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BTS432E2E3062ABUMA1

Infineon Technologies

BTS432E2E3062ABUMA1 by Infineon Technologies

BTS432E2E3062ABUMA1 by Infineon is a Power Management IC with 4 terminals, operating voltage range of 4.5V to 42V, and AEC-Q100 screening for automotive applications. It has a compact rectangular package style, matte tin terminal finish, and can withstand temperatures from -40°C to 150°C. Ideal for power supply support circuits in automotive electronics.

Median Price

$2.012

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 184,905 parts In-Stock

1+ parts

-

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$1.900

1k+ parts

$1.700

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$1.600

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$1.900

$1.700

$1.600

Verical

USA . 184,905 parts In-Stock

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$2.125

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$2.000

184,905

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$2.125

$2.000

EBV Elektronik

Germany . 3,000 parts In-Stock

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Nova Conductors

Japan . 82 parts In-Stock

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$2.360

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82

$2.360

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Chip Stock

USA . 11,500 parts In-Stock

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Vyrian

USA . 7,431 parts In-Stock

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VNN

France . 4,947 parts In-Stock

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Digiode

USA . 543 parts In-Stock

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Semicontronic

India . 2,152 parts In-Stock

1+ parts

$1.790

100+ parts

$1.745

1k+ parts

$1.736

10k+ parts

-

2,152

$1.790

$1.745

$1.736

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Ampacity Inc.

Singapore . 2,151 parts In-Stock

1+ parts

$1.790

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$1.790

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Continental Prestige Electronics

USA . 4,826 parts In-Stock

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$2.360

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$2.313

4,826

$2.360

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$2.313

Argo Parts USA

USA . 3,751 parts In-Stock

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$2.360

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$2.360

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Modulus Dynamics

Lithuania . 3,950 parts In-Stock

1+ parts

$2.360

100+ parts

$2.266

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$2.171

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$2.360

$2.266

$2.171

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Corohmni

South Africa . 749 parts In-Stock

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$2.360

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749

$2.360

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Bastille Electronics

Australia . 84 parts In-Stock

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$2.360

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$2.242

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$2.130

10k+ parts

$2.100

84

$2.360

$2.242

$2.130

$2.100

Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$2.431

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$2.309

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$2.309

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$2.431

$2.309

$2.309

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Aztec Data Supply Inc.

USA . 2,714 parts In-Stock

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$6.900

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$6.900

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AZTECH Wire

Italy . 687 parts In-Stock

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$17.230

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Perfect Parts

USA . 118,720 parts In-Stock

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RC Electronics

USA . 34,059 parts In-Stock

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Kepictronics

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Microchip USA

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Epart123

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Authorized Procurement Solutions

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Robosynatics

Brazil . 1,527 parts In-Stock

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Lucentia Tech

USA . 1,527 parts In-Stock

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$2.313

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$2.266

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$2.266

1,527

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$2.266

$2.266

A-Z Elektronik GmbH

Germany . 1,352 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Corphita

USA . 324 parts In-Stock

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Overview

Unlock the power of efficient and reliable power management with the BTS432E2E3062ABUMA1 by Infineon Technologies. Manufactured by a trusted leader in the industry, this Power Management IC offers exceptional quality and performance for a wide range of applications. Whether you're looking to optimize energy consumption or enhance system reliability, this product delivers value through its advanced features and benefits. Experience peace of mind knowing that your power supply is in good hands with the BTS432E2E3062ABUMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product ideal for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Screening Level: AEC-Q100

This high reliability standard ensures the product can withstand harsh automotive environments.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space, making it suitable for compact designs.

Nominal Supply Voltage (Vsup): 12 V

The 12V supply voltage is commonly used in many systems, making this product compatible with a wide range of applications.

No. of Terminals: 4

The 4 terminals provide a secure connection, ensuring stable power distribution.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves board space and is suitable for portable devices.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, the product can perform reliably in extreme conditions.

Minimum Operating Temperature: -40 °C

The low operating temperature range ensures the product can function in cold environments.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability, ensuring a strong and reliable connection.

Terminal Position: SINGLE

Single terminal allows for easy installation and maintenance.

Maximum Seated Height: 4.5 mm

The low seated height makes the product suitable for slim designs.

Width (mm): 9.25 mm

The compact width allows for efficient use of board space.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This integrated circuit provides support for power supply functions, enhancing system reliability.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Peak Reflow Temperature °C: 245

With a high reflow temperature, the product can withstand the soldering process without damage.

Length: 10 mm

The compact length makes the product suitable for space-constrained applications.

Terminal Form: GULL WING

The gull wing terminal form provides a strong mechanical bond for increased durability.

Terminal Pitch: 1.7 mm

The small terminal pitch allows for tight packing of components on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the product has a moderate moisture sensitivity level, suitable for standard manufacturing processes.

Maximum Supply Voltage (Vsup): 42 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

Technical Specifications

Power Management ICs BTS432E2E3062ABUMA1 attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PSSO-G4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SMSIP5H,.6,67TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Screening Level:

AEC-Q100

Maximum Seated Height:

4.5 mm

Maximum Supply Voltage (Vsup):

42 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Width (mm):

9.25 mm

Trade Compliance

BTS432E2E3062ABUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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