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LC709203FQH-03TWG

Onsemi

LC709203FQH-03TWG by Onsemi

LC709203FQH-03TWG by Onsemi is a Power Management IC with Vsup ranging from 2.5V to 4.5V, operating temperature of -40°C to 85°C, and CMOS technology. It has a small outline package style with 8 terminals for power supply support circuits in industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,744 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Digiode

USA . 75 parts In-Stock

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Ampacity Inc.

Singapore . 620 parts In-Stock

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$2.500

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Semicontronic

India . 616 parts In-Stock

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$2.500

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$2.438

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$2.425

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616

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AZTECH Wire

Italy . 546 parts In-Stock

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$5.179

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Aztec Data Supply Inc.

USA . 1,968 parts In-Stock

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$5.523

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$7.330

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$6.670

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$6.011

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$7.330

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$6.011

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TANS Electronics

Latvia . 7,967 parts In-Stock

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SupplyDigital Components

Austria . 5,003 parts In-Stock

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Continental Prestige Electronics

USA . 4,683 parts In-Stock

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Problanco Electronics

Mexico . 3,518 parts In-Stock

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Argo Parts USA

USA . 3,326 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 588 parts In-Stock

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Kulean Microsystems

USA . 546 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 424 parts In-Stock

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Aranea Global

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Overview

Enhance your power management capabilities with the LC709203FQH-03TWG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Management ICs that provide efficient solutions for various applications. The LC709203FQH-03TWG offers reliability, performance, and versatility, making it the perfect choice for your power supply support circuit needs. With its compact design and wide temperature range, this IC ensures optimal functionality in any industrial setting. Trust Onsemi to deliver innovative technology that meets your demands and exceeds your expectations. Elevate your power management systems with the LC709203FQH-03TWG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer product lifespan.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 3.6 V

This specific supply voltage is commonly used in many applications, making this power management IC compatible with a wide range of devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that this power management IC can perform reliably even in hot environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this power management IC energy-efficient and reliable.

Technical Specifications

Power Management ICs LC709203FQH-03TWG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-N8

Length:

4 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

LC709203FQH-03TWG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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