

USA . 1,990 parts In-Stock

1+ parts

$1.804

100+ parts

-

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1,990

$1.804

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Bastille Electronics

Australia . 94 parts In-Stock

1+ parts

$1.810

100+ parts

$1.720

1k+ parts

$1.634

10k+ parts

$1.611

94

$1.810

$1.720

$1.634

$1.611

Modulus Dynamics

Lithuania . 50 parts In-Stock

1+ parts

$2.002

100+ parts

$1.982

1k+ parts

$1.922

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-

50

$2.002

$1.982

$1.922

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Ampacity Inc.

Singapore . 4,099 parts In-Stock

1+ parts

$2.670

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4,099

$2.670

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Semicontronic

India . 3,871 parts In-Stock

1+ parts

$2.670

100+ parts

$2.603

1k+ parts

$2.590

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3,871

$2.670

$2.603

$2.590

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Corphita

USA . 1,845 parts In-Stock

1+ parts

$2.822

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1,845

$2.822

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Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$4.840

100+ parts

$4.598

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$4.598

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550

$4.840

$4.598

$4.598

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Parana Technologies

USA . 382 parts In-Stock

1+ parts

$10.632

100+ parts

-

1k+ parts

$11.124

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382

$10.632

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$11.124

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DigiPath Technology Company

USA . 1,405 parts In-Stock

1+ parts

$11.707

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1,405

$11.707

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ChromeModa Solutions

Germany . 6,792 parts In-Stock

1+ parts

$11.946

100+ parts

$9.796

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6,792

$11.946

$9.796

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IDEA Electronic Components Group

UK . 2,292 parts In-Stock

1+ parts

$11.946

100+ parts

$11.349

1k+ parts

$10.751

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2,292

$11.946

$11.349

$10.751

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Corohmni

South Africa . 233 parts In-Stock

1+ parts

$16.888

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233

$16.888

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GlobX GmbH

Germany . 75,215 parts In-Stock

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Lixinc

USA . 9,338 parts In-Stock

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Infinite Electronics LLP (Excess)

. 3,004 parts In-Stock

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3,004

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Formix International (Excess)

India . 3,000 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

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100+ parts

$0.757

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$0.757

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$0.757

500

-

$0.757

$0.757

$0.757

Overview

Enhance your power management system with the TPS26631RGER by Texas Instruments, a leading manufacturer known for high-quality products. This Power Management IC is designed to provide efficient and reliable performance, making it ideal for various applications. With a wide input voltage range and adjustable threshold, this chip carrier offers great flexibility for your projects. Trust Texas Instruments to deliver top-notch solutions that meet your needs and exceed your expectations. Upgrade your power management setup with the TPS26631RGER and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and lightweight, making the product suitable for various applications.

Nominal Supply Voltage (Vsup): 24 V

Optimal supply voltage for efficient power management and operation of the device.

Surface Mount: YES

Surface mount capability allows for easy and space-saving integration into circuit boards.

Maximum Output Current: 6 A

High output current capacity enables the product to handle power-intensive devices effectively.

Adjustable Threshold: YES

Adjustable threshold feature allows for fine-tuning of power management settings for specific requirements.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Temperature Grade: AUTOMOTIVE

Automotive grade temperature rating makes the product suitable for use in automotive applications where temperature fluctuations are common.

Technical Specifications

Power Management ICs TPS26631RGER attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

60 V

Minimum Supply Voltage (Vsup):

60 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

TPS26631RGER Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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