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LC709202FRD-02-PH

Onsemi

LC709202FRD-02-PH by Onsemi

LC709202FRD-02-PH by Onsemi is a Power Management IC with 2.5/4.5V power supplies, 16 terminals, and 0.026mA max supply current. It is used in industrial applications, operates b/w -40 to 85 °C, and features CMOS technology for efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 639 parts In-Stock

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Digiode

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SupplyDigital Components

Austria . 7,985 parts In-Stock

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Problanco Electronics

Mexico . 7,163 parts In-Stock

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TANS Electronics

Latvia . 2,611 parts In-Stock

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Kulean Microsystems

USA . 906 parts In-Stock

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UHIMA Technologies

Türkiye . 724 parts In-Stock

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Corphita

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Corohmni

South Africa . 129 parts In-Stock

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Overview

Enhance your power management capabilities with the LC709202FRD-02-PH by Onsemi. Known for their high-quality products, Onsemi delivers reliable and efficient solutions for a wide range of applications. This Power Management IC offers unparalleled value, providing customers with precise control over power supplies while ensuring optimal performance. Whether you're looking to improve battery life in portable devices or enhance power efficiency in industrial systems, the LC709202FRD-02-PH is the perfect choice. Trust Onsemi to deliver cutting-edge technology that meets your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 2.5/4.5

The dual power supply options provide flexibility in powering the device, allowing for compatibility with a wide range of systems.

No. of Terminals: 16

With a high number of terminals, the product can accommodate multiple connections and functions, enhancing its versatility and usability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in challenging environments or applications where heat may be a concern.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature means the product can operate effectively in cold conditions without the risk of malfunction or damage.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for various power management applications.

Technical Specifications

Power Management ICs LC709202FRD-02-PH attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.10SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2.5/4.5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.026 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC709202FRD-02-PH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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