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PBQ79731PHPTQ1

Texas Instruments

PBQ79731PHPTQ1 by Texas Instruments

PBQ79731PHPTQ1 by Texas Instruments is a Power Management IC with AEC-Q100 screening. It features 48 terminals in a square package, with operating temperatures from -40 to 125°C. Ideal for power supply support circuits in automotive applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,551 parts In-Stock

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Vyrian

USA . 4,298 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Distributors (Availability)

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One Stop Electronics

USA . 154 parts In-Stock

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$1.500

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154

$1.500

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Ampacity Inc.

Singapore . 1,130 parts In-Stock

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$4.500

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$4.500

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AZTECH Wire

Italy . 746 parts In-Stock

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$13.864

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746

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Corphita

USA . 4,887 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Overview

Experience the power of innovation with the PBQ79731PHPTQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that are perfect for a wide range of applications. With advanced technology and AEC-Q100 screening level, this product offers unmatched reliability and performance. Say goodbye to worries about overheating or power supply issues - this IC is designed to operate flawlessly in extreme temperatures and provide stable power support. Trust Texas Instruments to deliver excellence in every package, and elevate your projects to new heights with the PBQ79731PHPTQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and helps reduce the overall weight of the product, making it a reliable and efficient choice.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, making this product suitable for compact and space-constrained applications.

Screening Level: AEC-Q100

With AEC-Q100 screening level, this product meets automotive-grade quality standards, ensuring high reliability and performance in automotive applications.

Package Shape: SQUARE

The square package shape provides uniform heat dissipation and efficient space utilization, making it a versatile and practical choice for various electronic designs.

No. of Terminals: 48

With 48 terminals, this power management IC offers a high level of connectivity and flexibility for connecting to a wide range of external components, enhancing its functionality.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The combination of flatpack, heat sink/slug, thin profile, and fine pitch package styles allows for effective thermal management, space-saving design, and precise assembly, making it a versatile and reliable option.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures the product can withstand extreme environmental conditions, offering robust performance in demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables this power management IC to function efficiently in cold environments, expanding its usability in a wide range of applications.

Terminal Position: QUAD

The quad terminal position facilitates secure and stable connections, enhancing the reliability and longevity of the product in demanding operating conditions.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2mm allows for a slim and compact design, making this power management IC suitable for space-constrained applications where height is a critical factor.

Width (mm): 7 mm

With a width of 7mm, this product offers a compact footprint, enabling easy integration into small form factor devices and circuit layouts.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC provides essential functions for maintaining stable power delivery, enhancing the overall performance and efficiency of power management systems.

Length: 7 mm

The length of 7mm offers a balanced form factor, making this power management IC versatile for various electronic designs that require a compact and streamlined component.

Terminal Form: GULL WING

The gull-wing terminal form provides secure solder connections and ease of assembly, ensuring reliable electrical connections and long-term performance of the product.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this power management IC offers precise and compact terminal spacing, enabling high-density integration and enhancing the overall efficiency of circuit designs.

Maximum Supply Voltage (Vsup): 20 V

The high maximum supply voltage of 20V allows this power management IC to support a wide range of power supply configurations, making it suitable for diverse applications that require different voltage levels.

Technical Specifications

Power Management ICs PBQ79731PHPTQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HTQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

20 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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