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NCP302LSN30T1G

Onsemi

NCP302LSN30T1G by Onsemi

NCP302LSN30T1G by Onsemi is a Power Management IC with Vsup of 1.5V, Isup of 0.0013mA, and V range of 0.8-10V. It's a CMOS technology IC suitable for automotive applications due to its operating temp range of -40 to 125°C and small outline package style.

Median Price

$0.176

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 607 parts In-Stock

1+ parts

$0.176

100+ parts

$0.166

1k+ parts

$0.150

10k+ parts

$0.150

607

$0.176

$0.166

$0.150

$0.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,369 parts In-Stock

1+ parts

$0.167

100+ parts

-

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2,369

$0.167

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$0.416

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200

$0.416

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Flip Electronics

USA . 75,000 parts In-Stock

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75,000

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Chip Stock

USA . 17,380 parts In-Stock

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Vyrian

USA . 7,836 parts In-Stock

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7,836

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ComSIT Distribution GmbH

Germany . 3,288 parts In-Stock

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3,288

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AGACORP

USA . 3,000 parts In-Stock

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3,000

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Cyclops Electronics Ltd

UK . 2,495 parts In-Stock

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2,495

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NPI Materials, Inc.

USA . 40 parts In-Stock

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40

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Sensible Micro Corp

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 536 parts In-Stock

1+ parts

$0.150

100+ parts

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536

$0.150

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Semicontronic

India . 324 parts In-Stock

1+ parts

$0.150

100+ parts

$0.146

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$0.146

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324

$0.150

$0.146

$0.146

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Corphita

USA . 311 parts In-Stock

1+ parts

$0.158

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311

$0.158

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Corohmni

South Africa . 393 parts In-Stock

1+ parts

$0.176

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393

$0.176

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$0.329

100+ parts

$0.303

1k+ parts

$0.283

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-

40

$0.329

$0.303

$0.283

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Continental Prestige Electronics

USA . 3,664 parts In-Stock

1+ parts

$0.335

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$0.328

3,664

$0.335

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-

$0.328

Argo Parts USA

USA . 3,256 parts In-Stock

1+ parts

$0.335

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$0.325

3,256

$0.335

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$0.325

Vigor

Singapore . 630 parts In-Stock

1+ parts

$0.450

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630

$0.450

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AZTECH Wire

Italy . 754 parts In-Stock

1+ parts

$13.420

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754

$13.420

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Aztec Data Supply Inc.

USA . 3,212 parts In-Stock

1+ parts

$19.680

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3,212

$19.680

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Perfect Parts

USA . 399,246 parts In-Stock

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399,246

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RC Electronics

USA . 85,154 parts In-Stock

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Kepictronics

USA . 27,000 parts In-Stock

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GreenTree Electronics

Israel . 26,387 parts In-Stock

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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Lixinc

USA . 17,816 parts In-Stock

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Futuretech Components

Singapore . 10,000 parts In-Stock

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SupplyDigital Components

Austria . 5,925 parts In-Stock

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Problanco Electronics

Mexico . 3,413 parts In-Stock

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3,413

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Netroflash

USA . 2,000 parts In-Stock

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$0.408

1k+ parts

$0.395

10k+ parts

$0.387

2,000

-

$0.408

$0.395

$0.387

Kulean Microsystems

USA . 1,028 parts In-Stock

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1,028

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Speed Components Ltd (Excess)

Israel . 826 parts In-Stock

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826

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TANS Electronics

Latvia . 515 parts In-Stock

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515

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Microchip USA

USA . 470 parts In-Stock

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470

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Robosynatics

Brazil . 350 parts In-Stock

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350

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Lucentia Tech

USA . 350 parts In-Stock

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350

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iodParts Technologies Inc.

India . 181 parts In-Stock

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181

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UHIMA Technologies

Türkiye . 164 parts In-Stock

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164

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Overview

Discover the NCP302LSN30T1G by Onsemi, a top-tier power management IC that guarantees superior quality and reliability. Manufactured by Onsemi, a trusted industry leader, this product offers a wide range of applications in various fields. With its compact design and advanced technology, the NCP302LSN30T1G ensures optimal performance and efficiency. Experience seamless power supply support with this automotive-grade IC that provides unmatched value and benefits to customers. Upgrade your systems today with the NCP302LSN30T1G for enhanced productivity and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material is cost-effective and provides good durability for the product.

Surface Mount: YES

Surface mount technology is space-saving and allows for efficient component placement on the PCB.

Nominal Supply Voltage (Vsup): 1.5 V

Stable nominal supply voltage of 1.5V ensures consistent power delivery to the connected components.

No. of Terminals: 5

Having 5 terminals provides enough connectivity options for the power management IC.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature of 125°C ensures reliable performance even in elevated temperature conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows for operation in a wide range of environments.

Technical Specifications

Power Management ICs NCP302LSN30T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 3.0V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP302LSN30T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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