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LC709203FQH-01TWG

Onsemi

LC709203FQH-01TWG by Onsemi

LC709203FQH-01TWG by Onsemi is a Power Management IC with 3.6V nominal voltage, 2.5/4.5V power supplies, and -40 to 85°C operating temperature range. It comes in a small outline package suitable for industrial applications requiring power supply support circuits.

Median Price

$0.917

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 10,000 parts In-Stock

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$0.917

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$0.917

Distributors (In-Stock)

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Nova Conductors

Japan . 650 parts In-Stock

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$0.784

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650

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Cyclops Electronics Ltd

UK . 43,000 parts In-Stock

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Chip Stock

USA . 23,500 parts In-Stock

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Vyrian

USA . 8,924 parts In-Stock

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Bristol Electronics

USA . 1,839 parts In-Stock

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Digiode

USA . 640 parts In-Stock

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AGACORP

USA . 55 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 287 parts In-Stock

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$0.769

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287

$0.769

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Continental Prestige Electronics

USA . 6,968 parts In-Stock

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$0.784

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$0.769

6,968

$0.784

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$0.769

Argo Parts USA

USA . 2,118 parts In-Stock

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$0.784

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Netroflash

USA . 2,000 parts In-Stock

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$0.784

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$0.784

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Modulus Dynamics

Lithuania . 870 parts In-Stock

1+ parts

$0.865

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$0.856

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$0.830

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870

$0.865

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$0.830

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Semicontronic

India . 869 parts In-Stock

1+ parts

$1.500

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$1.462

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$1.455

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869

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 833 parts In-Stock

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$5.500

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833

$5.500

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Aztec Data Supply Inc.

USA . 1,073 parts In-Stock

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$17.310

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AZTECH Wire

Italy . 812 parts In-Stock

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$18.895

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$24.145

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$22.938

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$22.938

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$22.938

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RC Electronics

USA . 68,708 parts In-Stock

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Perfect Parts

USA . 37,593 parts In-Stock

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TANS Electronics

Latvia . 4,331 parts In-Stock

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Futuretech Components

Singapore . 4,000 parts In-Stock

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Problanco Electronics

Mexico . 3,371 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

Germany . 2,141 parts In-Stock

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SupplyDigital Components

Austria . 2,055 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,427 parts In-Stock

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Corphita

USA . 533 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Kulean Microsystems

USA . 383 parts In-Stock

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Microchip USA

USA . 277 parts In-Stock

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UHIMA Technologies

Türkiye . 51 parts In-Stock

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Robosynatics

Brazil . 46 parts In-Stock

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Lucentia Tech

USA . 46 parts In-Stock

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$22.246

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$21.792

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$21.792

46

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$21.792

$21.792

Overview

Enhance your power management capabilities with the LC709203FQH-01TWG by Onsemi. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides seamless power supply support with maximum efficiency. With its compact design and advanced technology, customers can enjoy optimal performance and enhanced functionality. Experience the benefits of superior power management solutions with Onsemi's LC709203FQH-01TWG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good insulation and protection for the internal components.

Surface Mount: YES

Being surface mountable makes installation easier and simpler, especially in compact electronic devices.

Nominal Supply Voltage (Vsup): 3.6 V

The nominal supply voltage of 3.6 V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows the product to function reliably even in harsh environmental conditions.

Technology: CMOS

The use of CMOS technology ensures low power consumption and efficient operation of the power management IC.

Technical Specifications

Power Management ICs LC709203FQH-01TWG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.16,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/4.5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

LC709203FQH-01TWG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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