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LC709202FRD-01-2H

Onsemi

LC709202FRD-01-2H by Onsemi

LC709202FRD-01-2H by Onsemi is a Power Management IC with 16 terminals, operating at temperatures from -40 to 85 °C. It offers power supplies of 2.5/4.5V and has a max supply current of 0.026mA. Ideal for industrial applications requiring power supply support circuits in a square chip carrier package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,924 parts In-Stock

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Digiode

USA . 1,111 parts In-Stock

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AZTECH Wire

Italy . 1,032 parts In-Stock

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$12.490

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Microchip USA

USA . 1,907 parts In-Stock

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$19.120

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SupplyDigital Components

Austria . 7,968 parts In-Stock

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TANS Electronics

Latvia . 4,740 parts In-Stock

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Problanco Electronics

Mexico . 4,014 parts In-Stock

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Kulean Microsystems

USA . 3,522 parts In-Stock

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Corphita

USA . 932 parts In-Stock

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UHIMA Technologies

Türkiye . 673 parts In-Stock

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Corohmni

South Africa . 282 parts In-Stock

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Overview

Discover the ultimate solution for your power management needs with the LC709202FRD-01-2H by Onsemi. Crafted with precision and expertise, this Power Management IC offers unmatched quality and reliability, ensuring optimal performance in a wide range of applications. From industrial settings to consumer electronics, this innovative product delivers exceptional value, efficiency, and convenience. Trust Onsemi to provide you with cutting-edge technology that exceeds expectations, making your power management tasks seamless and hassle-free. Elevate your projects with the LC709202FRD-01-2H and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to external elements, ensuring the reliability and longevity of the product.

Surface Mount: YES

The surface mount capability allows for easy and efficient integration of the IC into various electronic devices, making it convenient for assembly and manufacturing processes.

Power Supplies (V): 2.5/4.5

The IC supports a range of power supplies, providing flexibility in voltage requirements and compatibility with a variety of power sources.

No. of Terminals: 16

With 16 terminals, this IC offers a sufficient number of connection points for interfacing with other components and peripherals, enabling versatile system designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85 °C ensures reliable performance even in demanding industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature rating of -40 °C allows the IC to function effectively in cold temperature conditions without compromising its performance.

Technology: CMOS

The CMOS technology utilized in this IC offers low power consumption, high speed, and noise immunity, making it an efficient and reliable choice for power management applications.

Technical Specifications

Power Management ICs LC709202FRD-01-2H attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N16

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.10SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2.5/4.5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.026 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC709202FRD-01-2H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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