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TPS23841PAPR

Texas Instruments

TPS23841PAPR by Texas Instruments

TPS23841PAPR by Texas Instruments is a Power Management IC with 48V nominal voltage, 64 terminals, and 1.2mm max seated height. It is used in automotive applications, operates b/w -40 to 125°C, and has a terminal pitch of 0.5mm.

Median Price

$9.310

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 98 parts In-Stock

1+ parts

$8.751

100+ parts

$8.464

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-

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98

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$8.464

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Arrow

USA . 41 parts In-Stock

1+ parts

$9.310

100+ parts

$9.004

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-

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41

$9.310

$9.004

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Verical

USA . 41 parts In-Stock

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$9.310

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$9.004

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41

$9.310

$9.004

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Texas Instruments

USA . 17,056 parts In-Stock

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$10.956

100+ parts

$9.570

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$6.600

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17,056

$10.956

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$6.600

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Mouser Electronics

USA . 1,109 parts In-Stock

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$14.810

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$10.080

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$9.220

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1,109

$14.810

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$9.220

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DigiKey

USA . 842 parts In-Stock

1+ parts

$14.810

100+ parts

$10.077

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$9.224

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842

$14.810

$10.077

$9.224

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Rochester

USA . 76 parts In-Stock

1+ parts

-

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$8.490

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$7.600

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$7.150

76

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$8.490

$7.600

$7.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,189 parts In-Stock

1+ parts

$4.146

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3,189

$4.146

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Nova Conductors

Japan . 300 parts In-Stock

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$9.468

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300

$9.468

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Vyrian

USA . 2,730 parts In-Stock

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NexGen Digital

USA . 189 parts In-Stock

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Cyclops Electronics Ltd

UK . 36 parts In-Stock

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LWI Electronics Inc

India . 17 parts In-Stock

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Sunrise Surplus Inc.

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 787 parts In-Stock

1+ parts

$2.387

100+ parts

-

1k+ parts

$2.884

10k+ parts

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787

$2.387

-

$2.884

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DigiPath Technology Company

USA . 233 parts In-Stock

1+ parts

$2.628

100+ parts

$2.418

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233

$2.628

$2.418

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ChromeModa Solutions

Germany . 5,266 parts In-Stock

1+ parts

$2.682

100+ parts

$2.199

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5,266

$2.682

$2.199

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IDEA Electronic Components Group

UK . 1,463 parts In-Stock

1+ parts

$2.682

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$2.414

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1,463

$2.682

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$2.414

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Semicontronic

India . 2,513 parts In-Stock

1+ parts

$3.520

100+ parts

$3.432

1k+ parts

$3.414

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2,513

$3.520

$3.432

$3.414

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Ampacity Inc.

Singapore . 2,267 parts In-Stock

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$3.710

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$3.710

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Corphita

USA . 4,904 parts In-Stock

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$3.928

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$3.928

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Corohmni

South Africa . 35 parts In-Stock

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$6.249

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$6.249

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Aranea Global

USA . 1,000 parts In-Stock

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$9.279

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$8.907

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$9.279

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$8.907

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Continental Prestige Electronics

USA . 3,593 parts In-Stock

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$9.468

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$9.279

3,593

$9.468

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$9.279

Advanced Electronics

New Zealand . 150 parts In-Stock

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$9.508

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$9.508

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$9.508

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$9.508

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$9.508

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,626 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,153 parts In-Stock

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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Argo Parts USA

USA . 2,519 parts In-Stock

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Kepictronics

USA . 586 parts In-Stock

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586

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Overview

Discover the power of efficient and reliable power management with the TPS23841PAPR by Texas Instruments. Designed with quality and precision in mind, this Power Management IC offers unparalleled performance suitable for a wide range of applications. With Texas Instruments' reputation for excellence and innovation, you can trust that this product delivers exceptional value and benefits to meet your power supply needs. Upgrade your systems today and experience the advantages of superior technology with the TPS23841PAPR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product.

Surface Mount: YES

The surface mount feature allows for easy and quick installation on PCBs.

Package Shape: SQUARE

The square package shape ensures efficient use of space on the PCB.

Nominal Supply Voltage (Vsup): 48 V

The 48V nominal supply voltage ensures compatibility with a wide range of applications.

Power Supplies (V): 48

The 48V power supplies offer sufficient power for various devices and systems.

No. of Terminals: 64

The 64 terminals allow for a strong and secure connection to the PCB.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The various package styles offer versatility in design and application.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides a high-quality connection and prevents corrosion.

Terminal Position: QUAD

The quad terminal position offers stability and reliability in the connection.

Maximum Seated Height: 1.2 mm

The low maximum seated height allows for compact designs.

Width (mm): 10 mm

The 10mm width ensures compatibility with standard PCB layouts.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

The power supply management circuit enhances efficiency and performance of the product.

Minimum Supply Voltage (Vsup): 21.5 V

The 21.5V minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering during installation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for secure and reliable soldering connections.

Length: 10 mm

The 10mm length ensures compatibility with standard PCB dimensions.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliability in automotive applications.

Maximum Supply Current (Isup): 14 mA

The 14mA maximum supply current ensures efficient power management.

Terminal Form: GULL WING

The gull wing terminal form offers a secure and stable connection to the PCB.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting on the PCB.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate moisture sensitivity, suitable for various environments.

Maximum Supply Voltage (Vsup): 57 V

The 57V maximum supply voltage allows for flexibility in power input.

Technical Specifications

Power Management ICs TPS23841PAPR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

14 mA

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

21.5 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

10 mm

Trade Compliance

TPS23841PAPR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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