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PINA238AQDGSRQ1

Texas Instruments

PINA238AQDGSRQ1 by Texas Instruments

PINA238AQDGSRQ1 by Texas Instruments is a Power Management IC with AEC-Q100 screening for automotive applications. It operates b/w -40 to 125°C, supports supply voltages from 2.7V to 5.5V, and has a small outline package with dual terminals at 0.5mm pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,202 parts In-Stock

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7,202

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Digiode

USA . 2,842 parts In-Stock

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2,842

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 770 parts In-Stock

1+ parts

$2.500

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-

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770

$2.500

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Semicontronic

India . 493 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

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$5.335

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493

$5.500

$5.362

$5.335

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One Stop Electronics

USA . 311 parts In-Stock

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$6.500

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311

$6.500

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AZTECH Wire

Italy . 324 parts In-Stock

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$7.719

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324

$7.719

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Advanced Electronics

New Zealand . 76 parts In-Stock

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$11.301

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$10.736

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$10.736

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76

$11.301

$10.736

$10.736

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Parana Technologies

USA . 514 parts In-Stock

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$11.845

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$12.245

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514

$11.845

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$12.245

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Corohmni

South Africa . 330 parts In-Stock

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$11.911

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330

$11.911

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DigiPath Technology Company

USA . 1,064 parts In-Stock

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$13.043

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$11.999

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1,064

$13.043

$11.999

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ChromeModa Solutions

Germany . 6,565 parts In-Stock

1+ parts

$13.309

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$10.913

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6,565

$13.309

$10.913

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IDEA Electronic Components Group

UK . 617 parts In-Stock

1+ parts

$13.309

100+ parts

$12.644

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$11.978

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617

$13.309

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$11.978

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Continental Prestige Electronics

USA . 3,296 parts In-Stock

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Argo Parts USA

USA . 3,077 parts In-Stock

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Corphita

USA . 1,730 parts In-Stock

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1,730

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

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$31.020

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$31.020

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$31.020

500

-

$31.020

$31.020

$31.020

Overview

Enhance your automotive power management systems with the PINA238AQDGSRQ1 from Texas Instruments. This high-quality Power Management IC is designed to meet AEC-Q100 standards, ensuring reliability in extreme temperature conditions. With its compact size and versatile features, this IC offers superior power supply support for a wide range of automotive applications. Trust Texas Instruments to deliver cutting-edge technology that provides value, efficiency, and performance for all your power management needs. Elevate your automotive designs with the PINA238AQDGSRQ1 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation and integration onto circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

Ensures that the product meets automotive industry quality standards, making it reliable for use in automotive applications.

Nominal Supply Voltage (Vsup): 3.3 V

Optimal supply voltage for efficient power management and performance of the integrated circuits.

No. of Terminals: 10

Provides sufficient connectivity options for connecting to different components in the system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and space-saving design, suitable for applications where size constraints are a concern.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for use in demanding environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for reliable operation in extreme cold conditions as well.

Terminal Position: DUAL

Dual terminal position provides flexibility in connection options, accommodating different circuit layouts.

Maximum Seated Height: 1.1 mm

Low profile design for slim and compact devices, ideal for space-constrained applications.

Width (mm): 3 mm

Compact width size makes it suitable for small form factor devices and PCB layouts.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed for power management applications, ensuring efficient and reliable power supply support.

Minimum Supply Voltage (Vsup): 2.7 V

Allows for operation at low voltage levels, suitable for battery-powered or low-power applications.

Length: 3 mm

Compact length size for space-saving and efficient PCB layout designs.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for temperature range and durability, making it suitable for automotive applications.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections for stable operation of the integrated circuits.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connectivity and space-saving layout on circuit boards.

Maximum Supply Voltage (Vsup): 5.5 V

Safe operating voltage range for efficient power management and performance of the integrated circuits.

Technical Specifications

Power Management ICs PINA238AQDGSRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G10

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

PINA238AQDGSRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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