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LC709202FRD-02-MH

Onsemi

LC709202FRD-02-MH by Onsemi

LC709202FRD-02-MH by Onsemi is a Power Management IC with 2.5/4.5V power supplies, 16 terminals, and 0.026mA max supply current. It is used in industrial applications for power supply support circuits due to its CMOS technology and wide operating temperature range of -40 to 85 °C.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,392 parts In-Stock

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Digiode

USA . 1,288 parts In-Stock

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Microchip USA

USA . 3,360 parts In-Stock

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$13.746

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AZTECH Wire

Italy . 882 parts In-Stock

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$21.500

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Advanced Electronics

New Zealand . 750 parts In-Stock

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$24.385

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$22.190

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$19.996

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750

$24.385

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$19.996

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SupplyDigital Components

Austria . 3,835 parts In-Stock

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Kulean Microsystems

USA . 2,576 parts In-Stock

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TANS Electronics

Latvia . 2,510 parts In-Stock

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Corphita

USA . 1,164 parts In-Stock

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Problanco Electronics

Mexico . 969 parts In-Stock

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UHIMA Technologies

Türkiye . 477 parts In-Stock

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Corohmni

South Africa . 70 parts In-Stock

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Overview

Unlock the power of efficient energy management with the LC709202FRD-02-MH by Onsemi. Crafted with precision and reliability in mind, this Power Management IC offers unrivaled performance for a variety of applications. From industrial settings to consumer electronics, this chip carrier package integrates seamlessly while providing a wide range of operating temperatures. Trust Onsemi's expertise in Power Management ICs to deliver cutting-edge technology that maximizes efficiency and minimizes power consumption. Upgrade your systems with the LC709202FRD-02-MH and experience the quality and value that Onsemi is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the components inside, ensuring a longer lifespan for the power management IC.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation onto a PCB, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape is space-efficient and can easily fit into compact designs, making it ideal for applications where space is limited.

Power Supplies (V): 2.5/4.5

The ability to handle multiple power supply voltages of 2.5V and 4.5V makes this power management IC versatile and suitable for a variety of applications.

No. of Terminals: 16

With 16 terminals, this power management IC offers a high level of connectivity options, allowing for versatile configurations and connections within a system.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures the power management IC can operate reliably in high temperature environments, increasing its overall durability and performance.

Technology: CMOS

Using CMOS technology allows for low power consumption and high noise immunity, making the power management IC energy-efficient and reliable in various operating conditions.

Technical Specifications

Power Management ICs LC709202FRD-02-MH attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N16

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.10SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2.5/4.5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.026 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC709202FRD-02-MH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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