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INA228AIDGSR

Texas Instruments

INA228AIDGSR by Texas Instruments

Texas Instruments' INA228AIDGSR is a Power Management IC with 10 terminals, operating b/w -40 to 125°C. It supports supply voltages from 2.7V to 5.5V and has an adjustable threshold feature for automotive applications. The package is small outline, thin profile, and surface-mountable with a matte tin finish.

Median Price

$2.886

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,304 parts In-Stock

1+ parts

$3.232

100+ parts

$2.832

1k+ parts

$1.600

10k+ parts

-

1,304

$3.232

$2.832

$1.600

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Arrow

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$2.541

5,000

-

-

-

$2.541

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 23 parts In-Stock

1+ parts

$2.691

100+ parts

-

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23

$2.691

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Digiode

USA . 3,538 parts In-Stock

1+ parts

$3.070

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3,538

$3.070

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Maritex

Poland . 1,609 parts In-Stock

1+ parts

$4.569

100+ parts

$2.499

1k+ parts

$2.157

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-

1,609

$4.569

$2.499

$2.157

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Chip Stock

USA . 23,500 parts In-Stock

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23,500

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Vyrian

USA . 3,685 parts In-Stock

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3,685

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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3,000

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Sensible Micro Corp

USA . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,862 parts In-Stock

1+ parts

$2.160

100+ parts

-

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-

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3,862

$2.160

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Semicontronic

India . 3,636 parts In-Stock

1+ parts

$2.160

100+ parts

$2.106

1k+ parts

$2.095

10k+ parts

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3,636

$2.160

$2.106

$2.095

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Parana Technologies

USA . 1,280 parts In-Stock

1+ parts

$2.327

100+ parts

-

1k+ parts

$2.826

10k+ parts

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1,280

$2.327

-

$2.826

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ChromeModa Solutions

Germany . 5,648 parts In-Stock

1+ parts

$2.615

100+ parts

$2.144

1k+ parts

-

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5,648

$2.615

$2.144

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IDEA Electronic Components Group

UK . 1,820 parts In-Stock

1+ parts

$2.615

100+ parts

-

1k+ parts

$2.354

10k+ parts

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1,820

$2.615

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$2.354

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$2.637

100+ parts

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1k+ parts

$2.532

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100

$2.637

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$2.532

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Continental Prestige Electronics

USA . 5,527 parts In-Stock

1+ parts

$2.691

100+ parts

-

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-

10k+ parts

$2.637

5,527

$2.691

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-

$2.637

Argo Parts USA

USA . 2,145 parts In-Stock

1+ parts

$2.691

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2,145

$2.691

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Corphita

USA . 1,969 parts In-Stock

1+ parts

$2.909

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1,969

$2.909

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Modulus Dynamics

Lithuania . 2,606 parts In-Stock

1+ parts

$2.946

100+ parts

$2.946

1k+ parts

$2.946

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2,606

$2.946

$2.946

$2.946

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Corohmni

South Africa . 177 parts In-Stock

1+ parts

$9.959

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177

$9.959

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$13.608

100+ parts

$12.928

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$12.928

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500

$13.608

$12.928

$12.928

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Lixinc

USA . 19,886 parts In-Stock

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19,886

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Futuretech Components

Singapore . 3,810 parts In-Stock

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3,810

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A-Z Elektronik GmbH

Germany . 3,810 parts In-Stock

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Robosynatics

Brazil . 3,000 parts In-Stock

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Lucentia Tech

USA . 3,000 parts In-Stock

1+ parts

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$0.183

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$0.183

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$0.183

3,000

-

$0.183

$0.183

$0.183

DigiPath Technology Company

USA . 2,236 parts In-Stock

1+ parts

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100+ parts

$2.358

1k+ parts

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2,236

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$2.358

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Overview

Experience the next level of power management with the INA228AIDGSR by Texas Instruments. Designed with precision and quality in mind, this small outline power management IC offers unparalleled performance and reliability. Ideal for automotive applications, this innovative product provides adjustable thresholds and a wide operating temperature range, ensuring optimal functionality in any environment. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations, choose the INA228AIDGSR for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for various applications and environments.

Surface Mount: YES

Surface mount packaging allows for easy installation and saves space on the circuit board.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with a commonly used supply voltage, making it versatile for a range of electronic devices.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for applications where heat dissipation is important.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and conductivity, ensuring reliable connections.

Temperature Grade: AUTOMOTIVE

Designed to operate reliably in automotive environments, making it suitable for automotive power management applications.

Minimum Supply Voltage (Vsup): 2.7 V

Can operate at low supply voltages, providing flexibility in powering the device.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during the manufacturing process, ensuring proper soldering.

Maximum Supply Current (Isup): 1.1 mA

Low supply current consumption helps in reducing power consumption of the overall system.

Adjustable Threshold: YES

Ability to adjust threshold values provides customization and flexibility in power management settings.

Technical Specifications

Power Management ICs INA228AIDGSR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Current (Isup):

1.1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

INA228AIDGSR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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