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PBQ79718B1PAPTQ1

Texas Instruments

PBQ79718B1PAPTQ1 by Texas Instruments

PBQ79718B1PAPTQ1 by Texas Instruments is a Power Management IC with 18 channels, operating from -40 to 125°C. It features a package style of flatpack, gull wing terminals, and supports power supply circuits. Ideal for automotive applications due to AEC-Q100 screening and compact design with a max voltage of 90V.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,836 parts In-Stock

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Digiode

USA . 198 parts In-Stock

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198

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Nova Conductors

Japan . 84 parts In-Stock

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84

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One Stop Electronics

USA . 1,613 parts In-Stock

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$3.500

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$3.500

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Ampacity Inc.

Singapore . 1,179 parts In-Stock

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$3.500

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AZTECH Wire

Italy . 479 parts In-Stock

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$15.146

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479

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Argo Parts USA

USA . 3,529 parts In-Stock

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Corphita

USA . 1,620 parts In-Stock

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Continental Prestige Electronics

USA . 1,597 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Experience top-notch quality and performance with the PBQ79718B1PAPTQ1 by Texas Instruments, a leading manufacturer in the industry. This Power Management IC offers unmatched reliability and efficiency for a wide range of applications. With its innovative design and advanced features, this product provides exceptional value and benefits to customers seeking a powerful solution for their power supply support circuit needs. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly, saving time and reducing production costs.

Screening Level: AEC-Q100

AEC-Q100 standard ensures high reliability and quality, making this product suitable for automotive applications.

Package Shape: SQUARE

The square shape of the package provides efficient use of space and allows for easier integration into circuit designs.

No. of Terminals: 64

Having a large number of terminals allows for more connectivity options and functionality in the circuit.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The combination of these package styles provides versatility in mounting options and thermal management, catering to various design requirements.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand tough environmental conditions and operate reliably under high temperature scenarios.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for operation in extreme cold environments, increasing the product's suitability for diverse applications.

Terminal Position: QUAD

Quad terminal position offers increased stability and functionality in circuit connectivity, enhancing overall performance of the product.

Maximum Seated Height: 1.2 mm

Low profile design with maximum seated height of 1.2 mm enables compact and slim device form factor, ideal for space-constrained applications.

Width (mm): 10 mm

Compact width of 10 mm allows for efficient placement on PCBs and saves valuable board space for other components.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this product offers essential functions for managing power distribution and ensuring stable operation of electronic devices.

Length: 10 mm

Symmetrical dimensions with a length of 10 mm provide uniformity in design layout and ease of integration into different systems.

No. of Channels: 18

Multiple channels allow for simultaneous power management of different components or circuits, enhancing overall system efficiency.

Terminal Form: GULL WING

Gull wing terminal form offers strong mechanical support and secure solder joints, improving the reliability and durability of the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density mounting and precise connections, facilitating complex circuit designs.

Maximum Supply Voltage (Vsup): 90 V

With a maximum supply voltage of 90 V, this product can handle high voltage levels, making it suitable for power management in a wide range of applications.

Technical Specifications

Power Management ICs PBQ79718B1PAPTQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-G64

Length:

10 mm

No. of Channels:

18

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL64,.4,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

90 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

10 mm

Trade Compliance

PBQ79718B1PAPTQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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