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TLC7701IDG4

Texas Instruments

TLC7701IDG4 by Texas Instruments

TLC7701IDG4 by Texas Instruments is a Power Management IC with Vsup ranging from 2V to 6V. It features a small outline package, operates in industrial temperature range (-40 to 85 °C), and consumes low supply current of 0.016 mA. Ideal for power supply support circuits in various applications.

Median Price

$1.410

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$0.162

100+ parts

-

1k+ parts

-

10k+ parts

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1

$0.162

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-

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Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$1.260

100+ parts

-

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1

$1.260

-

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Mouser Electronics

USA . 63 parts In-Stock

1+ parts

$2.390

100+ parts

$1.710

1k+ parts

$1.410

10k+ parts

$0.974

63

$2.390

$1.710

$1.410

$0.974

Rochester

USA . 161 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

$1.290

10k+ parts

$1.150

161

-

$1.560

$1.290

$1.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,708 parts In-Stock

1+ parts

$0.156

100+ parts

-

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4,708

$0.156

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Nova Conductors

Japan . 20 parts In-Stock

1+ parts

$1.448

100+ parts

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20

$1.448

-

-

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Chip Stock

USA . 14,510 parts In-Stock

1+ parts

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14,510

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Vyrian

USA . 4,930 parts In-Stock

1+ parts

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4,930

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-

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Speed Components Ltd

Israel . 450 parts In-Stock

1+ parts

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450

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Odintec Ltd.

Israel . 75 parts In-Stock

1+ parts

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75

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 20 parts In-Stock

1+ parts

$0.139

100+ parts

$0.136

1k+ parts

$0.135

10k+ parts

-

20

$0.139

$0.136

$0.135

-

Corphita

USA . 4,079 parts In-Stock

1+ parts

$0.148

100+ parts

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4,079

$0.148

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Ampacity Inc.

Singapore . 57 parts In-Stock

1+ parts

$0.303

100+ parts

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57

$0.303

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Continental Prestige Electronics

USA . 5,855 parts In-Stock

1+ parts

$1.292

100+ parts

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1k+ parts

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10k+ parts

$1.267

5,855

$1.292

-

-

$1.267

Argo Parts USA

USA . 2,926 parts In-Stock

1+ parts

$1.292

100+ parts

-

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10k+ parts

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2,926

$1.292

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Parana Technologies

USA . 1,786 parts In-Stock

1+ parts

$5.538

100+ parts

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1k+ parts

$6.305

10k+ parts

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1,786

$5.538

-

$6.305

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DigiPath Technology Company

USA . 1,283 parts In-Stock

1+ parts

$6.099

100+ parts

$5.611

1k+ parts

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10k+ parts

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1,283

$6.099

$5.611

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ChromeModa Solutions

Germany . 2,444 parts In-Stock

1+ parts

$6.223

100+ parts

$5.103

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-

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2,444

$6.223

$5.103

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IDEA Electronic Components Group

UK . 1,730 parts In-Stock

1+ parts

$6.223

100+ parts

-

1k+ parts

$5.601

10k+ parts

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1,730

$6.223

-

$5.601

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Corohmni

South Africa . 600 parts In-Stock

1+ parts

$11.015

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600

$11.015

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AZTECH Wire

Italy . 426 parts In-Stock

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$15.868

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426

$15.868

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Advanced Electronics

New Zealand . 47 parts In-Stock

1+ parts

$21.654

100+ parts

$20.571

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$20.571

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47

$21.654

$20.571

$20.571

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 1,949 parts In-Stock

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1,949

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Perfect Parts

USA . 1,011 parts In-Stock

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1,011

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$1.419

1k+ parts

$1.375

10k+ parts

$1.346

1,000

-

$1.419

$1.375

$1.346

Robosynatics

Brazil . 350 parts In-Stock

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350

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Lucentia Tech

USA . 350 parts In-Stock

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350

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Overview

Experience superior power management with the TLC7701IDG4 from Texas Instruments. Crafted with precision and quality, this Power Management IC offers unparalleled reliability and efficiency. Suitable for a wide range of applications, this product provides customers with the peace of mind that comes with knowing their devices are in good hands. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your power management solutions with the TLC7701IDG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good durability and thermal performance, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 2.7 V

The nominal supply voltage of 2.7V ensures compatibility with a wide range of devices and power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to function reliably in harsh environments and industrial settings.

Technology: BICMOS

The use of BICMOS technology combines the benefits of both bipolar and CMOS technologies, providing high-speed operation and low power consumption.

Technical Specifications

Power Management ICs TLC7701IDG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.016 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.1V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TLC7701IDG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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