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LC709203FXE-05MH

Onsemi

LC709203FXE-05MH by Onsemi

LC709203FXE-05MH by Onsemi is a Power Management IC with 9 terminals, operating b/w -40 to 85°C. It has a nominal voltage of 3.6V and supports power supply circuits. The package style is grid array, very thin profile, fine pitch, making it suitable for industrial applications.

Median Price

$0.568

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 800 parts In-Stock

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$0.568

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$0.568

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DigiKey

USA . 5,000 parts In-Stock

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$0.630

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Flip Electronics (Authorized)

USA . 5,000 parts In-Stock

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Verical

USA . 800 parts In-Stock

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$0.568

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800

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$0.568

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Digiode

USA . 1,247 parts In-Stock

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$0.708

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$0.708

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Nova Conductors

Japan . 870 parts In-Stock

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$1.117

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870

$1.117

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Flip Electronics

USA . 5,000 parts In-Stock

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Vyrian

USA . 2,768 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 2,761 parts In-Stock

1+ parts

$0.540

100+ parts

$0.526

1k+ parts

$0.524

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2,761

$0.540

$0.526

$0.524

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Corohmni

South Africa . 132 parts In-Stock

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$0.630

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132

$0.630

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Corphita

USA . 1,289 parts In-Stock

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$0.670

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Continental Prestige Electronics

USA . 3,652 parts In-Stock

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$1.117

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$1.094

3,652

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$1.094

Argo Parts USA

USA . 685 parts In-Stock

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$1.117

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Ampacity Inc.

Singapore . 2,591 parts In-Stock

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$1.170

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Aztec Data Supply Inc.

USA . 4,452 parts In-Stock

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$16.570

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Kepictronics

USA . 5,450 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 4,950 parts In-Stock

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Problanco Electronics

Mexico . 3,832 parts In-Stock

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SupplyDigital Components

Austria . 3,665 parts In-Stock

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TANS Electronics

Latvia . 3,474 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$1.094

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$1.061

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$1.039

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$1.061

$1.039

UHIMA Technologies

Türkiye . 439 parts In-Stock

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Microchip USA

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Kulean Microsystems

USA . 105 parts In-Stock

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Overview

Unleash the power of your devices with the LC709203FXE-05MH by Onsemi. As a leading manufacturer in Power Management ICs, Onsemi delivers unparalleled quality and reliability. This innovative product is designed to optimize performance and efficiency, ensuring seamless operation for a wide range of applications. From smartphones to IoT devices, the LC709203FXE-05MH provides exceptional value, benefits, and advantages that will exceed your expectations. Upgrade your technology today with Onsemi's cutting-edge solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this power management IC lightweight and durable.

Surface Mount: YES

The surface mount capability of this IC makes it easy to integrate into compact electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on a circuit board.

Nominal Supply Voltage (Vsup): 3.6 V

With a nominal supply voltage of 3.6V, this IC is suitable for a wide range of applications.

No. of Terminals: 9

The nine terminals provide ample connectivity options for various power management functions.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch allows for high-density mounting on a PCB.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand elevated temperature conditions.

Minimum Operating Temperature: -40 °C

The IC's ability to operate at temperatures as low as -40°C makes it suitable for use in diverse environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

The bottom terminal position simplifies the assembly process and enhances stability on the PCB.

Maximum Seated Height: 0.51 mm

With a maximum seated height of 0.51 mm, this IC is ultra-thin and ideal for slim devices.

Width (mm): 1.6 mm

The 1.6mm width of this IC allows for compact integration in tight spaces.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC ensures steady and reliable power delivery to connected components.

Minimum Supply Voltage (Vsup): 2.5 V

The minimum supply voltage requirement of 2.5V enables flexibility in power input options.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this IC is easy to solder onto a PCB.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and joint reliability.

Length: 1.76 mm

The 1.76mm length of this IC allows for efficient use of space on a PCB.

Temperature Grade: INDUSTRIAL

This IC is designed for industrial-grade applications that require robust performance in harsh conditions.

Maximum Supply Current (Isup): 0.0045 mA

With a maximum supply current of 0.0045mA, this IC consumes minimal power during operation.

Terminal Form: BALL

The ball terminal form provides secure connections and facilitates ease of soldering.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for precise mounting and connectivity on a PCB.

Maximum Supply Voltage (Vsup): 4.5 V

The maximum supply voltage of 4.5V ensures compatibility with a wide range of power sources.

Technical Specifications

Power Management ICs LC709203FXE-05MH attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PBGA-B9

JESD-609 Code:

e1

Length:

1.76 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA9,3X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.51 mm

Maximum Supply Current (Isup):

.0045 mA

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

LC709203FXE-05MH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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