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MAX809LEUR+T10

Analog Devices

MAX809LEUR+T10 by Analog Devices

Analog Devices' MAX809LEUR+T10 is a Power Management IC with 5V nominal voltage. It features a small outline, thin profile package and operates in industrial temperature range (-40 to 105°C). Ideal for power supply support circuits, it has dual terminals and low supply current of 0.06mA.

Median Price

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4

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1k+

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Digiode

USA . 1,812 parts In-Stock

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Anansix

USA . 1,548 parts In-Stock

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Vyrian

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Nova Conductors

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Aztec Data Supply Inc.

USA . 4,930 parts In-Stock

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$2.145

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$2.145

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Semicontronic

India . 494 parts In-Stock

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$5.500

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$5.362

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$5.335

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One Stop Electronics

USA . 648 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 578 parts In-Stock

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$7.494

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$7.741

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$7.354

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$7.741

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$7.354

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Corohmni

South Africa . 288 parts In-Stock

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$8.654

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MARBEL Systems

Belgium . 2,485 parts In-Stock

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$12.882

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Texas Native Microelectronics

USA . 824 parts In-Stock

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$14.807

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$14.215

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$13.771

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$13.030

824

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$13.030

Kenton Components

USA . 436 parts In-Stock

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$17.768

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$15.636

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Qasali Group International

UK . 793 parts In-Stock

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$39.979

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Component Stockers USA

USA . 310 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

USA . 17,949 parts In-Stock

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Microchip USA

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Corphita

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Vigor

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Argo Parts USA

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Continental Prestige Electronics

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Unlock the power of reliable and efficient power management with the MAX809LEUR+T10 by Analog Devices. Crafted from high-quality materials and boasting cutting-edge technology, this small outline, thin profile IC is designed to provide seamless support for your power supply circuits. From industrial applications to everyday electronics, this product ensures optimal performance and stability, making it a valuable asset for customers looking for top-notch power management solutions. Trust Analog Devices to deliver excellence in every component they manufacture, and elevate your projects with the MAX809LEUR+T10 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easily integrated into existing designs, making it a versatile choice.

Nominal Supply Voltage (Vsup): 5 V

With a 5V nominal supply voltage, this power management IC is compatible with a wide range of devices and systems.

Power Supplies (V): 5

The availability of 5 power supplies ensures stable and reliable operation, making this product suitable for demanding applications.

No. of Terminals: 3

Having 3 terminals simplifies the connection process and reduces the risk of errors during installation.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space on the circuit board, ideal for compact designs.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this IC can withstand tough environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance in cold environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and reliability, ensuring secure connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit design and offers redundancy for added reliability.

Maximum Seated Height: 1.12 mm

The low maximum seated height facilitates compact designs and allows for efficient use of space on the circuit board.

Width (mm): 1.3 mm

With a width of 1.3mm, this IC is suitable for applications where space is limited.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC type offers comprehensive power supply support, making it a versatile choice for various electronic devices.

Minimum Supply Voltage (Vsup): 1.2 V

The low minimum supply voltage of 1.2V allows for operation in low-power applications, increasing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds minimizes the risk of thermal damage during soldering.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable solder joints and durability.

Length: 2.92 mm

The length of 2.92mm is suitable for various applications, providing flexibility in design and layout.

Nominal Threshold Voltage (V): +4.63V

The nominal threshold voltage of +4.63V ensures stable and precise operation, contributing to the reliability of the product.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this temperature grade ensures the IC can withstand harsh operating conditions.

Maximum Supply Current (Isup): 0.06 mA

With a maximum supply current of 0.06mA, this IC is energy-efficient and suitable for low-power applications.

Technology: CMOS

The CMOS technology used in this IC offers low power consumption and high noise immunity, making it a reliable choice for power management.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process and ensures secure connections.

Terminal Pitch: 0.95 mm

With a terminal pitch of 0.95mm, this IC is suitable for fine-pitch applications, providing flexibility in design.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides a safety margin for voltage variations, ensuring the IC's stability and longevity.

Technical Specifications

Power Management ICs MAX809LEUR+T10 attributes and parameters. Explore more Power Management ICs devices from Analog Devices

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.63V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.3 mm

Trade Compliance

MAX809LEUR+T10 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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