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BTS50055-1TMAXT

Infineon Technologies

BTS50055-1TMAXT by Infineon Technologies

BTS50055-1TMAXT by Infineon is a Power Management IC with AEC-Q100 screening. It has 7 terminals, Vsup range of 5V to 34V, and adjustable threshold voltage of 6V. Widely used in power supply support circuits for automotive applications due to its small outline package and wide temperature range from -40°C to 150°C.

Median Price

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Lifecycle Status

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4

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1k+

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VNN

France . 4,523 parts In-Stock

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Vyrian

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Digiode

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Nova Conductors

Japan . 100 parts In-Stock

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Ampacity Inc.

Singapore . 297 parts In-Stock

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$1.500

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Corohmni

South Africa . 89 parts In-Stock

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Semicontronic

India . 1,478 parts In-Stock

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$4.388

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$4.365

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$5.373

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Modulus Dynamics

Lithuania . 1,951 parts In-Stock

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$7.627

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$7.322

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$7.017

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Aztec Data Supply Inc.

USA . 3,209 parts In-Stock

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$10.700

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AZTECH Wire

Italy . 415 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 900 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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$6.217

Overview

Unlock the power of efficient and reliable power management with the BTS50055-1TMAXT by Infineon Technologies. Designed with quality and precision in mind, this Power Management IC offers unparalleled performance for a wide range of applications. Manufactured by industry leader Infineon Technologies, this product provides customers with value, benefits, and advantages that are unmatched in the market. Whether you're looking for high-quality power supply support or dependable performance in extreme temperatures, the BTS50055-1TMAXT has got you covered. Elevate your projects with Infineon's cutting-edge technology today.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and thermal stability, making it a reliable choice for power management applications.

Surface Mount:

YES - Allows for easy and efficient assembly on circuit boards, saving time and effort during production.

Screening Level:

AEC-Q100 - Ensures high reliability and quality, making it suitable for automotive applications where robustness is crucial.

Package Shape:

RECTANGULAR - Provides a compact design that helps in saving space and allows for efficient layout on PCBs.

Nominal Supply Voltage (Vsup):

12 V - Supports a wide range of input voltages, making it versatile for various power supply requirements.

No. of Terminals:

7 - Sufficient number of terminals for connecting to other components, enhancing flexibility in system design.

Package Style (Meter):

SMALL OUTLINE - Compact form factor that helps in reducing overall system size and weight, perfect for portable devices.

Maximum Operating Temperature:

150 °C - Allows for operation in high-temperature environments without risking damage to the component.

Minimum Operating Temperature:

40 °C - Ensures reliable performance even in extreme cold conditions, making it suitable for a wide range of applications.

Terminal Position:

SINGLE - Simplifies assembly and reduces the chance of errors during installation, leading to a more reliable end product.

Technical Specifications

Power Management ICs BTS50055-1TMAXT attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PSSO-G7

Length:

10 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP7H,.55,50TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Maximum Seated Height:

4.5 mm

Maximum Supply Voltage (Vsup):

34 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Nominal Threshold Voltage (V):

6

Width (mm):

9.25 mm

Trade Compliance

BTS50055-1TMAXT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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