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PINA229AQDGSRQ1

Texas Instruments

PINA229AQDGSRQ1 by Texas Instruments

PINA229AQDGSRQ1 by Texas Instruments is a Power Management IC with AEC-Q100 screening for automotive applications. It operates b/w -40 to 125°C, supporting supply voltages from 2.7V to 5.5V. This small outline package with dual terminals is ideal for power supply support circuits in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,763 parts In-Stock

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7,763

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Digiode

USA . 3,100 parts In-Stock

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3,100

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 704 parts In-Stock

1+ parts

$2.500

100+ parts

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704

$2.500

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One Stop Electronics

USA . 956 parts In-Stock

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$3.500

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956

$3.500

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Semicontronic

India . 1,178 parts In-Stock

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$5.500

100+ parts

$5.362

1k+ parts

$5.335

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1,178

$5.500

$5.362

$5.335

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Parana Technologies

USA . 1,302 parts In-Stock

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$10.320

100+ parts

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$10.843

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1,302

$10.320

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$10.843

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DigiPath Technology Company

USA . 1,723 parts In-Stock

1+ parts

$11.364

100+ parts

$10.455

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1,723

$11.364

$10.455

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IDEA Electronic Components Group

UK . 1,020 parts In-Stock

1+ parts

$11.596

100+ parts

$11.016

1k+ parts

$10.436

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1,020

$11.596

$11.016

$10.436

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ChromeModa Solutions

Germany . 388 parts In-Stock

1+ parts

$11.596

100+ parts

$9.509

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388

$11.596

$9.509

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AZTECH Wire

Italy . 707 parts In-Stock

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$13.447

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707

$13.447

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Corohmni

South Africa . 95 parts In-Stock

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$21.335

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95

$21.335

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Corphita

USA . 2,845 parts In-Stock

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Argo Parts USA

USA . 2,725 parts In-Stock

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Continental Prestige Electronics

USA . 643 parts In-Stock

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Bastille Electronics

Australia . 550 parts In-Stock

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550

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Overview

Discover the power of Texas Instruments with the PINA229AQDGSRQ1 Power Management IC. Designed with quality in mind, this innovative product offers a wide range of applications in automotive settings. With a compact design and impressive temperature range, this IC provides optimal performance and reliability. Trust in Texas Instruments for cutting-edge technology that delivers value, efficiency, and peace of mind for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and cost-effectiveness.

Surface Mount: YES

Easy installation and space-saving design.

Screening Level: AEC-Q100

Ensures high quality and reliability for automotive applications.

Package Shape: SQUARE

Efficient use of board space.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with a wide range of devices.

No. of Terminals: 10

Supports multiple connections for versatile applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Offers compact and efficient design.

Maximum Operating Temperature: 125 °C

Can withstand high-temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions.

Terminal Position: DUAL

Allows for flexibility in installation.

Maximum Seated Height: 1.1 mm

Low profile for space-constrained applications.

Width (mm): 3 mm

Compact form factor for tight spaces.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Provides essential power management functions.

Minimum Supply Voltage (Vsup): 2.7 V

Works efficiently with low voltage sources.

Length: 3 mm

Small footprint for compact devices.

Temperature Grade: AUTOMOTIVE

Designed for reliable performance in automotive environments.

Terminal Form: NO LEAD

Environmentally friendly design.

Terminal Pitch: 0.5 mm

Allows for close spacing of connections.

Maximum Supply Voltage (Vsup): 5.5 V

Handles higher voltage inputs with ease.

Technical Specifications

Power Management ICs PINA229AQDGSRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G10

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

PINA229AQDGSRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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