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PBQ76952PFBT

Texas Instruments

PBQ76952PFBT by Texas Instruments

PBQ76952PFBT by Texas Instruments is a Power Management IC with 48 terminals, Vsup range of 4.7V to 80V, and operating temperature from -40°C to 85°C. It is ideal for industrial applications requiring power supply management circuits in a compact flatpack package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 974 parts In-Stock

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Vyrian

USA . 242 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Ampacity Inc.

Singapore . 926 parts In-Stock

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$1.500

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926

$1.500

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One Stop Electronics

USA . 373 parts In-Stock

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$5.500

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373

$5.500

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Semicontronic

India . 251 parts In-Stock

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$6.500

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$6.338

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$6.305

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$6.500

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$6.305

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Corohmni

South Africa . 416 parts In-Stock

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$10.151

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Parana Technologies

USA . 1,760 parts In-Stock

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$13.858

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$14.338

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DigiPath Technology Company

USA . 366 parts In-Stock

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$15.260

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IDEA Electronic Components Group

UK . 1,894 parts In-Stock

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$15.571

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$14.792

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$14.014

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ChromeModa Solutions

Germany . 1,661 parts In-Stock

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$15.571

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$12.768

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AZTECH Wire

Italy . 587 parts In-Stock

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$18.289

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$24.298

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$23.083

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Corphita

USA . 4,090 parts In-Stock

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Continental Prestige Electronics

USA . 690 parts In-Stock

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Argo Parts USA

USA . 341 parts In-Stock

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Bastille Electronics

Australia . 26 parts In-Stock

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Overview

Enhance your power management capabilities with the PBQ76952PFBT by Texas Instruments. Manufactured with precision and quality in mind, this Power Management IC is designed to meet the demands of industrial applications. With a wide supply voltage range and adjustable threshold, this IC offers flexibility and efficiency in managing power supply circuits. Experience reliable performance and peace of mind knowing that your power needs are in good hands with Texas Instruments. Upgrade to the PBQ76952PFBT today and stay ahead in the game of power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight, cost-effective, and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 59.2 V

Suitable for applications requiring a stable power supply at this voltage level.

No. of Terminals: 48

Provides multiple connection points for a variety of input and output signals, enhancing versatility.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring reliability in harsh environments.

Terminal Position: QUAD

Quad terminal positioning facilitates easy integration into existing circuit designs and layouts.

Width (mm): 7 mm

Compact width allows for space-saving installation in tight layouts or designs.

Minimum Supply Voltage (Vsup): 4.7 V

Supports a wide range of input voltages, making it compatible with various power sources.

Temperature Grade: INDUSTRIAL

Designed for industrial applications where robust performance in challenging conditions is required.

No. of Channels: 2

Dual-channel capability allows for independent control or monitoring of two different power channels.

Technical Specifications

Power Management ICs PBQ76952PFBT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

80 V

Minimum Supply Voltage (Vsup):

4.7 V

Nominal Supply Voltage (Vsup):

59.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Trade Compliance

PBQ76952PFBT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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