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NCP303LSN30T1G

Onsemi

NCP303LSN30T1G by Onsemi

NCP303LSN30T1G by Onsemi is a Power Management IC with Vsup of 1.5V, Isup of 0.0013mA, and V range of 0.8-10V. It is used in automotive applications for power supply support circuits due to its compact size, CMOS technology, and wide operating temperature range from -40 to 125°C.

Median Price

$0.228

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 12,170 parts In-Stock

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$0.236

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$0.196

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$0.175

12,170

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$0.236

$0.196

$0.175

Verical

USA . 12,170 parts In-Stock

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$0.219

12,170

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$0.219

Distrelec

Netherlands . 2,549 parts In-Stock

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Digiode

USA . 634 parts In-Stock

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$0.193

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634

$0.193

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Nova Conductors

Japan . 70 parts In-Stock

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$0.695

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70

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Mobius Materials

USA . 1,876 parts In-Stock

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$1.400

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$1.120

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A&K Electronics

USA . 417,000 parts In-Stock

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Bristol Electronics

USA . 417,000 parts In-Stock

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Chip Stock

USA . 272,500 parts In-Stock

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Cyclops Electronics Ltd

UK . 38,164 parts In-Stock

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Rotakorn

Sweden . 23,800 parts In-Stock

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Flip Electronics

USA . 20,000 parts In-Stock

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Technoshack Inc.

Canada . 12,000 parts In-Stock

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Vyrian

USA . 2,041 parts In-Stock

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Martec Srl

Italy . 1,974 parts In-Stock

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ComSIT Distribution GmbH

Germany . 214 parts In-Stock

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ComSIT USA

USA . 214 parts In-Stock

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Goldney Electronics S.L.

Spain . 182 parts In-Stock

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A2Z Electronics, Inc.

USA . 87 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 51 parts In-Stock

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Sensible Micro Corp

USA . 20 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,457 parts In-Stock

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$0.173

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$0.173

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Corphita

USA . 1,698 parts In-Stock

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$0.183

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$0.183

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Corohmni

South Africa . 202 parts In-Stock

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$0.203

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202

$0.203

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$0.320

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$0.304

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$0.304

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5,000

$0.320

$0.304

$0.304

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Semicontronic

India . 3,805 parts In-Stock

1+ parts

$0.376

100+ parts

$0.367

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$0.365

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3,805

$0.376

$0.367

$0.365

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Vigor

Singapore . 394 parts In-Stock

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$0.620

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394

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Continental Prestige Electronics

USA . 2 parts In-Stock

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$0.669

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2

$0.669

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Argo Parts USA

USA . 4,972 parts In-Stock

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$0.695

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$0.674

4,972

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$0.674

Aztec Data Supply Inc.

USA . 4,391 parts In-Stock

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$6.970

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$6.970

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AZTECH Wire

Italy . 509 parts In-Stock

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$8.720

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509

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Perfect Parts

USA . 567,348 parts In-Stock

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Kepictronics

USA . 87,000 parts In-Stock

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RC Electronics

USA . 85,421 parts In-Stock

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GreenTree Electronics

Israel . 30,000 parts In-Stock

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ChipstoGo Electronic ltd

UK . 27,000 parts In-Stock

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Lixinc

USA . 14,282 parts In-Stock

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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Infinite Electronics LLP (Excess)

. 8,436 parts In-Stock

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Kulean Microsystems

USA . 7,211 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,008 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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SupplyDigital Components

Austria . 2,071 parts In-Stock

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TANS Electronics

Latvia . 1,930 parts In-Stock

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Problanco Electronics

Mexico . 1,126 parts In-Stock

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UHIMA Technologies

Türkiye . 689 parts In-Stock

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689

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Microchip USA

USA . 473 parts In-Stock

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473

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Robosynatics

Brazil . 350 parts In-Stock

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350

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Lucentia Tech

USA . 350 parts In-Stock

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Overview

Enhance your power management capabilities with the NCP303LSN30T1G by Onsemi. As a leader in the industry, Onsemi delivers top-notch quality and reliability in their products. This Power Management IC is perfect for automotive applications, offering a wide range of supply voltages and temperature grades. With its compact design and advanced technology, this IC provides optimal performance and efficiency for all your power supply support circuit needs. Upgrade your systems with the NCP303LSN30T1G and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection, making it suitable for various applications.

Surface Mount: YES

This feature allows for easy and efficient PCB assembly, reducing production time and costs.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design, saving space on the board.

Nominal Supply Voltage (Vsup): 1.5 V

The nominal supply voltage ensures stable operation and compatibility with many systems.

Power Supplies (V): 0.8/10

With a wide range of power supplies, this IC can be used in a variety of applications.

No. of Terminals: 5

The number of terminals provides flexibility in connectivity and functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style offers a slim profile and efficient layout, ideal for space-constrained designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability and performance in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in diverse temperature conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and resistance to corrosion.

Terminal Position: DUAL

Dual terminal positions offer improved stability and reliability in connections.

Maximum Seated Height: 1.1 mm

The low seated height allows for a compact and slim design, saving space in the overall system.

Width (mm): 1.5 mm

The narrow width makes this IC suitable for applications with limited board space.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC provides essential support for power supply functions, ensuring optimal performance.

Minimum Supply Voltage (Vsup): 0.8 V

The minimum supply voltage allows for operation in low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures proper soldering and reliability during the assembly process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the IC's durability during manufacturing processes.

Length: 3 mm

The compact length of this IC makes it suitable for small form factor designs.

Nominal Threshold Voltage (V): +3V

The nominal threshold voltage allows for precise voltage detection and control.

Temperature Grade: AUTOMOTIVE

This IC is designed to meet automotive industry standards and requirements for temperature range.

Maximum Supply Current (Isup): 0.0013 mA

The low maximum supply current ensures efficient power consumption and reduced heat dissipation.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity for reliable performance.

Terminal Form: GULL WING

The gull wing terminal form provides secure and robust connections on the PCB.

Terminal Pitch: 0.95 mm

The narrow terminal pitch allows for high-density mounting and compact PCB layouts.

Maximum Supply Voltage (Vsup): 10 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

Technical Specifications

Power Management ICs NCP303LSN30T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 3.0V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP303LSN30T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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