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TLC7733IDRG4

Texas Instruments

TLC7733IDRG4 by Texas Instruments

TLC7733IDRG4 by Texas Instruments is a Power Management IC with 1 function, operating voltage of 2-6V, and small outline package. It is used as a power supply support circuit in industrial applications.

Median Price

$1.020

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 6,484 parts In-Stock

1+ parts

-

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$1.020

6,484

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$1.020

Distributors (In-Stock)

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Nova Conductors

Japan . 74 parts In-Stock

1+ parts

$1.460

100+ parts

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74

$1.460

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Chip Stock

USA . 14,780 parts In-Stock

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14,780

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Vyrian

USA . 6,015 parts In-Stock

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Digiode

USA . 694 parts In-Stock

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694

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Distributors (Availability)

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Ampacity Inc.

Singapore . 6,447 parts In-Stock

1+ parts

$0.870

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-

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6,447

$0.870

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Semicontronic

India . 5,998 parts In-Stock

1+ parts

$0.870

100+ parts

$0.848

1k+ parts

$0.844

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5,998

$0.870

$0.848

$0.844

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Corohmni

South Africa . 749 parts In-Stock

1+ parts

$1.460

100+ parts

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749

$1.460

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Continental Prestige Electronics

USA . 4,464 parts In-Stock

1+ parts

$1.460

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$1.431

4,464

$1.460

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$1.431

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.460

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-

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$1.387

10k+ parts

$1.358

2,000

$1.460

-

$1.387

$1.358

Argo Parts USA

USA . 760 parts In-Stock

1+ parts

$1.460

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760

$1.460

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$1.504

100+ parts

$1.429

1k+ parts

$1.429

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-

200

$1.504

$1.429

$1.429

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Modulus Dynamics

Lithuania . 500 parts In-Stock

1+ parts

$1.621

100+ parts

$1.604

1k+ parts

$1.556

10k+ parts

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500

$1.621

$1.604

$1.556

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Parana Technologies

USA . 1,744 parts In-Stock

1+ parts

$5.116

100+ parts

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$5.705

10k+ parts

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1,744

$5.116

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$5.705

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DigiPath Technology Company

USA . 1,348 parts In-Stock

1+ parts

$5.633

100+ parts

$5.182

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1,348

$5.633

$5.182

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ChromeModa Solutions

Germany . 3,146 parts In-Stock

1+ parts

$5.748

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$4.713

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3,146

$5.748

$4.713

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IDEA Electronic Components Group

UK . 1,507 parts In-Stock

1+ parts

$5.748

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$5.173

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1,507

$5.748

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$5.173

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Lixinc

USA . 19,560 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,655 parts In-Stock

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5,655

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Microchip USA

USA . 1,757 parts In-Stock

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1,757

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Corphita

USA . 587 parts In-Stock

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Robosynatics

Brazil . 30 parts In-Stock

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30

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Lucentia Tech

USA . 30 parts In-Stock

1+ parts

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$0.053

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$0.053

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$0.053

30

-

$0.053

$0.053

$0.053

Overview

Discover the TLC7733IDRG4 by Texas Instruments, a top-quality Power Management IC designed to provide efficient and reliable power supply support. With its compact small outline package and surface mount capability, this versatile device offers exceptional performance for a wide range of applications. Whether you need to regulate voltage levels or protect your circuitry, the TLC7733IDRG4 delivers unrivaled value, providing stable power supplies and optimal functionality. Experience the benefits of Texas Instruments' advanced technology and trust in their renowned expertise in power management. Upgrade your designs today with the TLC7733IDRG4!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the Power Management IC, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation of the Power Management IC onto circuit boards, ensuring a seamless integration into electronic devices.

No. of Functions: 1

With a single function, this Power Management IC simplifies the circuit design, reducing complexity and enhancing overall efficiency.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard circuit board layouts and allows for efficient use of space in electronic devices.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5 V ensures a stable power source for the Power Management IC, enabling reliable performance in a wide range of applications.

Power Supplies (V): 2/6

With support for 2 to 6 power supplies, this Power Management IC offers flexibility in powering different components, enhancing versatility and adaptability.

No. of Terminals: 8

The 8 terminals provide sufficient connectivity options for various connections, making it suitable for diverse electrical setups.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances the product's portability and allows for easy integration into compact devices, making it an ideal choice for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures the Power Management IC can handle demanding operational conditions without compromising its performance or reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the Power Management IC to operate efficiently even in extreme cold environments, making it suitable for diverse applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent corrosion resistance and ensures reliable electrical connections, contributing to the product's long-term durability.

Terminal Position: DUAL

The dual terminal position maximizes design flexibility and simplifies the PCB layout, providing ease of integration and installation.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a compact and slim design, enabling the Power Management IC to be used in space-constrained applications.

Width (mm): 3.9 mm

The small width of 3.9 mm ensures the Power Management IC can be easily accommodated within tight spaces, making it suitable for compact electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

The Power Management IC acts as a power supply support circuit, providing stable power and efficient management, making it an essential component for reliable system operation.

Minimum Supply Voltage (Vsup): 2 V

The minimum supply voltage requirement of 2 V allows for compatibility with a wide range of power sources, ensuring versatility in various applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 C ensures reliable soldering during the manufacturing process, guaranteeing excellent product integrity and quality.

Length: 4.9 mm

The compact length of 4.9 mm enables the Power Management IC to fit seamlessly into small form factor devices, offering versatility and flexibility in design.

Nominal Threshold Voltage (V): +2.93V

The nominal threshold voltage of +2.93V provides an optimal level for triggering the Power Management IC, ensuring accurate and reliable operation.

Temperature Grade: INDUSTRIAL

The industrial temperature grade enables the Power Management IC to withstand harsh environmental conditions, making it suitable for industrial applications where temperature fluctuations are common.

Maximum Supply Current (Isup): 0.016 mA

With a maximum supply current of 0.016 mA, this Power Management IC ensures efficient power consumption, contributing to energy-saving and extended battery life in portable devices.

No. of Channels: 1

The Power Management IC features 1 channel, providing dedicated power management for a single circuit/component, simplifying system design and optimizing performance.

Technology: BICMOS

Utilizing BiCMOS technology, this Power Management IC combines the advantages of both bipolar and CMOS technologies, resulting in improved power efficiency, stability, and performance.

Terminal Form: GULL WING

The gull wing terminal form enables easy and reliable soldering during the manufacturing process, ensuring secure connections and enhancing product reliability.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for compatibility with standard PCB manufacturing processes, offering easy integration and reducing the risk of soldering errors.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, the Power Management IC exhibits excellent resistance against moisture-related damage, enhancing its longevity and reliability.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6 V allows for compatibility with a wide range of power sources, providing versatility and adaptability in various applications.

Technical Specifications

Power Management ICs TLC7733IDRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.016 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TLC7733IDRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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