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BTS4140N

Infineon Technologies

BTS4140N by Infineon Technologies

BTS4140N by Infineon Technologies is a Power Management IC with AEC-Q100 screening. It operates b/w -40 to 150°C, supports supply voltages from 4.9V to 60V, and has a compact package style suitable for power supply support circuits in automotive applications.

Median Price

$1.926

Lifecycle Status

Suppliers In-Stock

37

In-Stock Inventory

1k+

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Mouser Electronics

USA . 32,304 parts In-Stock

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Verical

USA . 2,255 parts In-Stock

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Freelance Electronics

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Greenchips

USA . 4,000 parts In-Stock

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TME

Poland . 844 parts In-Stock

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Maritex

Poland . 47,025 parts In-Stock

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Digiode

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Forefront Electronics and Design

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Infinite Electronics LLP

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LIBRA Elektronik GmbH

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Ampacity Inc.

Singapore . 28,485 parts In-Stock

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Semicontronic

India . 28,309 parts In-Stock

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Corphita

USA . 387 parts In-Stock

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CoreStaff

Japan . 2,304 parts In-Stock

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$0.927

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$0.880

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$2.944

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$2.797

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Modulus Dynamics

Lithuania . 3,224 parts In-Stock

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$12.042

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Corohmni

South Africa . 482 parts In-Stock

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Perfect Parts

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Infinite Electronics LLP (Excess)

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S.R.D Solutions

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Component Connect

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Futuretech Components

Singapore . 12,500 parts In-Stock

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Lixinc

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Continental Prestige Electronics

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Spain . 1,970 parts In-Stock

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Kepictronics

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Alle Elektronik GmbH

Germany . 1,600 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 347 parts In-Stock

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EMSNET (Excess)

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Lucentia Tech

USA . 250 parts In-Stock

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Overview

Infineon PROFET™ Smart High-Side Switches are placed between the supply and load to control the application. These highly integrated high-side switches incorporate a broad range of smart features like diagnosis and protection. PROFET switches consist of a DMOS power transistor and CMOS logic circuitry for complete built-in protection against overload, short-circuit, excessive temperature, ground loss, power supply loss, and electrostatic discharge (ESD).

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the PCB.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and quality for automotive applications.

Nominal Supply Voltage (Vsup): 6 V

Suitable voltage for powering various devices efficiently.

No. of Terminals: 4

Simplified connection interface for easy integration into circuits.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on the PCB and allows for efficient layout.

Maximum Operating Temperature: 150 °C

High operating temperature range ensures reliability in harsh environments.

Terminal Finish: TIN

Tin finish provides good conductivity and corrosion resistance.

Width (mm): 3.5 mm

Narrow width allows for more components to be packed closely together on the board.

Minimum Supply Voltage (Vsup): 4.9 V

Low minimum supply voltage allows for flexibility in powering the device.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure solder joints during assembly.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, allowing for safer storage and handling.

Maximum Supply Voltage (Vsup): 60 V

Wide voltage range capability for powering a variety of devices safely.

Technical Specifications

Power Management ICs BTS4140N attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Additional Features:

ESD Value for IN pin is 1C

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.8 mm

Maximum Supply Voltage (Vsup):

60 V

Minimum Supply Voltage (Vsup):

4.9 V

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Width (mm):

3.5 mm

Trade Compliance

BTS4140N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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