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PBQ79606PHPTQ1

Texas Instruments

PBQ79606PHPTQ1 by Texas Instruments

PBQ79606PHPTQ1 by Texas Instruments is a Power Management IC with 12 channels, operating temperature range of -40 to 105°C. It features a flatpack package style, quad terminal position, and nickel palladium gold finish. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,771 parts In-Stock

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3,771

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Vyrian

USA . 2,732 parts In-Stock

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2,732

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LIBRA Elektronik GmbH

Germany . 250 parts In-Stock

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250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 248 parts In-Stock

1+ parts

$4.500

100+ parts

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248

$4.500

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Parana Technologies

USA . 957 parts In-Stock

1+ parts

$11.089

100+ parts

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$11.550

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957

$11.089

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$11.550

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DigiPath Technology Company

USA . 774 parts In-Stock

1+ parts

$12.211

100+ parts

$11.234

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774

$12.211

$11.234

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ChromeModa Solutions

Germany . 1,925 parts In-Stock

1+ parts

$12.460

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$10.217

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1,925

$12.460

$10.217

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IDEA Electronic Components Group

UK . 126 parts In-Stock

1+ parts

$12.460

100+ parts

$11.837

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$11.214

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126

$12.460

$11.837

$11.214

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AZTECH Wire

Italy . 376 parts In-Stock

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$18.055

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376

$18.055

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Corphita

USA . 2,760 parts In-Stock

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2,760

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Overview

Experience superior performance and reliability with the PBQ79606PHPTQ1 from Texas Instruments, a leading manufacturer in the industry of Power Management ICs. This high-quality product offers unmatched efficiency and versatility for a wide range of applications. With its advanced features and durable construction, this Power Supply Support Circuit ensures optimal power management while maintaining a compact design. Discover the value and benefits that this innovative solution brings to your projects, providing you with the competitive edge you need in today's demanding market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and thermal resistance, making the product suitable for industrial use.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

Ensures high quality and reliability, meeting automotive industry standards for robustness and performance.

Package Shape: SQUARE

Square shape allows for efficient use of layout space, optimizing design flexibility.

No. of Terminals: 48

Provides ample connectivity options for various components, enhancing compatibility and functionality.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Combination of different package styles offers versatility in mounting options and thermal management, catering to diverse application requirements.

Maximum Operating Temperature: 105 °C

Withstands high temperatures, ensuring stable performance in challenging environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, making it suitable for a wide range of industrial settings.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

Terminal Position: QUAD

Quad terminal layout simplifies connections and enhances stability, facilitating efficient circuit integration.

Maximum Seated Height: 1.2 mm

Low profile design saves space and allows for compact installations in constrained environments.

Width (mm): 7 mm

Compact width enables easy integration into various electronic devices without occupying excess space.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power management applications, ensuring optimal efficiency and performance in powering electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering process with precise timing, ensuring secure connections and reliable performance.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during soldering, maintaining structural integrity and electrical conductivity.

Length: 7 mm

Compact length contributes to space-saving design, facilitating streamlined circuit layouts and compact system configurations.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, providing robustness and resilience in harsh operating conditions.

No. of Channels: 12

Multiple channels enhance functionality and versatility, allowing for efficient power distribution and management across different components.

Terminal Form: GULL WING

Gull wing terminals offer secure and stable connections, minimizing the risk of disconnection or signal loss.

Terminal Pitch: 0.5 mm

Fine terminal pitch supports high-density layouts, enabling compact designs and efficient use of PCB space.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, making the product suitable for storage and operation in standard indoor environments.

Technical Specifications

Power Management ICs PBQ79606PHPTQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

12

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

PBQ79606PHPTQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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