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PINA234AIYBJR

Texas Instruments

PINA234AIYBJR by Texas Instruments

PINA234AIYBJR by Texas Instruments is a Power Management IC with 3.3V nominal voltage, suitable for automotive applications. It features a grid array package style with very thin profile and fine pitch terminals. With an adjustable threshold and operating temperature range from -40 to 125 °C, it offers versatile power supply support in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,058 parts In-Stock

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3,058

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Digiode

USA . 1,300 parts In-Stock

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1,300

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Nova Conductors

Japan . 70 parts In-Stock

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70

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Distributors (Availability)

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One Stop Electronics

USA . 1,630 parts In-Stock

1+ parts

$0.500

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1,630

$0.500

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Semicontronic

India . 1,115 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,115

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 1,401 parts In-Stock

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$5.500

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1,401

$5.500

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AZTECH Wire

Italy . 654 parts In-Stock

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$7.767

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654

$7.767

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Corohmni

South Africa . 944 parts In-Stock

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$9.568

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944

$9.568

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Parana Technologies

USA . 1,803 parts In-Stock

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$10.130

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$10.673

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1,803

$10.130

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$10.673

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DigiPath Technology Company

USA . 2,339 parts In-Stock

1+ parts

$11.154

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2,339

$11.154

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ChromeModa Solutions

Germany . 4,254 parts In-Stock

1+ parts

$11.382

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$9.333

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4,254

$11.382

$9.333

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IDEA Electronic Components Group

UK . 919 parts In-Stock

1+ parts

$11.382

100+ parts

$10.813

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$10.244

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919

$11.382

$10.813

$10.244

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Advanced Electronics

New Zealand . 48 parts In-Stock

1+ parts

$23.222

100+ parts

$22.061

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$22.061

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48

$23.222

$22.061

$22.061

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Continental Prestige Electronics

USA . 5,969 parts In-Stock

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Corphita

USA . 802 parts In-Stock

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802

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Robosynatics

Brazil . 533 parts In-Stock

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533

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Lucentia Tech

USA . 533 parts In-Stock

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533

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Argo Parts USA

USA . 24 parts In-Stock

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24

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Overview

Unlock the power of cutting-edge technology with the PINA234AIYBJR by Texas Instruments. As a leader in Power Management ICs, Texas Instruments ensures top-quality products that guarantee superior performance and reliability. With a versatile range of applications, this innovative product offers customers unparalleled value and benefits. Whether you're looking for automotive solutions or power supply support circuits, the PINA234AIYBJR delivers exceptional results every time. Trust Texas Instruments to provide you with the tools you need to succeed in today's fast-paced technological landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material makes the IC durable and resistant to external elements, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a nominal supply voltage of 3.3V provides a stable power source for various applications.

No. of Terminals: 8

Having 8 terminals enables connectivity with other components, improving system integration and functionality.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C allows for reliable performance in challenging environments or under heavy load conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures usability in a wide range of temperature conditions, making it suitable for diverse applications.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy access and connection, simplifying the installation process.

Maximum Seated Height: 0.35 mm

Low maximum seated height of 0.35mm saves space on the PCB and allows for compact designs.

Minimum Supply Voltage (Vsup): 1.7 V

Ability to operate at a minimum supply voltage of 1.7V provides flexibility for power sources with lower voltage outputs.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures that the IC can withstand harsh environmental conditions typically encountered in automotive applications.

Terminal Form: BALL

Ball terminal form enables secure and reliable connections with other components, reducing the risk of disconnection or malfunction.

Terminal Pitch: 0.4 mm

Small terminal pitch of 0.4mm allows for high-density mounting, maximizing PCB space utilization.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, the IC can handle higher input voltages, providing versatility for a range of power sources.

Adjustable Threshold: YES

Adjustable threshold feature allows for customization of operating parameters, enhancing compatibility with different system requirements.

Technical Specifications

Power Management ICs PINA234AIYBJR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B8

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA8,2X4,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.35 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Trade Compliance

PINA234AIYBJR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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