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BTS50080-1EGA

Infineon Technologies

BTS50080-1EGA by Infineon Technologies

BTS50080-1EGA by Infineon is a Power Management IC with AEC-Q100 screening. It operates b/w -40 to 150 °C, supporting supply voltages from 9V to 16V. With a compact design and gull wing terminals, it's ideal for automotive power supply circuits.

Median Price

$1.595

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,586 parts In-Stock

1+ parts

$1.760

100+ parts

$1.660

1k+ parts

$1.500

10k+ parts

-

15,586

$1.760

$1.660

$1.500

-

Avnet

USA . 15,586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.430

10k+ parts

-

15,586

-

-

$1.430

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 131 parts In-Stock

1+ parts

$1.672

100+ parts

-

1k+ parts

-

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131

$1.672

-

-

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Vyrian

USA . 15,225 parts In-Stock

1+ parts

-

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15,225

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-

-

-

VNN

France . 1,551 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,551

-

-

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 15,286 parts In-Stock

1+ parts

$1.220

100+ parts

-

1k+ parts

-

10k+ parts

-

15,286

$1.220

-

-

-

Corphita

USA . 992 parts In-Stock

1+ parts

$1.584

100+ parts

-

1k+ parts

-

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992

$1.584

-

-

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Aztec Data Supply Inc.

USA . 330 parts In-Stock

1+ parts

$6.870

100+ parts

-

1k+ parts

-

10k+ parts

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330

$6.870

-

-

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Modulus Dynamics

Lithuania . 1,139 parts In-Stock

1+ parts

$8.758

100+ parts

$8.408

1k+ parts

$8.057

10k+ parts

-

1,139

$8.758

$8.408

$8.057

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Corohmni

South Africa . 35 parts In-Stock

1+ parts

$12.910

100+ parts

-

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35

$12.910

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Continental Prestige Electronics

USA . 3,917 parts In-Stock

1+ parts

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3,917

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Argo Parts USA

USA . 3,099 parts In-Stock

1+ parts

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3,099

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RC Electronics

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

$0.510

1k+ parts

$0.490

10k+ parts

$0.480

2,700

-

$0.510

$0.490

$0.480

A-Z Elektronik GmbH

Germany . 1,934 parts In-Stock

1+ parts

-

100+ parts

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1,934

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Enhance your power management capabilities with the BTS50080-1EGA by Infineon Technologies. Known for their high-quality products, Infineon Technologies delivers top-notch Power Management ICs like this one, perfect for a variety of applications. With a wide operating temperature range and AEC-Q100 screening level, this product offers reliability and durability. The BTS50080-1EGA provides value and benefits to customers through its efficient power supply support circuit, compact design, and ease of installation. Upgrade your power management system today with this innovative product from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and cost-effective.

Surface Mount: YES

This feature allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high quality and reliability, making this product suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to integrate into existing designs and saves space on the PCB.

Nominal Supply Voltage (Vsup): 13.5 V

With a nominal supply voltage of 13.5 V, this product is compatible with a wide range of power sources.

No. of Terminals: 12

The 12 terminals provide flexibility in connecting to other components, allowing for versatile use in various circuits.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline and heat sink design help in efficient heat dissipation, ensuring stable operation in high temperature environments.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this product is suitable for harsh industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at as low as -40°C makes this product reliable in extreme cold conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and reliability in connections, reducing the risk of failure.

Maximum Seated Height: 2.6 mm

The low seated height of 2.6 mm saves space and allows for compact designs in applications with height constraints.

Width (mm): 6.4 mm

The compact width of 6.4 mm enables easy integration into tight spaces on the PCB.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This product serves as a power supply support circuit, essential for ensuring stable power delivery in various electronic systems.

Minimum Supply Voltage (Vsup): 9 V

With a minimum supply voltage of 9 V, this product can efficiently operate even with low voltage power sources.

Length: 7.5 mm

The length of 7.5 mm provides a balance between compact size and ease of handling during installation.

Nominal Threshold Voltage (V): +2.8V

The nominal threshold voltage of +2.8V ensures accurate power regulation and protection against voltage fluctuations.

Maximum Supply Current (Isup): 24 mA

With a maximum supply current of 24 mA, this product is capable of handling moderate power loads reliably.

Terminal Form: GULL WING

The gull-wing terminal form ensures secure and stable connections, reducing the risk of intermittent contact.

Terminal Pitch: 1 mm

The terminal pitch of 1 mm provides efficient soldering and connection options, improving the ease of use during assembly.

Maximum Supply Voltage (Vsup): 16 V

With a maximum supply voltage of 16 V, this product offers flexibility in power input options for various applications.

Technical Specifications

Power Management ICs BTS50080-1EGA attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G12

Length:

7.5 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP12,.4,39

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

2.6 mm

Maximum Supply Current (Isup):

24 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

9 V

Nominal Supply Voltage (Vsup):

13.5 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.8V

Width (mm):

6.4 mm

Trade Compliance

BTS50080-1EGA Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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