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MAX809STRGH

Onsemi

MAX809STRGH by Onsemi

MAX809STRGH by Onsemi is a Power Management IC with 3.3V Nominal Voltage, suitable for industrial applications. It features a small outline package style, Gull Wing terminal form, and can operate in temperatures ranging from -40 to 105°C. This IC supports power supply circuits and is designed for surface mount installation.

Median Price

$22.433

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 50 parts In-Stock

1+ parts

$22.433

100+ parts

$21.312

1k+ parts

$21.312

10k+ parts

-

50

$22.433

$21.312

$21.312

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Distributors (In-Stock)

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Digiode

USA . 755 parts In-Stock

1+ parts

$21.311

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755

$21.311

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Vyrian

USA . 3,840 parts In-Stock

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3,840

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Distributors (Availability)

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AZTECH Wire

Italy . 779 parts In-Stock

1+ parts

$9.982

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-

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779

$9.982

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Aztec Data Supply Inc.

USA . 2,148 parts In-Stock

1+ parts

$16.586

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$16.586

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Ampacity Inc.

Singapore . 50 parts In-Stock

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$19.070

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50

$19.070

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Semicontronic

India . 50 parts In-Stock

1+ parts

$19.070

100+ parts

$18.593

1k+ parts

$18.498

10k+ parts

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50

$19.070

$18.593

$18.498

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Corphita

USA . 1,612 parts In-Stock

1+ parts

$20.190

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1,612

$20.190

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Corohmni

South Africa . 420 parts In-Stock

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$22.433

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420

$22.433

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$22.433

100+ parts

$21.312

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$21.312

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50

$22.433

$21.312

$21.312

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SupplyDigital Components

Austria . 7,743 parts In-Stock

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7,743

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TANS Electronics

Latvia . 6,846 parts In-Stock

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Problanco Electronics

Mexico . 6,820 parts In-Stock

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Kulean Microsystems

USA . 5,923 parts In-Stock

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Argo Parts USA

USA . 4,512 parts In-Stock

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Continental Prestige Electronics

USA . 3,670 parts In-Stock

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3,670

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UHIMA Technologies

Türkiye . 771 parts In-Stock

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771

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Elevate your power management game with the MAX809STRGH by Onsemi. Crafted with precision and expertise, this Power Management IC offers unparalleled reliability and performance. Perfect for a wide range of applications, this small outline rectangular package delivers a nominal supply voltage of 3.3V with industrial-grade temperature resistance. With a dual terminal position and gull wing form, this IC ensures seamless integration into your design. Trust Onsemi to provide high-quality solutions that bring value and peace of mind to your projects. Upgrade to the MAX809STRGH today and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components as it offers durability and thermal resistance, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and reducing manufacturing costs.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is commonly used in many electronic devices, ensuring compatibility with a wide range of applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in conserving PCB space, making it suitable for compact electronic devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures the product can withstand demanding operating conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably in extreme cold environments.

Nominal Threshold Voltage (V): +2.93V

The precise nominal threshold voltage ensures accurate voltage regulation, critical for the proper functioning of power management circuits.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges, this product is suitable for use in harsh industrial environments where temperature variations are common.

Technical Specifications

Power Management ICs MAX809STRGH attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

THRESHOLD VOLTAGE= 2.93 V; OTHER SUPPLY VOLTAGE= 1V TO 5.5V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.11 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.3 mm

Trade Compliance

MAX809STRGH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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