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BTS4140NNT

Infineon Technologies

BTS4140NNT by Infineon Technologies

BTS4140NNT by Infineon Technologies is a Power Management IC with AEC-Q100 screening. It operates b/w -40 to 150°C, supports supply voltage from 4.9V to 60V, and has a small outline package suitable for power supply circuits in automotive applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,306 parts In-Stock

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Digiode

USA . 552 parts In-Stock

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552

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Nova Conductors

Japan . 83 parts In-Stock

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VNN

France . 30 parts In-Stock

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Ampacity Inc.

Singapore . 691 parts In-Stock

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$0.500

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691

$0.500

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Modulus Dynamics

Lithuania . 2,774 parts In-Stock

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$4.055

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$3.893

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$3.731

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2,774

$4.055

$3.893

$3.731

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$4.802

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$4.562

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$4.562

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$4.802

$4.562

$4.562

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Semicontronic

India . 653 parts In-Stock

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$6.500

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$6.338

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$6.305

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653

$6.500

$6.338

$6.305

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AZTECH Wire

Italy . 661 parts In-Stock

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$17.553

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Aztec Data Supply Inc.

USA . 2,070 parts In-Stock

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$19.230

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Corohmni

South Africa . 235 parts In-Stock

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Argo Parts USA

USA . 4,747 parts In-Stock

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Robosynatics

Brazil . 1,223 parts In-Stock

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Lucentia Tech

USA . 1,223 parts In-Stock

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$0.844

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$0.844

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$0.844

1,223

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$0.844

Continental Prestige Electronics

USA . 349 parts In-Stock

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Microchip USA

USA . 296 parts In-Stock

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Corphita

USA . 149 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Enhance your power management capabilities with the BTS4140NNT by Infineon Technologies. Manufactured with precision and reliability, this Power Management IC offers unparalleled performance in a compact design. Perfect for a wide range of applications, this product provides customers with exceptional value and benefits. Trust in the quality of Infineon Technologies and experience the advantages of seamless power supply support with the BTS4140NNT. Elevate your power management solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package provides good protection for the internal components of the IC, ensuring durability and reliability.

Surface Mount: YES

Surface mount capability makes it easy to integrate this IC onto PCBs, saving space and simplifying the manufacturing process.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the IC meets automotive industry standards for reliability and performance, making it suitable for automotive applications.

Nominal Supply Voltage (Vsup): 6 V

6V supply voltage allows this IC to operate effectively within a common voltage range, making it compatible with a wide variety of power management systems.

No. of Terminals: 4

Having only 4 terminals simplifies the installation process and reduces the likelihood of wiring errors, contributing to system efficiency.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures that the IC can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows this IC to function reliably even in extremely cold environments, increasing its versatility.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and helps optimize signal routing, enhancing overall system performance.

Width (mm): 3.5 mm

Compact 3.5mm width allows for space-efficient PCB design, making this IC suitable for applications where size constraints are a concern.

Minimum Supply Voltage (Vsup): 4.9 V

Low minimum supply voltage ensures that the IC remains operational even when power supply levels are slightly lower, improving system robustness.

Length: 6.5 mm

With a length of only 6.5mm, this IC offers a compact footprint, making it ideal for applications where board space is limited.

Terminal Form: GULL WING

Gull wing terminal form simplifies the soldering process and enhances mechanical strength, ensuring secure connections for reliable performance.

Maximum Supply Voltage (Vsup): 60 V

High maximum supply voltage capability allows this IC to handle a wide range of input voltages, making it versatile for various power management applications.

Technical Specifications

Power Management ICs BTS4140NNT attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Additional Features:

ESD Value for IN pin is 1C

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

Length:

6.5 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.8 mm

Maximum Supply Voltage (Vsup):

60 V

Minimum Supply Voltage (Vsup):

4.9 V

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Width (mm):

3.5 mm

Trade Compliance

BTS4140NNT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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