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PTPS26630RGET

Texas Instruments

PTPS26630RGET by Texas Instruments

PTPS26630RGET by Texas Instruments is a Power Management IC with 24 terminals, operating voltage range of 4.5V to 60V, and temperature grade suitable for automotive applications. It features adjustable threshold, surface mount package style, and quad terminal position making it ideal for power supply support circuits in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,549 parts In-Stock

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Vyrian

USA . 3,077 parts In-Stock

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3,077

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Semicontronic

India . 298 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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-

298

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 265 parts In-Stock

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$2.500

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265

$2.500

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One Stop Electronics

USA . 995 parts In-Stock

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$7.500

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995

$7.500

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AZTECH Wire

Italy . 802 parts In-Stock

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$7.867

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802

$7.867

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$9.761

100+ parts

$9.273

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$9.273

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$9.761

$9.273

$9.273

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Corohmni

South Africa . 51 parts In-Stock

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$14.569

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$14.569

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Parana Technologies

USA . 1,834 parts In-Stock

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$19.396

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$19.409

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$19.396

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$19.409

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DigiPath Technology Company

USA . 1,135 parts In-Stock

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$21.357

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ChromeModa Solutions

Germany . 4,960 parts In-Stock

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$21.793

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$17.870

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$17.870

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IDEA Electronic Components Group

UK . 1,021 parts In-Stock

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$21.793

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$20.703

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$19.614

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Continental Prestige Electronics

USA . 6,174 parts In-Stock

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Corphita

USA . 4,129 parts In-Stock

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Argo Parts USA

USA . 2,839 parts In-Stock

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Robosynatics

Brazil . 200 parts In-Stock

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200

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Lucentia Tech

USA . 200 parts In-Stock

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$28.136

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$28.136

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$28.136

200

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$28.136

$28.136

$28.136

Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the PTPS26630RGET Power Management IC. Designed for automotive applications, this chip carrier boasts a wide supply voltage range, adjustable threshold, and surface mount compatibility for easy integration. Trust in Texas Instruments' expertise to deliver top-notch performance and efficiency, making it the ideal choice for your power management needs. Stay ahead of the curve with the PTPS26630RGET and unlock a world of possibilities in automotive power solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and insulation, ensuring a reliable performance and a longer lifespan for the product.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Nominal Supply Voltage (Vsup): 24 V

The 24V supply voltage makes this product suitable for a wide range of applications, providing flexibility and compatibility with various systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand demanding conditions and ensure stable performance even in elevated temperatures.

Width (mm): 4 mm

The compact width of 4mm allows for a space-efficient design, making it easy to integrate this power management IC into different devices and systems.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage of 4.5V ensures compatibility with a wide range of power sources, making this product versatile and adaptable to different setups.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this power management IC meets the specific requirements and standards for use in vehicles, providing reliability and performance in automotive environments.

Technical Specifications

Power Management ICs PTPS26630RGET attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

60 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

4 mm

Trade Compliance

PTPS26630RGET Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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