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ITS4142N

Infineon Technologies

ITS4142N by Infineon Technologies

ITS4142N by Infineon Technologies is a power management IC with a rectangular package shape and small outline style. It operates at a nominal voltage of 15V and has a max seated height of 1.8mm. This IC is commonly used as a power supply support circuit in various applications.

Median Price

$2.215

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bürklin Elektronik

Germany . 6,498 parts In-Stock

1+ parts

$1.270

100+ parts

-

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6,498

$1.270

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Mouser Electronics

USA . 25,888 parts In-Stock

1+ parts

$3.160

100+ parts

$1.620

1k+ parts

$1.120

10k+ parts

$1.020

25,888

$3.160

$1.620

$1.120

$1.020

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 309 parts In-Stock

1+ parts

$1.206

100+ parts

-

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309

$1.206

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Maritex

Poland . 16,500 parts In-Stock

1+ parts

$1.371

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16,500

$1.371

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TME

Poland . 3,109 parts In-Stock

1+ parts

$3.110

100+ parts

$1.590

1k+ parts

$1.180

10k+ parts

$1.140

3,109

$3.110

$1.590

$1.180

$1.140

Vyrian

USA . 20,246 parts In-Stock

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20,246

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Rutronik

Germany . 8,000 parts In-Stock

1+ parts

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$0.843

8,000

-

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$0.843

Tesla II Electronics Inc.

USA . 3,257 parts In-Stock

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3,257

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Nova Conductors

Japan . 870 parts In-Stock

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870

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ComSIT Distribution GmbH

Germany . 285 parts In-Stock

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285

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ComSIT USA

USA . 285 parts In-Stock

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285

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Bas Electronics GmbH & Co. KG

Germany . 260 parts In-Stock

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260

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Holdelec - ElecDif-Pro

France . 75 parts In-Stock

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75

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J2 Sourcing AB

Sweden . 50 parts In-Stock

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50

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Fibra_Brandt Electronic GMBH

Germany . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 20,001 parts In-Stock

1+ parts

$1.080

100+ parts

$1.053

1k+ parts

$1.048

10k+ parts

-

20,001

$1.080

$1.053

$1.048

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Corphita

USA . 596 parts In-Stock

1+ parts

$1.143

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596

$1.143

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Corohmni

South Africa . 83 parts In-Stock

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$1.414

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83

$1.414

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Ampacity Inc.

Singapore . 19,893 parts In-Stock

1+ parts

$2.350

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19,893

$2.350

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Modulus Dynamics

Lithuania . 4,094 parts In-Stock

1+ parts

$6.410

100+ parts

$6.154

1k+ parts

$5.897

10k+ parts

-

4,094

$6.410

$6.154

$5.897

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$9.657

100+ parts

$9.174

1k+ parts

$9.174

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-

100

$9.657

$9.174

$9.174

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Kepictronics

USA . 27,860 parts In-Stock

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Perfect Parts

USA . 17,058 parts In-Stock

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Lixinc

USA . 10,567 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,608 parts In-Stock

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6,608

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Alle Elektronik GmbH

Germany . 5,420 parts In-Stock

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Argo Parts USA

USA . 4,672 parts In-Stock

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4,672

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Futuretech Components

Singapore . 4,000 parts In-Stock

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4,000

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Continental Prestige Electronics

USA . 489 parts In-Stock

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489

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Lucentia Tech

USA . 350 parts In-Stock

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350

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Infineon PROFET™ Smart High-Side Switches are placed between the supply and load to control the application. These highly integrated high-side switches incorporate a broad range of smart features like diagnosis and protection. PROFET switches consist of a DMOS power transistor and CMOS logic circuitry for complete built-in protection against overload, short-circuit, excessive temperature, ground loss, power supply loss, and electrostatic discharge (ESD).

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material offers durability and reliability for the product, making it a good choice for long-term usage.

Surface Mount:

YES - The surface mount feature allows for easy installation and space-saving on circuit boards, making it convenient for compact designs.

No. of Functions:

1 - With a single-function capability, this power management IC simplifies circuit integration and ensures efficient power management.

Package Shape:

RECTANGULAR - The rectangular shape provides stability and ease of mounting, making it suitable for various applications.

Nominal Supply Voltage (Vsup):

15 V - This voltage range ensures compatibility with a wide range of power input sources, enhancing flexibility and adaptability.

No. of Terminals:

4 - The 4 terminals provide convenient connectivity options, allowing for easy integration into different circuit configurations.

Package Style (Meter):

SMALL OUTLINE - The small outline package style saves space and enables dense circuit layouts, making it ideal for compact designs.

Maximum Operating Temperature:

85 °C - With a high maximum operating temperature, this power management IC can withstand demanding conditions, ensuring reliability in extreme environments.

Minimum Operating Temperature:

30 °C - The low minimum operating temperature allows for operation in colder environments, expanding the range of applications for this product.

Terminal Finish:

TIN - The tin terminal finish offers good solderability and corrosion resistance, contributing to the product's longevity and reliability.

Terminal Position:

DUAL - The dual terminal position provides flexibility in circuit board mounting orientations, accommodating various layout requirements.

Maximum Seated Height:

1.8 mm - With a low seated height, this IC is suitable for applications with limited vertical space, promoting efficient board design.

Width (mm):

3.5 mm - The compact width of 3.5mm allows for efficient use of board space, enabling high-density circuit designs.

Other IC type:

POWER SUPPLY SUPPORT CIRCUIT - This power management IC serves as a reliable support circuit for power supply systems, enhancing overall system performance.

Minimum Supply Voltage (Vsup):

12 V - The low minimum supply voltage ensures compatibility with diverse power supply sources, increasing versatility and usability.

Peak Reflow Temperature °C:

260 - With a high peak reflow temperature, this IC can withstand the reflow soldering process, ensuring reliable solder joints during assembly.

Length:

6.5 mm - The compact length of 6.5mm allows for efficient space utilization on circuit boards, facilitating compact system designs.

Maximum Supply Current (Isup):

1.6 mA - With a low maximum supply current, this IC consumes minimal power, contributing to energy efficiency in power management applications.

No. of Channels:

1 - The single-channel configuration simplifies circuit design and integration, ensuring efficient power distribution in various applications.

Technology:

MOS - The MOS technology employed in this IC offers high switching speeds and low power dissipation, resulting in efficient power management and reduced heat generation.

Terminal Form:

GULL WING - The gull wing terminal form allows for easy soldering and reliable electrical connections, ensuring robust performance in demanding applications.

Terminal Pitch:

2.3 mm - The 2.3mm terminal pitch provides sufficient spacing for easy soldering and maintenance, facilitating efficient board assembly.

Moisture Sensitivity Level (MSL):

3 - With a MSL level of 3, this power management IC has moderate moisture sensitivity, allowing for safe storage and handling.

Maximum Supply Voltage (Vsup):

45 V - With a high maximum supply voltage, this IC can handle a wide voltage range, making it suitable for various power supply systems.

Technical Specifications

Power Management ICs ITS4142N attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Additional Features:

THRESHOLD VOLTAGE FROM 1.82 V TO 3 V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.8 mm

Maximum Supply Current (Isup):

1.6 mA

Maximum Supply Voltage (Vsup):

45 V

Minimum Supply Voltage (Vsup):

12 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

2.3 mm

Terminal Position:

DUAL

Width (mm):

3.5 mm

Trade Compliance

ITS4142N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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