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LC709203FXE-01MH

Onsemi

LC709203FXE-01MH by Onsemi

LC709203FXE-01MH by Onsemi is a Power Management IC with Vsup ranging from 2.5V to 4.5V, suitable for industrial applications. It features a rectangular package style with 9 terminals and operates b/w -40°C to 85°C. The IC supports power supply circuits and has a very thin profile, making it ideal for compact designs.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 254,800 parts In-Stock

1+ parts

$1.000

100+ parts

$0.980

1k+ parts

$0.960

10k+ parts

-

254,800

$1.000

$0.980

$0.960

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.881

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.881

-

-

-

Digiode

USA . 2,037 parts In-Stock

1+ parts

$0.950

100+ parts

-

1k+ parts

-

10k+ parts

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2,037

$0.950

-

-

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Global Solutions Electronics Company

USA . 18,646 parts In-Stock

1+ parts

-

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-

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18,646

-

-

-

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Inventory MP

USA . 10,000 parts In-Stock

1+ parts

-

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10,000

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Vyrian

USA . 4,850 parts In-Stock

1+ parts

-

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4,850

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-

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Flip Electronics

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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600

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 180 parts In-Stock

1+ parts

$0.846

100+ parts

-

1k+ parts

-

10k+ parts

-

180

$0.846

-

-

-

Semicontronic

India . 254,553 parts In-Stock

1+ parts

$0.850

100+ parts

$0.829

1k+ parts

$0.824

10k+ parts

-

254,553

$0.850

$0.829

$0.824

-

Ampacity Inc.

Singapore . 254,525 parts In-Stock

1+ parts

$0.850

100+ parts

-

1k+ parts

-

10k+ parts

-

254,525

$0.850

-

-

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Argo Parts USA

USA . 4,486 parts In-Stock

1+ parts

$0.881

100+ parts

-

1k+ parts

-

10k+ parts

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4,486

$0.881

-

-

-

Continental Prestige Electronics

USA . 2,876 parts In-Stock

1+ parts

$0.881

100+ parts

-

1k+ parts

-

10k+ parts

$0.863

2,876

$0.881

-

-

$0.863

Corphita

USA . 2,217 parts In-Stock

1+ parts

$0.900

100+ parts

-

1k+ parts

-

10k+ parts

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2,217

$0.900

-

-

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AZTECH Wire

Italy . 187 parts In-Stock

1+ parts

$13.330

100+ parts

-

1k+ parts

-

10k+ parts

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187

$13.330

-

-

-

Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$14.185

100+ parts

$13.476

1k+ parts

$13.476

10k+ parts

-

350

$14.185

$13.476

$13.476

-

Aztec Data Supply Inc.

USA . 2,855 parts In-Stock

1+ parts

$22.670

100+ parts

-

1k+ parts

-

10k+ parts

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2,855

$22.670

-

-

-

RC Electronics

USA . 98,149 parts In-Stock

1+ parts

-

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98,149

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-

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Perfect Parts

USA . 42,401 parts In-Stock

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42,401

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Kepictronics

USA . 35,000 parts In-Stock

1+ parts

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35,000

-

-

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Kulean Microsystems

USA . 7,763 parts In-Stock

1+ parts

-

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7,763

-

-

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Lixinc

USA . 5,743 parts In-Stock

1+ parts

-

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5,743

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-

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SupplyDigital Components

Austria . 5,722 parts In-Stock

1+ parts

-

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5,722

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TANS Electronics

Latvia . 5,664 parts In-Stock

1+ parts

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5,664

-

-

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A-Z Elektronik GmbH

Germany . 5,249 parts In-Stock

1+ parts

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100+ parts

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5,249

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Problanco Electronics

Mexico . 4,091 parts In-Stock

1+ parts

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4,091

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Alle Elektronik GmbH

Germany . 3,499 parts In-Stock

1+ parts

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3,499

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-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$0.863

1k+ parts

$0.837

10k+ parts

$0.819

2,000

-

$0.863

$0.837

$0.819

Robosynatics

Brazil . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

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Lucentia Tech

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.613

1k+ parts

$1.613

10k+ parts

$1.613

1,000

-

$1.613

$1.613

$1.613

UHIMA Technologies

Türkiye . 773 parts In-Stock

1+ parts

-

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773

-

-

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GreenTree Electronics

Israel . 554 parts In-Stock

1+ parts

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1k+ parts

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554

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-

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Microchip USA

USA . 166 parts In-Stock

1+ parts

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166

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Overview

Enhance your power management solutions with the LC709203FXE-01MH by Onsemi. Known for their high-quality manufacturing, Onsemi delivers top-notch Power Management ICs designed to optimize performance and efficiency. This versatile product is perfect for a wide range of applications, offering customers unmatched value and benefits. With a nominal supply voltage of 3.6V and a temperature grade of industrial, the LC709203FXE-01MH ensures reliable operation in any environment. Upgrade your power management system today with this cutting-edge technology from Onsemi.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount - YES

The surface mount feature allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage (Vsup) - 3.6 V

The nominal supply voltage of 3.6 V is within the typical operating range for many electronic devices, making this product compatible with a wide range of applications.

Minimum Operating Temperature -40 °C

The wide minimum operating temperature range of -40°C ensures the product can perform reliably in various environments, including extreme cold conditions.

Maximum Operating Temperature 85 °C

With a maximum operating temperature of 85°C, this product is suitable for industrial applications where temperature variations are common.

Technology - CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, making it an efficient choice for power management.

Technical Specifications

Power Management ICs LC709203FXE-01MH attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B9

JESD-609 Code:

e1

Length:

1.76 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA9,3X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/4.5

Qualification:

Not Qualified

Maximum Seated Height:

.51 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

LC709203FXE-01MH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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