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BTS500801TMCATMA1

Infineon Technologies

BTS500801TMCATMA1 by Infineon Technologies

BTS500801TMCATMA1 by Infineon is a Power Management IC with AEC-Q100 screening. It operates b/w -40 to 150 °C, supports 5.5-38V supply voltage range, and has 7 terminals for automotive applications.

Median Price

$3.938

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 27,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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27,750

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Verical

USA . 16,000 parts In-Stock

1+ parts

-

100+ parts

$3.938

1k+ parts

$3.350

10k+ parts

$3.150

16,000

-

$3.938

$3.350

$3.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 504 parts In-Stock

1+ parts

$3.164

100+ parts

-

1k+ parts

-

10k+ parts

-

504

$3.164

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$3.830

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$3.830

-

-

-

Vyrian

USA . 8,620 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,620

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Chip Stock

USA . 3,689 parts In-Stock

1+ parts

-

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3,689

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VNN

France . 1,089 parts In-Stock

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-

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1,089

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 22,668 parts In-Stock

1+ parts

$2.830

100+ parts

-

1k+ parts

-

10k+ parts

-

22,668

$2.830

-

-

-

Semicontronic

India . 22,611 parts In-Stock

1+ parts

$2.830

100+ parts

$2.759

1k+ parts

$2.745

10k+ parts

-

22,611

$2.830

$2.759

$2.745

-

Corphita

USA . 409 parts In-Stock

1+ parts

$2.997

100+ parts

-

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10k+ parts

-

409

$2.997

-

-

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Corohmni

South Africa . 579 parts In-Stock

1+ parts

$3.800

100+ parts

-

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579

$3.800

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Argo Parts USA

USA . 2,228 parts In-Stock

1+ parts

$3.830

100+ parts

-

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2,228

$3.830

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.830

100+ parts

-

1k+ parts

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10k+ parts

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1,000

$3.830

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-

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Continental Prestige Electronics

USA . 128 parts In-Stock

1+ parts

$3.830

100+ parts

-

1k+ parts

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10k+ parts

$3.753

128

$3.830

-

-

$3.753

Aztec Data Supply Inc.

USA . 2,658 parts In-Stock

1+ parts

$8.035

100+ parts

-

1k+ parts

-

10k+ parts

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2,658

$8.035

-

-

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AZTECH Wire

Italy . 1,124 parts In-Stock

1+ parts

$10.870

100+ parts

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1k+ parts

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10k+ parts

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1,124

$10.870

-

-

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Modulus Dynamics

Lithuania . 3,902 parts In-Stock

1+ parts

$14.190

100+ parts

$13.622

1k+ parts

$13.055

10k+ parts

-

3,902

$14.190

$13.622

$13.055

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Microchip USA

USA . 2,511 parts In-Stock

1+ parts

$20.363

100+ parts

-

1k+ parts

-

10k+ parts

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2,511

$20.363

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-

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Overview

Experience breakthrough power management technology with the BTS500801TMCATMA1 by Infineon Technologies. Designed for optimal performance and reliability, this Power Management IC offers unparalleled efficiency and precision in a compact package. Whether you're looking to enhance your automotive electronics or industrial applications, this product delivers exceptional value with its advanced features and high-quality construction. Trust Infineon Technologies for cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable makes the product easy to install and saves space on the PCB, making it ideal for compact designs.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the product meets stringent automotive quality and reliability standards, making it a reliable choice for automotive applications.

Nominal Supply Voltage (Vsup): 12 V

The nominal supply voltage of 12V makes it compatible with a wide range of power sources, allowing for versatile use.

No. of Terminals: 7

The 7 terminals provide multiple connection points, offering flexibility in circuit design and connectivity options.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package style with a heat sink/slug design helps in efficient heat dissipation, ensuring optimal performance of the product.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, the product can withstand harsh environmental conditions and maintain reliable operation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product can function in cold environments without any issues.

Terminal Finish: TIN

The tin terminal finish provides good conductivity and corrosion resistance, enhancing the reliability and longevity of the product.

Technology: SIPMOS

The SIPMOS technology offers efficient power management and low power consumption, making the product energy-efficient and reliable.

Technical Specifications

Power Management ICs BTS500801TMCATMA1 attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP7H,.55,50TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Screening Level:

AEC-Q100

Maximum Seated Height:

4.5 mm

Maximum Supply Current (Isup):

2.2 mA

Maximum Supply Voltage (Vsup):

38 V

Minimum Supply Voltage (Vsup):

5.5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

SIPMOS

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Nominal Threshold Voltage (V):

+3.5V

Width (mm):

9.25 mm

Trade Compliance

BTS500801TMCATMA1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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