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UCD3138RGCT

Texas Instruments

UCD3138RGCT by Texas Instruments

UCD3138RGCT by Texas Instruments is a Power Management IC with 8 outputs. It operates in temperatures ranging from -40 to 125°C, making it suitable for automotive applications. This chip carrier has a very thin profile and is surface mountable, with a terminal pitch of 0.5mm.

Median Price

$13.014

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 990 parts In-Stock

1+ parts

$13.014

100+ parts

$11.368

1k+ parts

$7.840

10k+ parts

-

990

$13.014

$11.368

$7.840

-

DigiKey

USA . 259 parts In-Stock

1+ parts

$16.880

100+ parts

$11.571

1k+ parts

$10.703

10k+ parts

-

259

$16.880

$11.571

$10.703

-

Mouser Electronics

USA . 137 parts In-Stock

1+ parts

$16.880

100+ parts

$11.580

1k+ parts

$10.700

10k+ parts

-

137

$16.880

$11.580

$10.700

-

Rochester

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$9.800

1k+ parts

$8.770

10k+ parts

$8.260

250

-

$9.800

$8.770

$8.260

Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$12.250

1k+ parts

$10.963

10k+ parts

$10.325

250

-

$12.250

$10.963

$10.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,818 parts In-Stock

1+ parts

$10.346

100+ parts

-

1k+ parts

-

10k+ parts

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2,818

$10.346

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$11.420

100+ parts

-

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-

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10

$11.420

-

-

-

Vyrian

USA . 6,986 parts In-Stock

1+ parts

-

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-

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6,986

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-

-

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Chip Stock

USA . 526 parts In-Stock

1+ parts

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526

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Prism Electronics

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

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1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 29 parts In-Stock

1+ parts

$8.863

100+ parts

-

1k+ parts

-

10k+ parts

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29

$8.863

-

-

-

Semicontronic

India . 379 parts In-Stock

1+ parts

$9.260

100+ parts

$9.028

1k+ parts

$8.982

10k+ parts

-

379

$9.260

$9.028

$8.982

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Ampacity Inc.

Singapore . 59 parts In-Stock

1+ parts

$9.260

100+ parts

-

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-

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59

$9.260

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-

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Corphita

USA . 3,520 parts In-Stock

1+ parts

$9.801

100+ parts

-

1k+ parts

-

10k+ parts

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3,520

$9.801

-

-

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Continental Prestige Electronics

USA . 761 parts In-Stock

1+ parts

$11.420

100+ parts

-

1k+ parts

-

10k+ parts

$11.192

761

$11.420

-

-

$11.192

Parana Technologies

USA . 877 parts In-Stock

1+ parts

$18.675

100+ parts

-

1k+ parts

$18.768

10k+ parts

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877

$18.675

-

$18.768

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DigiPath Technology Company

USA . 2,060 parts In-Stock

1+ parts

$20.563

100+ parts

$18.918

1k+ parts

-

10k+ parts

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2,060

$20.563

$18.918

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-

ChromeModa Solutions

Germany . 4,163 parts In-Stock

1+ parts

$20.983

100+ parts

$17.206

1k+ parts

-

10k+ parts

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4,163

$20.983

$17.206

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IDEA Electronic Components Group

UK . 822 parts In-Stock

1+ parts

$20.983

100+ parts

$19.934

1k+ parts

$18.885

10k+ parts

-

822

$20.983

$19.934

$18.885

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$21.502

100+ parts

$20.427

1k+ parts

$20.427

10k+ parts

-

2,500

$21.502

$20.427

$20.427

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Lixinc

USA . 12,793 parts In-Stock

1+ parts

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12,793

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Argo Parts USA

USA . 4,941 parts In-Stock

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4,941

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-

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A-Z Elektronik GmbH

Germany . 4,527 parts In-Stock

1+ parts

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4,527

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Perfect Parts

USA . 1,314 parts In-Stock

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1,314

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$11.192

1k+ parts

$10.849

10k+ parts

$10.621

500

-

$11.192

$10.849

$10.621

Kepictronics

USA . 223 parts In-Stock

1+ parts

-

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223

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Overview

Discover the power of Texas Instruments with the UCD3138RGCT Power Management IC. Designed for automotive applications, this high-quality chip carrier offers efficient power supply management with a very thin profile. With a wide operating temperature range and nickel-palladium-gold terminal finish, this surface-mount IC provides reliability and performance. Elevate your projects with the UCD3138RGCT and experience the benefits of cutting-edge technology from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the Power Management ICs a reliable choice for various applications.

Surface Mount: YES

Surface mount design enables easy installation and space-saving in compact electronic devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, these ICs can endure harsh environmental conditions and high temperature applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Width (mm): 9 mm

Compact width enables easy integration into various electronic systems without taking up much space.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, ensuring reliability and durability in automotive applications.

No. of Outputs: 8

With multiple outputs, these ICs can efficiently manage and distribute power to various components in a system.

Technical Specifications

Power Management ICs UCD3138RGCT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

2

No. of Outputs:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.88 mm

Maximum Supply Current (Isup):

100 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

9 mm

Trade Compliance

UCD3138RGCT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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