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TLC7733QDG4

Texas Instruments

TLC7733QDG4 by Texas Instruments

TLC7733QDG4 by Texas Instruments is a Power Management IC with 8 terminals, operating from -40 to 125 °C. It has a supply voltage range of 2-6 V and supports power supply circuits. With BICMOS technology, it's ideal for automotive applications due to its small outline package and low supply current of 0.016 mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,568 parts In-Stock

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2,568

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Digiode

USA . 297 parts In-Stock

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297

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Nova Conductors

Japan . 91 parts In-Stock

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91

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Distributors (Availability)

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Ampacity Inc.

Singapore . 438 parts In-Stock

1+ parts

$0.500

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438

$0.500

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Semicontronic

India . 163 parts In-Stock

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$2.500

100+ parts

$2.438

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$2.425

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163

$2.500

$2.438

$2.425

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Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$6.722

100+ parts

$6.117

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$5.512

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15

$6.722

$6.117

$5.512

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One Stop Electronics

USA . 1,476 parts In-Stock

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$7.500

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$7.500

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Parana Technologies

USA . 70 parts In-Stock

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$10.454

100+ parts

$970.807

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$9.409

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70

$10.454

$970.807

$9.409

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DigiPath Technology Company

USA . 247 parts In-Stock

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$11.511

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247

$11.511

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ChromeModa Solutions

Germany . 4,014 parts In-Stock

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$11.746

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$9.632

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4,014

$11.746

$9.632

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IDEA Electronic Components Group

UK . 1,154 parts In-Stock

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$11.746

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$11.159

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$10.571

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1,154

$11.746

$11.159

$10.571

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AZTECH Wire

Italy . 488 parts In-Stock

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$15.099

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Corohmni

South Africa . 178 parts In-Stock

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$21.072

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Continental Prestige Electronics

USA . 4,075 parts In-Stock

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Corphita

USA . 2,973 parts In-Stock

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Argo Parts USA

USA . 1,331 parts In-Stock

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Lucentia Tech

USA . 250 parts In-Stock

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250

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Perfect Parts

USA . 168 parts In-Stock

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168

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Experience the cutting-edge technology of the TLC7733QDG4 by Texas Instruments, a premier manufacturer known for its superior quality and reliability. This power management IC is essential for various applications in automotive and industrial settings, providing unmatched performance and efficiency. With a compact design and advanced features, this product offers customers unparalleled value, ensuring seamless operation and optimal power supply support. Upgrade your systems with the TLC7733QDG4 and enjoy the benefits of top-tier technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and cost in production.

Nominal Supply Voltage (Vsup): 5 V

The 5V nominal supply voltage is a common and widely compatible voltage level, ensuring compatibility with a wide range of systems.

No. of Terminals: 8

The 8 terminals provide ample connectivity options, allowing for more flexibility in circuit design and configuration.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the product can withstand harsh environmental conditions and prolonged use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability.

Technology: BICMOS

The BICMOS technology used in the product combines the benefits of both bipolar and CMOS technologies, providing high performance and low power consumption.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6V allows for flexibility in power input, accommodating a wide range of power sources.

Technical Specifications

Power Management ICs TLC7733QDG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.016 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TLC7733QDG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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