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TPS26632RGER

Texas Instruments

TPS26632RGER by Texas Instruments

TPS26632RGER by Texas Instruments is a Power Management IC with 1 function, suitable for automotive applications. It operates b/w -40 to 125°C, supporting a max output current of 6A at a nominal voltage of 24V. This IC comes in a square chip carrier package with very thin profile and surface mount capability.

Median Price

$3.136

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 49,083 parts In-Stock

1+ parts

$3.136

100+ parts

$2.590

1k+ parts

$1.400

10k+ parts

-

49,083

$3.136

$2.590

$1.400

-

Mouser Electronics

USA . 3,058 parts In-Stock

1+ parts

$4.280

100+ parts

$3.640

1k+ parts

$3.420

10k+ parts

$2.230

3,058

$4.280

$3.640

$3.420

$2.230

Arrow

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.664

9,000

-

-

-

$1.664

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 62 parts In-Stock

1+ parts

$1.790

100+ parts

-

1k+ parts

-

10k+ parts

-

62

$1.790

-

-

-

Digiode

USA . 3,341 parts In-Stock

1+ parts

$2.979

100+ parts

-

1k+ parts

-

10k+ parts

-

3,341

$2.979

-

-

-

Vyrian

USA . 20,144 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,144

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 19,934 parts In-Stock

1+ parts

$1.410

100+ parts

$1.375

1k+ parts

$1.368

10k+ parts

-

19,934

$1.410

$1.375

$1.368

-

Ampacity Inc.

Singapore . 19,823 parts In-Stock

1+ parts

$1.410

100+ parts

-

1k+ parts

-

10k+ parts

-

19,823

$1.410

-

-

-

Continental Prestige Electronics

USA . 5,238 parts In-Stock

1+ parts

$1.790

100+ parts

-

1k+ parts

-

10k+ parts

$1.754

5,238

$1.790

-

-

$1.754

Argo Parts USA

USA . 3,095 parts In-Stock

1+ parts

$1.790

100+ parts

-

1k+ parts

-

10k+ parts

-

3,095

$1.790

-

-

-

Modulus Dynamics

Lithuania . 870 parts In-Stock

1+ parts

$1.987

100+ parts

$1.967

1k+ parts

$1.907

10k+ parts

-

870

$1.987

$1.967

$1.907

-

Corphita

USA . 4,695 parts In-Stock

1+ parts

$2.822

100+ parts

-

1k+ parts

-

10k+ parts

-

4,695

$2.822

-

-

-

Parana Technologies

USA . 1,666 parts In-Stock

1+ parts

$9.110

100+ parts

-

1k+ parts

$9.763

10k+ parts

-

1,666

$9.110

-

$9.763

-

DigiPath Technology Company

USA . 1,495 parts In-Stock

1+ parts

$10.031

100+ parts

$9.229

1k+ parts

-

10k+ parts

-

1,495

$10.031

$9.229

-

-

ChromeModa Solutions

Germany . 4,348 parts In-Stock

1+ parts

$10.236

100+ parts

$8.394

1k+ parts

-

10k+ parts

-

4,348

$10.236

$8.394

-

-

IDEA Electronic Components Group

UK . 348 parts In-Stock

1+ parts

$10.236

100+ parts

$9.724

1k+ parts

$9.212

10k+ parts

-

348

$10.236

$9.724

$9.212

-

Advanced Electronics

New Zealand . 17 parts In-Stock

1+ parts

$19.297

100+ parts

$18.332

1k+ parts

$18.332

10k+ parts

-

17

$19.297

$18.332

$18.332

-

Corohmni

South Africa . 534 parts In-Stock

1+ parts

$19.835

100+ parts

-

1k+ parts

-

10k+ parts

-

534

$19.835

-

-

-

Lixinc

USA . 14,260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,260

-

-

-

-

Overview

Experience superior power management with the TPS26632RGER by Texas Instruments. With a reputation for top-quality manufacturing, Texas Instruments delivers reliable Power Management ICs that excel in a variety of applications. This chip carrier, heat sink style IC offers a nominal supply voltage of 24V and a maximum output current of 6A, making it perfect for automotive use. Say goodbye to power supply issues and hello to efficiency with the TPS26632RGER.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use, making this product a good choice.

Surface Mount: YES

Allows for easy installation and space-saving on circuit boards, enhancing efficiency.

No. of Functions: 1

Simplifies design and integration into systems, making it user-friendly.

Package Shape: SQUARE

Offers a compact design for better space utilization in electronic devices.

Nominal Supply Voltage (Vsup): 24 V

Suitable for a wide range of applications, providing versatility.

No. of Terminals: 24

Ensures compatibility and connectivity with various components, improving functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Allows for efficient heat dissipation and compact sizing, enhancing performance.

Maximum Operating Temperature: 125 °C

Ensures reliable operation in high-temperature environments, increasing durability.

Minimum Operating Temperature: -40 °C

Suitable for use in harsh conditions, enhancing reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and resistance to corrosion, ensuring long-term performance.

Terminal Position: QUAD

Facilitates easy connection with other components, improving usability.

Maximum Seated Height: 1 mm

Enables low-profile designs for space-constrained applications.

Width (mm): 4 mm

Compact size allows for versatile installation options in different devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Enhances power management capabilities, making it a versatile choice.

Minimum Supply Voltage (Vsup): 60 V

Supports a wide range of voltage inputs, increasing compatibility.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures durability during manufacturing processes, improving quality.

Peak Reflow Temperature °C: 260

Withstands high temperatures during soldering, ensuring reliability.

Length: 4 mm

Compact design ideal for space-constrained applications, enhancing versatility.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications, ensuring reliability under harsh conditions.

Maximum Output Current: 6 A

Supports high current outputs, making it suitable for power-intensive applications.

No. of Channels: 1

Simplifies integration into systems, making it user-friendly.

Terminal Form: NO LEAD

Environmentally friendly option with lead-free terminals.

Terminal Pitch: 0.5 mm

Allows for precise connections, ensuring reliability in operation.

Moisture Sensitivity Level (MSL): 1

Resistant to moisture damage, ensuring reliability in humid environments.

Maximum Supply Voltage (Vsup): 60 V

Supports a wide range of voltage inputs, ensuring versatility in applications.

Adjustable Threshold: YES

Allows for customizable settings, enhancing flexibility in usage.

Technical Specifications

Power Management ICs TPS26632RGER attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

60 V

Minimum Supply Voltage (Vsup):

60 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

TPS26632RGER Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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