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FUSB302BVMPX

Onsemi

FUSB302BVMPX by Onsemi

FUSB302BVMPX by Onsemi is a Power Management IC with 14 terminals, operating at temperatures from -40 to 105°C. It supports supply voltages from 2.7V to 5.5V and has an adjustable threshold feature. This IC is ideal for industrial applications requiring power supply support circuits in a compact square package style.

Median Price

$1.970

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4,431 parts In-Stock

1+ parts

$1.072

100+ parts

-

1k+ parts

-

10k+ parts

-

4,431

$1.072

-

-

-

Chip1Stop

Japan . 4,868 parts In-Stock

1+ parts

$1.490

100+ parts

$1.150

1k+ parts

$1.085

10k+ parts

-

4,868

$1.490

$1.150

$1.085

-

Mouser Electronics

USA . 6,859 parts In-Stock

1+ parts

$2.410

100+ parts

$1.470

1k+ parts

$1.210

10k+ parts

$1.170

6,859

$2.410

$1.470

$1.210

$1.170

DigiKey

USA . 2,909 parts In-Stock

1+ parts

$2.410

100+ parts

$1.464

1k+ parts

$1.293

10k+ parts

-

2,909

$2.410

$1.464

$1.293

-

Flip Electronics (Authorized)

USA . 36,004 parts In-Stock

1+ parts

-

100+ parts

-

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36,004

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-

-

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Avnet

USA . 15,000 parts In-Stock

1+ parts

-

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-

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10k+ parts

$3.769

15,000

-

-

-

$3.769

Verical

USA . 4,431 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,431

-

-

-

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Rochester

USA . 996 parts In-Stock

1+ parts

-

100+ parts

$1.530

1k+ parts

$1.270

10k+ parts

$1.130

996

-

$1.530

$1.270

$1.130

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,284 parts In-Stock

1+ parts

$1.197

100+ parts

-

1k+ parts

-

10k+ parts

-

1,284

$1.197

-

-

-

Nova Conductors

Japan . 64 parts In-Stock

1+ parts

$1.361

100+ parts

-

1k+ parts

-

10k+ parts

-

64

$1.361

-

-

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Flip Electronics

USA . 36,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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36,004

-

-

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Vyrian

USA . 14,254 parts In-Stock

1+ parts

-

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14,254

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-

-

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DigiKey Marketplace

USA . 12,996 parts In-Stock

1+ parts

-

100+ parts

$1.310

1k+ parts

-

10k+ parts

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12,996

-

$1.310

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 14,683 parts In-Stock

1+ parts

$0.920

100+ parts

$0.897

1k+ parts

$0.892

10k+ parts

-

14,683

$0.920

$0.897

$0.892

-

Ampacity Inc.

Singapore . 14,265 parts In-Stock

1+ parts

$0.920

100+ parts

-

1k+ parts

-

10k+ parts

-

14,265

$0.920

-

-

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Continental Prestige Electronics

USA . 3,000 parts In-Stock

1+ parts

$1.090

100+ parts

$0.717

1k+ parts

$0.501

10k+ parts

-

3,000

$1.090

$0.717

$0.501

-

Corphita

USA . 1,040 parts In-Stock

1+ parts

$1.134

100+ parts

-

1k+ parts

-

10k+ parts

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1,040

$1.134

-

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Argo Parts USA

USA . 3,196 parts In-Stock

1+ parts

$1.361

100+ parts

-

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-

10k+ parts

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3,196

$1.361

-

-

-

Microchip USA

USA . 5,167 parts In-Stock

1+ parts

$8.430

100+ parts

-

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-

10k+ parts

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5,167

$8.430

-

-

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Corohmni

South Africa . 130 parts In-Stock

1+ parts

$10.644

100+ parts

-

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-

10k+ parts

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130

$10.644

-

-

-

Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$13.035

100+ parts

$12.383

1k+ parts

$12.383

10k+ parts

-

60

$13.035

$12.383

$12.383

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Aztec Data Supply Inc.

USA . 2,161 parts In-Stock

1+ parts

$20.740

100+ parts

-

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2,161

$20.740

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Perfect Parts

USA . 20,233 parts In-Stock

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20,233

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TANS Electronics

Latvia . 8,030 parts In-Stock

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8,030

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GreenTree Electronics

Israel . 5,255 parts In-Stock

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5,255

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Problanco Electronics

Mexico . 1,109 parts In-Stock

1+ parts

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1,109

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-

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UHIMA Technologies

Türkiye . 970 parts In-Stock

1+ parts

-

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970

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SupplyDigital Components

Austria . 746 parts In-Stock

1+ parts

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746

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Kulean Microsystems

USA . 509 parts In-Stock

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509

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iodParts Technologies Inc.

India . 125 parts In-Stock

1+ parts

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125

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$1.334

1k+ parts

$1.293

10k+ parts

$1.266

100

-

$1.334

$1.293

$1.266

Overview

Discover the FUSB302BVMPX by Onsemi, a cutting-edge Power Management IC designed to optimize performance and efficiency. Trusted by industry professionals worldwide, Onsemi delivers top-notch quality and reliability in every product they create. Ideal for various applications, this surface mount chip carrier offers unparalleled value with its adjustable threshold feature, allowing for seamless integration and enhanced functionality. Experience the benefits of superior power supply support circuitry with the FUSB302BVMPX, where innovation meets excellence.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation and space-saving on PCBs.

Nominal Supply Voltage (Vsup): 3.3 V

Ideal for a wide range of applications requiring a stable power source.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Efficient heat dissipation and low profile design for compact devices.

Maximum Operating Temperature: 105 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions without issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides good conductivity and corrosion resistance for long-term reliability.

Width (mm): 2.5 mm

Compact size for fitting into tight spaces on the PCB.

Minimum Supply Voltage (Vsup): 2.7 V

Allows for operation even in situations where the voltage may drop slightly.

Peak Reflow Temperature °C: 260

Soldering reflow process can be done at high temperatures without damage.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with varying temperature extremes.

Technical Specifications

Power Management ICs FUSB302BVMPX attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N14

JESD-609 Code:

e4

Length:

2.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.5 mm

Trade Compliance

FUSB302BVMPX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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