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LC709202FRD-01-SH

Onsemi

LC709202FRD-01-SH by Onsemi

LC709202FRD-01-SH by Onsemi is a Power Management IC with 2.5/4.5V power supplies, 16 terminals, and 0.026mA max supply current. It is used in industrial applications, operates b/w -40 to 85 °C, and features CMOS technology for efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,221 parts In-Stock

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Digiode

USA . 1,463 parts In-Stock

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SupplyDigital Components

Austria . 8,363 parts In-Stock

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TANS Electronics

Latvia . 7,527 parts In-Stock

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Problanco Electronics

Mexico . 5,576 parts In-Stock

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Kulean Microsystems

USA . 4,311 parts In-Stock

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Corphita

USA . 1,458 parts In-Stock

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UHIMA Technologies

Türkiye . 496 parts In-Stock

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496

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Corohmni

South Africa . 453 parts In-Stock

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Overview

Revolutionize your power management solutions with the LC709202FRD-01-SH by Onsemi. This cutting-edge Power Management IC boasts top-notch quality and reliability from a trusted manufacturer, ensuring superior performance in a variety of applications. With a package style of chip carrier and a wide operating temperature range, this product offers unmatched value and benefits to customers seeking efficient and advanced power management solutions. Say goodbye to outdated technology and embrace the advantages of the LC709202FRD-01-SH today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easy installation on PCBs, saving space and facilitating automated assembly.

Package Shape: SQUARE

The square package shape is compact and efficient, maximizing space on the PCB for other components.

Power Supplies (V): 2.5/4.5

Support for multiple power supply voltages allows flexibility in design and compatibility with different systems.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options, enabling versatile integration into various circuit designs.

Package Style (Meter): CHIP CARRIER

The chip carrier style is known for its reliability and thermal performance, ensuring stable operation even in demanding conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand elevated environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the product to function reliably in both extreme cold and hot environments.

Terminal Position: QUAD

The quad terminal position simplifies connection to external components and enhances signal integrity.

Temperature Grade: INDUSTRIAL

Designed for industrial use, the product meets stringent temperature and performance requirements, ensuring long-term reliability.

Maximum Supply Current (Isup): 0.026 mA

The low maximum supply current minimizes power consumption, making the product energy-efficient.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

Terminal Form: NO LEAD

The no lead terminal form eliminates the risk of lead contamination and makes the product environmentally friendly.

Terminal Pitch: 0.5 mm

The small terminal pitch provides high density and allows for compact PCB layout, saving valuable space in the design.

Technical Specifications

Power Management ICs LC709202FRD-01-SH attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.10SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2.5/4.5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.026 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC709202FRD-01-SH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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