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NCP382HD10A-AR2G

Onsemi

NCP382HD10A-AR2G by Onsemi

NCP382HD10A-AR2G by Onsemi is a Power Management IC with 5V Nominal Voltage, -40 to 85°C Operating Temperature range, and 8 Terminals. It is used as a Power Supply Support Circuit in applications requiring a compact SMALL OUTLINE package with GULL WING terminals for surface mounting.

Median Price

$0.388

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 18,096 parts In-Stock

1+ parts

$0.700

100+ parts

$0.391

1k+ parts

$0.335

10k+ parts

$0.312

18,096

$0.700

$0.391

$0.335

$0.312

DigiKey

USA . 5,000 parts In-Stock

1+ parts

$0.700

100+ parts

$0.391

1k+ parts

$0.335

10k+ parts

$0.308

5,000

$0.700

$0.391

$0.335

$0.308

Rochester

USA . 40,935 parts In-Stock

1+ parts

-

100+ parts

$0.380

1k+ parts

$0.316

10k+ parts

$0.281

40,935

-

$0.380

$0.316

$0.281

Verical

USA . 40,935 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.395

10k+ parts

$0.352

40,935

-

-

$0.395

$0.352

Arrow

USA . 32,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.290

32,500

-

-

-

$0.290

Future Electronics

Canada . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.305

2,500

-

-

-

$0.305

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 697 parts In-Stock

1+ parts

$0.295

100+ parts

-

1k+ parts

-

10k+ parts

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697

$0.295

-

-

-

Nova Conductors

Japan . 96 parts In-Stock

1+ parts

$0.375

100+ parts

-

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96

$0.375

-

-

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Vyrian

USA . 32,368 parts In-Stock

1+ parts

-

100+ parts

-

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-

32,368

-

-

-

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NAC Semi

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.477

5,000

-

-

-

$0.477

IBS Electronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.397

2,500

-

-

-

$0.397

Euro-Tech

UK . 390 parts In-Stock

1+ parts

-

100+ parts

-

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390

-

-

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-

Contempo Components LLC

USA . 186 parts In-Stock

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186

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 46,416 parts In-Stock

1+ parts

$0.233

100+ parts

-

1k+ parts

-

10k+ parts

-

46,416

$0.233

-

-

-

Corphita

USA . 2,055 parts In-Stock

1+ parts

$0.280

100+ parts

-

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-

10k+ parts

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2,055

$0.280

-

-

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Corohmni

South Africa . 256 parts In-Stock

1+ parts

$0.311

100+ parts

-

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10k+ parts

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256

$0.311

-

-

-

Continental Prestige Electronics

USA . 5,136 parts In-Stock

1+ parts

$0.375

100+ parts

-

1k+ parts

-

10k+ parts

$0.367

5,136

$0.375

-

-

$0.367

Argo Parts USA

USA . 726 parts In-Stock

1+ parts

$0.375

100+ parts

-

1k+ parts

-

10k+ parts

$0.364

726

$0.375

-

-

$0.364

Vigor

Singapore . 315 parts In-Stock

1+ parts

$0.870

100+ parts

-

1k+ parts

-

10k+ parts

-

315

$0.870

-

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Microchip USA

USA . 4,249 parts In-Stock

1+ parts

$2.208

100+ parts

-

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4,249

$2.208

-

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Futuretech Components

Singapore . 29,980 parts In-Stock

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29,980

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Lixinc

USA . 19,143 parts In-Stock

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19,143

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TANS Electronics

Latvia . 8,370 parts In-Stock

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8,370

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Problanco Electronics

Mexico . 7,739 parts In-Stock

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7,739

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Assy Fe

Spain . 7,260 parts In-Stock

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7,260

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Kepictronics

USA . 4,000 parts In-Stock

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4,000

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SupplyDigital Components

Austria . 3,932 parts In-Stock

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3,932

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Infinite Electronics LLP (Excess)

. 2,395 parts In-Stock

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2,395

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$0.367

1k+ parts

$0.356

10k+ parts

$0.349

2,000

-

$0.367

$0.356

$0.349

Perfect Parts

USA . 1,008 parts In-Stock

1+ parts

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1,008

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Kulean Microsystems

USA . 839 parts In-Stock

1+ parts

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839

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Formix International (Excess)

India . 789 parts In-Stock

1+ parts

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789

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UHIMA Technologies

Türkiye . 520 parts In-Stock

1+ parts

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520

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-

Overview

Discover the power of seamless energy management with the NCP382HD10A-AR2G by Onsemi. Crafted with precision and reliability in mind, this Power Management IC offers unparalleled performance in a compact package. Ideal for a wide range of applications, this product provides superior voltage regulation and efficiency, ensuring optimal power consumption for your devices. Trust in Onsemi's reputation for excellence and elevate your power management experience today with the NCP382HD10A-AR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability to the product, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 5 V

Suitable for a wide range of devices and applications that require a stable 5 V power supply.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure optimal performance.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability, ensuring reliable connections in electronic circuits.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically as a power supply support circuit, this IC enhances the overall performance and reliability of power management in electronic devices.

Minimum Supply Voltage (Vsup): 2.5 V

Allows for flexibility in power input options, catering to devices that operate on lower supply voltages.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during manufacturing processes, ensuring proper soldering and assembly of the IC.

Technical Specifications

Power Management ICs NCP382HD10A-AR2G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

2.35

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCP382HD10A-AR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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