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LC709204FXE-01TBG

Onsemi

LC709204FXE-01TBG by Onsemi

LC709204FXE-01TBG by Onsemi is a Power Management IC with 12 terminals, operating b/w -40 to 85°C. It supports supply voltages from 2.5V to 5V and has a peak reflow temperature of 260°C. Ideal for industrial applications requiring power supply support circuits in compact form factors.

Median Price

$1.738

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$1.039

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$1.039

-

-

-

Mouser Electronics

USA . 1,315 parts In-Stock

1+ parts

$2.070

100+ parts

$1.490

1k+ parts

$1.110

10k+ parts

$1.010

1,315

$2.070

$1.490

$1.110

$1.010

Farnell

UK . 20,255 parts In-Stock

1+ parts

$2.860

100+ parts

$1.510

1k+ parts

$1.250

10k+ parts

$1.230

20,255

$2.860

$1.510

$1.250

$1.230

Element14

Singapore . 24,485 parts In-Stock

1+ parts

$4.690

100+ parts

$2.490

1k+ parts

$2.060

10k+ parts

$2.020

24,485

$4.690

$2.490

$2.060

$2.020

EBV Elektronik

Germany . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,000

-

-

-

-

Master Electronics

USA . 2,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.080

10k+ parts

$0.980

2,480

-

-

$1.080

$0.980

Verical

USA . 2,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.405

10k+ parts

$1.326

2,250

-

-

$1.405

$1.326

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,610 parts In-Stock

1+ parts

$0.987

100+ parts

-

1k+ parts

-

10k+ parts

-

1,610

$0.987

-

-

-

Nova Conductors

Japan . 25 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

25

$2.000

-

-

-

Cyclops Electronics Ltd

UK . 26,118 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,118

-

-

-

-

Bristol Electronics

USA . 18,043 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,043

-

-

-

-

IBS Electronics

USA . 2,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.515

10k+ parts

$1.374

2,480

-

-

$1.515

$1.374

Vyrian

USA . 1,928 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,928

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,233 parts In-Stock

1+ parts

$0.880

100+ parts

-

1k+ parts

-

10k+ parts

-

2,233

$0.880

-

-

-

Semicontronic

India . 1,905 parts In-Stock

1+ parts

$0.880

100+ parts

$0.858

1k+ parts

$0.854

10k+ parts

-

1,905

$0.880

$0.858

$0.854

-

Corphita

USA . 253 parts In-Stock

1+ parts

$0.935

100+ parts

-

1k+ parts

-

10k+ parts

-

253

$0.935

-

-

-

Corohmni

South Africa . 177 parts In-Stock

1+ parts

$1.039

100+ parts

-

1k+ parts

-

10k+ parts

-

177

$1.039

-

-

-

Argo Parts USA

USA . 2,090 parts In-Stock

1+ parts

$1.245

100+ parts

-

1k+ parts

-

10k+ parts

-

2,090

$1.245

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

$1.900

10k+ parts

$1.860

2,000

$2.000

-

$1.900

$1.860

Continental Prestige Electronics

USA . 25 parts In-Stock

1+ parts

$2.360

100+ parts

$1.430

1k+ parts

$0.972

10k+ parts

-

25

$2.360

$1.430

$0.972

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$10.735

100+ parts

$10.198

1k+ parts

$10.198

10k+ parts

-

500

$10.735

$10.198

$10.198

-

Aztec Data Supply Inc.

USA . 3,078 parts In-Stock

1+ parts

$15.410

100+ parts

-

1k+ parts

-

10k+ parts

-

3,078

$15.410

-

-

-

Microchip USA

USA . 14,959 parts In-Stock

1+ parts

$16.450

100+ parts

$16.340

1k+ parts

$16.290

10k+ parts

$16.240

14,959

$16.450

$16.340

$16.290

$16.240

Modulus Dynamics

Lithuania . 3,834 parts In-Stock

1+ parts

$23.707

100+ parts

$23.707

1k+ parts

$23.707

10k+ parts

-

3,834

$23.707

$23.707

$23.707

-

Component Connect

USA . 40,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40,050

-

-

-

-

Authorized Procurement Solutions

USA . 13,425 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,425

-

-

-

-

Lixinc

USA . 7,175 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,175

-

-

-

-

Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

SupplyDigital Components

Austria . 4,869 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,869

-

-

-

-

Speed Components Ltd (Excess)

Israel . 4,543 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,543

-

-

-

-

Problanco Electronics

Mexico . 3,784 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,784

-

-

-

-

Kulean Microsystems

USA . 2,523 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,523

-

-

-

-

UHIMA Technologies

Türkiye . 861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

861

-

-

-

-

TANS Electronics

Latvia . 331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

331

-

-

-

-

Robosynatics

Brazil . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

Lucentia Tech

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$3.486

1k+ parts

$3.486

10k+ parts

$3.486

300

-

$3.486

$3.486

$3.486

Overview

Unlock the full potential of your power management system with the LC709204FXE-01TBG by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality Power Management ICs that are designed to enhance efficiency and performance. This versatile IC is perfect for a wide range of applications, offering reliability and precision in every use. With its advanced technology and durable construction, the LC709204FXE-01TBG ensures seamless operation and long-lasting durability. Upgrade your power management system today and experience the difference with Onsemi's cutting-edge solutions.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and cost-effectiveness.

Surface Mount:

YES - Allows for easy and efficient PCB assembly.

Package Shape:

RECTANGULAR - Fits well into modern electronic designs.

Nominal Supply Voltage (Vsup):

4 V - Ideal for powering a wide range of devices.

No. of Terminals:

12 - Provides flexibility for various connections.

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH - Offers space-saving design for compact electronics.

Maximum Operating Temperature:

85 °C - Ensures stable performance under harsh conditions.

Minimum Operating Temperature:

40 °C - Suitable for use in extreme environments.

Terminal Finish:

TIN SILVER COPPER - Enhances conductivity and corrosion resistance.

Terminal Position:

BOTTOM - Facilitates easy PCB layout and routing.

Maximum Seated Height:

0.51 mm - Enables low-profile designs in applications with height constraints.

Width (mm):

1.48 mm - Accommodates space-constrained PCB layouts.

Other IC type:

POWER SUPPLY SUPPORT CIRCUIT - Provides additional features for efficient power management.

Minimum Supply Voltage (Vsup):

2.5 V - Allows for operation with lower input voltages.

Maximum Time At Peak Reflow Temperature (s):

30 - Offers ease of manufacturing during assembly process.

Peak Reflow Temperature °C:

260 - Ensures reliable soldering for robust connections.

Length:

1.91 mm - Fits well in compact electronic devices.

Temperature Grade:

INDUSTRIAL - Suitable for use in industrial applications with extended temperature ranges.

Terminal Form:

BALL - Facilitates easy and reliable solder connections.

Terminal Pitch:

0.4 mm - Allows for high-density PCB designs.

Maximum Supply Voltage (Vsup):

5 V - Supports a wide range of voltage requirements.

Technical Specifications

Power Management ICs LC709204FXE-01TBG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PBGA-B12

JESD-609 Code:

e1

Length:

1.91 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA12,3X4,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.51 mm

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.48 mm

Trade Compliance

LC709204FXE-01TBG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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