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INA233AIDGSR

Texas Instruments

INA233AIDGSR by Texas Instruments

INA233AIDGSR by Texas Instruments is a Power Management IC with 10 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 2.7V to 5.5V and features adjustable threshold voltage for automotive applications in small outline square package.

Median Price

$2.525

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,492 parts In-Stock

1+ parts

$2.525

100+ parts

$2.213

1k+ parts

$1.250

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1,492

$2.525

$2.213

$1.250

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Chip1Stop

Japan . 2,191 parts In-Stock

1+ parts

$2.600

100+ parts

$1.970

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$1.710

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$1.420

2,191

$2.600

$1.970

$1.710

$1.420

Verical

USA . 510 parts In-Stock

1+ parts

-

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$2.048

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$1.684

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510

-

$2.048

$1.684

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Distributors (In-Stock)

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Nova Conductors

Japan . 75 parts In-Stock

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$2.020

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75

$2.020

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Digiode

USA . 2,141 parts In-Stock

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$2.042

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$2.042

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Chip Stock

USA . 95,780 parts In-Stock

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95,780

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Cyclops Electronics Ltd

UK . 9,989 parts In-Stock

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Vyrian

USA . 4,594 parts In-Stock

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Bristol Electronics

USA . 1,336 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 2,275 parts In-Stock

1+ parts

$1.097

100+ parts

-

1k+ parts

$1.936

10k+ parts

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2,275

$1.097

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$1.936

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DigiPath Technology Company

USA . 590 parts In-Stock

1+ parts

$1.208

100+ parts

$1.112

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590

$1.208

$1.112

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ChromeModa Solutions

Germany . 6,972 parts In-Stock

1+ parts

$1.233

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$1.011

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6,972

$1.233

$1.011

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IDEA Electronic Components Group

UK . 1,427 parts In-Stock

1+ parts

$1.233

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$1.110

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1,427

$1.233

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$1.110

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Ampacity Inc.

Singapore . 4,509 parts In-Stock

1+ parts

$1.480

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4,509

$1.480

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Semicontronic

India . 4,428 parts In-Stock

1+ parts

$1.480

100+ parts

$1.443

1k+ parts

$1.436

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4,428

$1.480

$1.443

$1.436

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Continental Prestige Electronics

USA . 6,171 parts In-Stock

1+ parts

$1.864

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$1.827

6,171

$1.864

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$1.827

Argo Parts USA

USA . 892 parts In-Stock

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$1.864

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892

$1.864

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Corphita

USA . 3,820 parts In-Stock

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$1.935

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3,820

$1.935

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Netroflash

USA . 500 parts In-Stock

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$2.020

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$1.919

10k+ parts

$1.879

500

$2.020

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$1.919

$1.879

Modulus Dynamics

Lithuania . 86 parts In-Stock

1+ parts

$2.242

100+ parts

$2.220

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$2.153

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86

$2.242

$2.220

$2.153

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$13.893

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$13.198

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$13.198

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50

$13.893

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$13.198

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Corohmni

South Africa . 261 parts In-Stock

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$20.049

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261

$20.049

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A-Z Elektronik GmbH

Germany . 12,759 parts In-Stock

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Lixinc

USA . 9,383 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 4,800 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,506 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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Robosynatics

Brazil . 1,197 parts In-Stock

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1,197

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Lucentia Tech

USA . 1,197 parts In-Stock

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$21.327

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$20.892

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$20.892

1,197

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$21.327

$20.892

$20.892

Overview

Experience superior power management with the Texas Instruments INA233AIDGSR. Made with high-quality materials and cutting-edge technology, this power management IC offers unparalleled performance and reliability. Ideal for automotive applications, this small outline, thin profile package provides precise power supply support circuitry with an adjustable threshold voltage. Trust Texas Instruments to deliver innovative solutions that meet your needs and exceed your expectations. Take your power management to the next level with the INA233AIDGSR.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - These materials provide durability and protection for the internal components of the IC, making it a reliable choice for power management applications.

Surface Mount:

YES - The surface mount design allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape:

SQUARE - The square shape of the package provides a compact footprint, ideal for space-constrained applications where efficiency is key.

Nominal Supply Voltage (Vsup):

3.3 V - The 3.3V nominal supply voltage is commonly used in many electronic devices, making this IC compatible with a wide range of applications.

No. of Terminals:

10 - With 10 terminals, this IC offers flexibility in connecting to external components, enabling customized power management solutions.

Package Style:

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - This package style allows for a low profile design, reducing the overall size of the circuit board and optimizing space usage.

Maximum Operating Temperature:

125 °C - With a high maximum operating temperature, this IC can withstand elevated environmental conditions, ensuring reliable performance under challenging circumstances.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature allows for the IC to function effectively in a wide range of environments, making it a versatile choice for various applications.

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER - The terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and stable electrical connections.

Terminal Position:

DUAL - The dual terminal position offers redundancy and backup connections, enhancing the overall reliability of the IC in critical power management applications.

Technical Specifications

Power Management ICs INA233AIDGSR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Current (Isup):

.4 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

INA233AIDGSR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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