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LC709203FQH-04TWG

Onsemi

LC709203FQH-04TWG by Onsemi

LC709203FQH-04TWG by Onsemi is a Power Management IC with 3.6V nominal voltage, 2.5/4.5V power supplies, and -40 to 85°C operating temperature range. It comes in a small outline package and is ideal for industrial applications requiring power supply support circuits.

Median Price

$1.150

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,480 parts In-Stock

1+ parts

-

100+ parts

-

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$0.952

1,480

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$0.952

DigiKey

USA . 1,197 parts In-Stock

1+ parts

-

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$1.060

10k+ parts

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1,197

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$1.060

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Verical

USA . 697 parts In-Stock

1+ parts

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$1.550

10k+ parts

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697

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$1.550

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Rochester

USA . 182 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.030

10k+ parts

$0.918

182

-

$1.240

$1.030

$0.918

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 594 parts In-Stock

1+ parts

$0.969

100+ parts

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594

$0.969

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Chip Stock

USA . 27,892 parts In-Stock

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27,892

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DigiKey Marketplace

USA . 2,000 parts In-Stock

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2,000

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Sensible Micro Corp

USA . 1,791 parts In-Stock

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1,791

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K-1 Technologies

USA . 1,791 parts In-Stock

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1,791

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Vyrian

USA . 689 parts In-Stock

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689

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Corohmni

South Africa . 496 parts In-Stock

1+ parts

$0.666

100+ parts

-

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496

$0.666

-

-

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Semicontronic

India . 777 parts In-Stock

1+ parts

$0.810

100+ parts

$0.790

1k+ parts

$0.786

10k+ parts

-

777

$0.810

$0.790

$0.786

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Corphita

USA . 1,029 parts In-Stock

1+ parts

$0.918

100+ parts

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1,029

$0.918

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Ampacity Inc.

Singapore . 720 parts In-Stock

1+ parts

$1.760

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720

$1.760

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Aztec Data Supply Inc.

USA . 2,969 parts In-Stock

1+ parts

$12.600

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2,969

$12.600

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RC Electronics

USA . 30,606 parts In-Stock

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30,606

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Perfect Parts

USA . 20,160 parts In-Stock

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SupplyDigital Components

Austria . 7,653 parts In-Stock

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7,653

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Argo Parts USA

USA . 3,933 parts In-Stock

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3,933

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Lixinc

USA . 3,630 parts In-Stock

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3,630

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Continental Prestige Electronics

USA . 2,000 parts In-Stock

1+ parts

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$0.753

10k+ parts

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2,000

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-

$0.753

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Kepictronics

USA . 1,880 parts In-Stock

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1,880

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Problanco Electronics

Mexico . 1,508 parts In-Stock

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1,508

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UHIMA Technologies

Türkiye . 604 parts In-Stock

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604

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Microchip USA

USA . 268 parts In-Stock

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268

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TANS Electronics

Latvia . 267 parts In-Stock

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267

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Kulean Microsystems

USA . 257 parts In-Stock

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257

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Overview

Experience the power of efficient and reliable performance with the LC709203FQH-04TWG by Onsemi. As a leading manufacturer in Power Management ICs, Onsemi ensures top-notch quality and cutting-edge technology in every product. This compact and versatile device offers a wide range of applications, making it perfect for various power supply support circuits. With its durable construction and advanced features, this Power Management IC provides unmatched value, benefits, and advantages to customers seeking superior performance in their electronic devices. Trust Onsemi to deliver excellence in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost.

Nominal Supply Voltage (Vsup): 3.6 V

Optimal voltage for efficient power management and performance.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in high temperature environments.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where ruggedness and reliability are crucial.

Technology: CMOS

Utilizes low power consumption CMOS technology for energy efficiency.

Technical Specifications

Power Management ICs LC709203FQH-04TWG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.16,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/4.5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

LC709203FQH-04TWG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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