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NCP303LSN29T1G

Onsemi

NCP303LSN29T1G by Onsemi

NCP303LSN29T1G by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for automotive applications. It features a small outline package style, dual terminal position, and operates in temperatures from -40°C to 125°C. This CMOS technology IC has a nominal threshold voltage of +2.9V and low supply current of 0.0013mA.

Median Price

$0.205

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 3,000 parts In-Stock

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$0.143

3,000

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$0.143

Verical

USA . 1,772 parts In-Stock

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$0.256

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Rochester

USA . 2 parts In-Stock

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$0.205

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$0.170

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$0.151

2

-

$0.205

$0.170

$0.151

Distributors (In-Stock)

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Digiode

USA . 417 parts In-Stock

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$0.160

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Nova Conductors

Japan . 50 parts In-Stock

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$0.336

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$0.336

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Cyclops Electronics Ltd

UK . 37,928 parts In-Stock

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Chip Stock

USA . 30,499 parts In-Stock

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Vyrian

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Flip Electronics

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Prism Electronics

USA . 4 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,670 parts In-Stock

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$0.143

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1,670

$0.143

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Semicontronic

India . 1,401 parts In-Stock

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$0.143

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$0.139

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$0.139

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1,401

$0.143

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$0.139

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Corphita

USA . 1,618 parts In-Stock

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$0.151

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Corohmni

South Africa . 65 parts In-Stock

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$0.168

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$0.168

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Continental Prestige Electronics

USA . 4,981 parts In-Stock

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$0.336

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$0.329

4,981

$0.336

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$0.329

Argo Parts USA

USA . 250 parts In-Stock

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$0.336

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$0.326

250

$0.336

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$0.326

Vigor

Singapore . 795 parts In-Stock

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$0.450

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795

$0.450

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Aztec Data Supply Inc.

USA . 1,173 parts In-Stock

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$7.920

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AZTECH Wire

Italy . 786 parts In-Stock

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$14.450

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Perfect Parts

USA . 613,575 parts In-Stock

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GreenTree Electronics

Israel . 60,000 parts In-Stock

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ChipstoGo Electronic ltd

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Kepictronics

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TANS Electronics

Latvia . 7,236 parts In-Stock

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Lixinc

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SupplyDigital Components

Austria . 5,220 parts In-Stock

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Futuretech Components

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Kulean Microsystems

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iodParts Technologies Inc.

India . 900 parts In-Stock

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UHIMA Technologies

Türkiye . 493 parts In-Stock

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Problanco Electronics

Mexico . 226 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

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Overview

Discover the NCP303LSN29T1G by Onsemi, a top-of-the-line Power Management IC designed to provide superior performance and reliability. With a focus on quality and innovation, Onsemi delivers cutting-edge solutions for a wide range of applications. This compact and efficient IC offers customers value, benefits, and advantages that set it apart from the competition. Trust Onsemi to power up your devices with precision and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the power management IC.

Nominal Supply Voltage (Vsup): 1.5 V

Suitable for a wide range of applications requiring a stable power supply at 1.5V.

Maximum Operating Temperature: 125 °C

Ensures the power management IC can withstand high temperatures without malfunctioning.

Technology: CMOS

Utilizes CMOS technology for efficient power management and low power consumption.

Nominal Threshold Voltage (V): +2.9V

Provides a specific threshold voltage for proper operation and protection against voltage fluctuations.

Temperature Grade: AUTOMOTIVE

Designed to meet the stringent temperature and reliability requirements of automotive applications.

Technical Specifications

Power Management ICs NCP303LSN29T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.9V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.9V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP303LSN29T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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