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FUSB301TMX

Onsemi

FUSB301TMX by Onsemi

FUSB301TMX by Onsemi is a Power Management IC with 10 terminals, operating b/w -40 to 85°C. It supports supply voltages from 2.8V to 5.5V and has a peak reflow temperature of 260°C. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

$0.397

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 6,553 parts In-Stock

1+ parts

$0.950

100+ parts

$0.541

1k+ parts

$0.467

10k+ parts

$0.437

6,553

$0.950

$0.541

$0.467

$0.437

DigiKey

USA . 415 parts In-Stock

1+ parts

$0.980

100+ parts

$0.557

1k+ parts

$0.484

10k+ parts

$0.428

415

$0.980

$0.557

$0.484

$0.428

Arrow

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.378

5,000

-

-

-

$0.378

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$0.378

5,000

-

-

-

$0.378

Chip1Stop

Japan . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.397

5,000

-

-

-

$0.397

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

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450

$1.000

-

-

-

Digiode

USA . 2,595 parts In-Stock

1+ parts

$1.188

100+ parts

-

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2,595

$1.188

-

-

-

Chip Stock

USA . 33,412 parts In-Stock

1+ parts

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33,412

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Vyrian

USA . 3,849 parts In-Stock

1+ parts

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3,849

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,896 parts In-Stock

1+ parts

$0.332

100+ parts

$0.324

1k+ parts

$0.322

10k+ parts

-

3,896

$0.332

$0.324

$0.322

-

Ampacity Inc.

Singapore . 3,869 parts In-Stock

1+ parts

$0.332

100+ parts

-

1k+ parts

-

10k+ parts

-

3,869

$0.332

-

-

-

Corohmni

South Africa . 193 parts In-Stock

1+ parts

$0.391

100+ parts

-

1k+ parts

-

10k+ parts

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193

$0.391

-

-

-

Argo Parts USA

USA . 3,252 parts In-Stock

1+ parts

$0.503

100+ parts

-

1k+ parts

-

10k+ parts

$0.488

3,252

$0.503

-

-

$0.488

Continental Prestige Electronics

USA . 1,692 parts In-Stock

1+ parts

$0.503

100+ parts

-

1k+ parts

-

10k+ parts

$0.493

1,692

$0.503

-

-

$0.493

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$1.000

100+ parts

$0.950

1k+ parts

$0.902

10k+ parts

$0.890

10

$1.000

$0.950

$0.902

$0.890

Corphita

USA . 841 parts In-Stock

1+ parts

$1.125

100+ parts

-

1k+ parts

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-

841

$1.125

-

-

-

Microchip USA

USA . 1,350 parts In-Stock

1+ parts

$2.898

100+ parts

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1,350

$2.898

-

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iodParts Technologies Inc.

India . 50,000 parts In-Stock

1+ parts

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100+ parts

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50,000

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Kepictronics

USA . 28,400 parts In-Stock

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28,400

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Perfect Parts

USA . 11,200 parts In-Stock

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11,200

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SupplyDigital Components

Austria . 8,377 parts In-Stock

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8,377

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Kulean Microsystems

USA . 8,339 parts In-Stock

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8,339

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Problanco Electronics

Mexico . 2,465 parts In-Stock

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2,465

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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A-Z Elektronik GmbH

Germany . 1,563 parts In-Stock

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1,563

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TANS Electronics

Latvia . 1,536 parts In-Stock

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1,536

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Assy Fe

Spain . 1,117 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,042 parts In-Stock

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1,042

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Supply Digital

USA . 792 parts In-Stock

1+ parts

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792

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UHIMA Technologies

Türkiye . 376 parts In-Stock

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376

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Overview

Enhance your power management capabilities with the FUSB301TMX by Onsemi. Manufactured with precision and expertise, this Power Management IC offers reliability and efficiency like no other. Ideal for a wide range of applications, this product provides seamless integration and optimal performance. Experience the value and benefits it brings to your projects, from increased productivity to enhanced functionality. Trust in Onsemi's reputation for quality and innovation, and elevate your power management solutions with the FUSB301TMX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, which is ideal for portable or handheld devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing production costs and making the product suitable for automated manufacturing processes.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is a common standard in many electronic devices, ensuring compatibility with a wide range of systems.

No. of Terminals: 10

Having 10 terminals provides ample connection points for various power management functions, enabling versatile use in different applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding industrial environments with elevated heat levels.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function effectively in cold climates or refrigerated conditions.

Terminal Position: QUAD

The quad terminal position provides stable electrical connections and allows for efficient heat dissipation, enhancing overall performance and reliability.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges indicates the product's durability and reliability in harsh operating conditions, making it suitable for industrial applications.

Technical Specifications

Power Management ICs FUSB301TMX attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PQCC-N10

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.2 mm

Trade Compliance

FUSB301TMX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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