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LTC4357IDCB#PBF

Analog Devices

LTC4357IDCB#PBF by Analog Devices

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Digiode

USA . 2,471 parts In-Stock

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Anansix

USA . 826 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Vyrian

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Technoshack Inc.

Canada . 33 parts In-Stock

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Semi Source

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MARBEL Systems

Belgium . 1,670 parts In-Stock

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$1.404

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Texas Native Microelectronics

USA . 800 parts In-Stock

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$1.614

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$1.549

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$1.501

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$1.420

800

$1.614

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Kenton Components

USA . 5,364 parts In-Stock

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$1.937

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$1.704

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Parana Technologies

USA . 1,540 parts In-Stock

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$2.115

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$1.967

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IDEA Electronic Components Group

UK . 591 parts In-Stock

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$2.274

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$2.160

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DigiPath Technology Company

USA . 1,668 parts In-Stock

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$3.547

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$3.406

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Qasali Group International

UK . 1,212 parts In-Stock

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One Stop Electronics

USA . 1,284 parts In-Stock

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Ampacity Inc.

Singapore . 1,159 parts In-Stock

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Semicontronic

India . 1,139 parts In-Stock

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$7.275

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Corohmni

South Africa . 49 parts In-Stock

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AZTECH Wire

Italy . 818 parts In-Stock

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Advanced Electronics

New Zealand . 700 parts In-Stock

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Continental Prestige Electronics

USA . 2,863 parts In-Stock

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Argo Parts USA

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Corphita

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Bastille Electronics

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Technical Specifications

Power Management ICs LTC4357IDCB#PBF attributes and parameters. Explore more Power Management ICs devices from Analog Devices

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

80 V

Minimum Supply Voltage (Vsup):

9 V

Nominal Supply Voltage (Vsup):

20 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

LTC4357IDCB#PBF Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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