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MAX811TEUS-T

Onsemi

MAX811TEUS-T by Onsemi

MAX811TEUS-T by Onsemi is a Power Management IC with 3.3V nominal voltage, 4 terminals, and CMOS technology. It is used in power supply support circuits for industrial applications, operating b/w -40 to 85°C with a max seated height of 1.14mm.

Median Price

$3.430

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 4,386 parts In-Stock

1+ parts

$5.250

100+ parts

$3.346

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$3.198

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$5.250

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Rochester

USA . 44,537 parts In-Stock

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$1.610

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$1.440

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$1.350

44,537

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$1.440

$1.350

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Freelance Electronics

USA . 4,407 parts In-Stock

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$0.760

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$0.798

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$0.752

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4,407

$0.760

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Digiode

USA . 2,264 parts In-Stock

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$1.710

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Nova Conductors

Japan . 69 parts In-Stock

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$2.360

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Component Electronics Inc.

Canada . 31 parts In-Stock

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$3.080

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DigiKey Marketplace

USA . 44,637 parts In-Stock

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Vyrian

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Chip Stock

USA . 40,400 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 6,714 parts In-Stock

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Quantum Digital Technology

USA . 2,752 parts In-Stock

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EPE Components Inc.

USA . 2,256 parts In-Stock

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Inventory MP

USA . 2,173 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 2,120 parts In-Stock

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PC Components Company LLC

USA . 2,038 parts In-Stock

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Legend Electronics Inc.

USA . 1,717 parts In-Stock

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Dan-Mar Components

USA . 1,667 parts In-Stock

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GES GmbH

Germany . 1,525 parts In-Stock

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Anansix

USA . 1,366 parts In-Stock

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Bristol Electronics

USA . 1,204 parts In-Stock

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Prism Electronics

USA . 957 parts In-Stock

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ComSIT Distribution GmbH

Germany . 606 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 325 parts In-Stock

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Atlantic Semiconductor

USA . 307 parts In-Stock

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Pegasus Components GmbH

Germany . 66 parts In-Stock

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Beltway Electronics Company

USA . 50 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 22 parts In-Stock

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Speed Components Ltd

Israel . 22 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 88,676 parts In-Stock

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$1.530

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$1.492

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$1.484

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$1.484

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Ampacity Inc.

Singapore . 44,320 parts In-Stock

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$1.530

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Corphita

USA . 3,633 parts In-Stock

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$1.620

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Vigor

Singapore . 46,543 parts In-Stock

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$1.730

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Argo Parts USA

USA . 2,670 parts In-Stock

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$2.360

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Netroflash

USA . 2,000 parts In-Stock

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$2.360

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Continental Prestige Electronics

USA . 1,133 parts In-Stock

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$2.360

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$2.313

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Corohmni

South Africa . 273 parts In-Stock

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$2.914

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273

$2.914

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Advanced Electronics

New Zealand . 336 parts In-Stock

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$15.051

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$14.900

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$14.298

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336

$15.051

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$14.298

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MARBEL Systems

Belgium . 3,691 parts In-Stock

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$17.063

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3,691

$17.063

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Texas Native Microelectronics

USA . 120 parts In-Stock

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$19.613

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$18.240

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$17.259

120

$19.613

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$17.259

Kenton Components

USA . 368 parts In-Stock

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$23.536

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$20.711

368

$23.536

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Qasali Group International

UK . 10 parts In-Stock

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$52.955

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10

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Perfect Parts

USA . 19,645 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,385 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Microchip USA

USA . 9,233 parts In-Stock

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Kulean Microsystems

USA . 7,340 parts In-Stock

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

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GreenTree Electronics

Israel . 2,948 parts In-Stock

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Assy Fe

Spain . 2,746 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,550 parts In-Stock

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Problanco Electronics

Mexico . 2,130 parts In-Stock

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TANS Electronics

Latvia . 781 parts In-Stock

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UHIMA Technologies

Türkiye . 628 parts In-Stock

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SupplyDigital Components

Austria . 502 parts In-Stock

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502

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Overview

Discover the MAX811TEUS-T by Onsemi, the ultimate solution for your power management needs. With a reputation for top-quality products, Onsemi delivers exceptional performance and reliability in every Power Management IC they manufacture. Ideal for a wide range of applications, this small outline, thin profile package offers customers the perfect balance of efficiency and durability. Trust Onsemi to provide you with the best-in-class power supply support circuit technology, ensuring your devices operate at their fullest potential. Don't settle for less when you can have the MAX811TEUS-T from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

With a surface mount feature, this IC can be easily integrated onto PCBs, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on a circuit board, optimizing space utilization.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage ensures compatibility with a wide range of electronic applications operating within this voltage range.

Power Supplies (V): 3.3

This product is designed to efficiently manage power supplies operating at 3.3V, ensuring consistent and reliable power delivery.

No. of Terminals: 4

With 4 terminals, this IC offers flexibility in connecting to external components, enabling customization for specific system requirements.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile package style minimizes board space usage and allows for compact electronic designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the reliability and stability of the IC in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for use in extreme cold environments without performance degradation.

Terminal Finish: TIN LEAD

The tin lead terminal finish enhances solderability, ensuring secure and reliable connections during assembly.

Terminal Position: DUAL

The dual terminal position provides increased flexibility in circuit board layout, enabling efficient routing of connections.

Maximum Seated Height: 1.14 mm

The low maximum seated height allows for a compact overall design, ideal for slim electronic devices.

Width (mm): 1.3 mm

The small width of 1.3mm contributes to the IC's compact form factor, fitting seamlessly into space-constrained applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC is specifically designed as a power supply support circuit, ensuring efficient and stable power management in electronic systems.

Minimum Supply Voltage (Vsup): 1.2 V

The 1.2V minimum supply voltage enables operation in low-power settings, conserving energy and prolonging battery life.

Length: 2.92 mm

The compact length of 2.92mm further contributes to the small footprint of the IC, perfect for miniaturized electronic devices.

Nominal Threshold Voltage (V): +3.08V

The nominal threshold voltage of +3.08V ensures accurate and reliable performance in voltage regulation applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions commonly found in industrial settings.

Maximum Supply Current (Isup): 0.015 mA

The low maximum supply current of 0.015mA helps minimize power consumption, making this IC energy-efficient.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this IC suitable for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering, ensuring robust connections during assembly.

Terminal Pitch: 1.9 mm

The terminal pitch of 1.9mm facilitates easy soldering and connection to external components, simplifying the manufacturing process.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V ensures compatibility with a wide range of electronic systems requiring higher voltage levels.

Technical Specifications

Power Management ICs MAX811TEUS-T attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Length:

2.92 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-253LOW

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.14 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.015 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.9 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.08V

Width (mm):

1.3 mm

Trade Compliance

MAX811TEUS-T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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