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BTS500801TEBAUMA1

Infineon Technologies

BTS500801TEBAUMA1 by Infineon Technologies

BTS500801TEBAUMA1 by Infineon Technologies is a Power Management IC with a supply voltage range of 5.5V to 30V. It has a small outline package style and is suitable for power supply support circuits. With its SIPMOS technology, it operates in temperatures ranging from -40°C to 150°C.

Median Price

$2.075

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,269 parts In-Stock

1+ parts

$3.790

100+ parts

$2.370

1k+ parts

$2.115

10k+ parts

-

2,269

$3.790

$2.370

$2.115

-

Rochester

USA . 3,676 parts In-Stock

1+ parts

-

100+ parts

$1.850

1k+ parts

$1.660

10k+ parts

$1.560

3,676

-

$1.850

$1.660

$1.560

Verical

USA . 3,676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.075

10k+ parts

$1.950

3,676

-

-

$2.075

$1.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 395 parts In-Stock

1+ parts

$1.966

100+ parts

-

1k+ parts

-

10k+ parts

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395

$1.966

-

-

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$2.628

100+ parts

-

1k+ parts

-

10k+ parts

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300

$2.628

-

-

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VNN

France . 17,106 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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17,106

-

-

-

-

Chip Stock

USA . 4,800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,800

-

-

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Vyrian

USA . 3,957 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,957

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,557 parts In-Stock

1+ parts

$1.760

100+ parts

$1.716

1k+ parts

$1.707

10k+ parts

-

3,557

$1.760

$1.716

$1.707

-

Ampacity Inc.

Singapore . 3,475 parts In-Stock

1+ parts

$1.760

100+ parts

-

1k+ parts

-

10k+ parts

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3,475

$1.760

-

-

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Corphita

USA . 277 parts In-Stock

1+ parts

$1.863

100+ parts

-

1k+ parts

-

10k+ parts

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277

$1.863

-

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Component Stockers USA

USA . 5,568 parts In-Stock

1+ parts

$2.000

100+ parts

$1.880

1k+ parts

$1.700

10k+ parts

-

5,568

$2.000

$1.880

$1.700

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Modulus Dynamics

Lithuania . 4,175 parts In-Stock

1+ parts

$2.483

100+ parts

$2.384

1k+ parts

$2.284

10k+ parts

-

4,175

$2.483

$2.384

$2.284

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Corohmni

South Africa . 134 parts In-Stock

1+ parts

$2.483

100+ parts

-

1k+ parts

-

10k+ parts

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134

$2.483

-

-

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$2.576

100+ parts

-

1k+ parts

$2.473

10k+ parts

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500

$2.576

-

$2.473

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Continental Prestige Electronics

USA . 2,956 parts In-Stock

1+ parts

$2.628

100+ parts

-

1k+ parts

-

10k+ parts

$2.576

2,956

$2.628

-

-

$2.576

Argo Parts USA

USA . 1,400 parts In-Stock

1+ parts

$2.628

100+ parts

-

1k+ parts

-

10k+ parts

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1,400

$2.628

-

-

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Aztec Data Supply Inc.

USA . 410 parts In-Stock

1+ parts

$6.760

100+ parts

-

1k+ parts

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10k+ parts

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410

$6.760

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-

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Perfect Parts

USA . 26,958 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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26,958

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Overview

Experience the power of Infineon Technologies with the BTS500801TEBAUMA1 Power Management IC. This small, yet mighty device offers incredible value and benefits to our customers. With its high-quality manufacturing and advanced technology, this product delivers exceptional performance in a wide range of applications. Whether you need support for power supplies or require a reliable solution for your circuit, the BTS500801TEBAUMA1 has got you covered. Trust Infineon Technologies for unwavering quality and enjoy the advantages of this remarkable power management IC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and resistance to heat, making this power management IC suitable for various environments.

Surface Mount: YES

The surface mount feature enables easy and efficient installation onto PCBs, saving time and effort during assembly.

No. of Functions: 1

With a single function, this power management IC simplifies circuit design and reduces component count, resulting in a more cost-effective solution.

Screening Level: AEC-Q100

Meeting the AEC-Q100 screening level ensures that this power management IC complies with automotive industry quality and performance standards, making it suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for compact and space-efficient integration into electronic devices, facilitating the design of compact and lightweight power management systems.

Nominal Supply Voltage (Vsup): 12 V

The nominal supply voltage of 12V offers compatibility with a wide range of power sources, increasing versatility and ease of use in various applications.

No. of Terminals: 4

With only four terminals, this power management IC simplifies circuit connections, reducing complexity and minimizing the risk of errors during installation.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package style, combined with a heat sink/slug, aids in efficient heat dissipation, enhancing the reliability and performance of the power management IC under heavy load conditions.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C ensures the power management IC's reliability and stability even in demanding environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this power management IC to operate reliably in extremely cold environments, expanding its range of applications.

Terminal Finish: TIN

The tin terminal finish provides good solderability and corrosion resistance, ensuring reliable electrical connections and longevity of the power management IC.

Terminal Position: SINGLE

The single terminal position simplifies mounting and makes the power management IC suitable for automated assembly processes, saving time and increasing productivity.

Maximum Seated Height: 2.5 mm

The low maximum seated height enables the power management IC to be used in space-constrained designs, allowing for compact and slim devices.

Width (mm): 6.22 mm

The narrow width of 6.22mm ensures that the power management IC can be used in compact electronic systems where space is limited, providing versatility in various applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This power management IC functions as a power supply support circuit, providing essential power management capabilities, enhancing system stability, and protecting downstream components.

Minimum Supply Voltage (Vsup): 5.5 V

The low minimum supply voltage requirement of 5.5V allows for compatibility with a wide range of power sources, ensuring flexibility in various applications.

Length: 6.5 mm

The compact length of 6.5mm makes this power management IC suitable for small and space-restricted PCB layouts, contributing to the overall miniaturization of electronic devices.

Nominal Threshold Voltage (V): +3.5V

The nominal threshold voltage of +3.5V ensures accurate and reliable voltage measurement, providing precise control and protection in power management applications.

Maximum Supply Current (Isup): 2.2 mA

With a low maximum supply current of 2.2mA, this power management IC operates efficiently and minimizes power consumption, making it ideal for energy-conscious designs.

No. of Channels: 1

Equipped with a single channel, this power management IC simplifies system integration and enables precise power management for a specific function or device.

Technology: SIPMOS

Utilizing SIPMOS technology, this power management IC offers high efficiency and fast switching characteristics, ensuring optimal performance and power conversion.

Terminal Form: GULL WING

The gull wing terminal form enables secure and reliable solder connections, reducing the risk of electrical failures and enhancing the overall durability of the power management IC.

Terminal Pitch: 1.14 mm

With a small terminal pitch of 1.14mm, this power management IC can be easily integrated into densely packed PCBs, enabling high-density circuit designs and miniaturization of electronic systems.

Moisture Sensitivity Level (MSL): 3

Possessing MSL 3, this power management IC can withstand moderate moisture exposure during storage and handling, ensuring its reliability and usability in various environments.

Maximum Supply Voltage (Vsup): 30 V

With a high maximum supply voltage of 30V, this power management IC offers compatibility with a wide range of power sources, making it suitable for diverse applications and power requirements.

Technical Specifications

Power Management ICs BTS500801TEBAUMA1 attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP4/5H,.39,44TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Screening Level:

AEC-Q100

Maximum Seated Height:

2.5 mm

Maximum Supply Current (Isup):

2.2 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

5.5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

SIPMOS

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.14 mm

Terminal Position:

SINGLE

Nominal Threshold Voltage (V):

+3.5V

Width (mm):

6.22 mm

Trade Compliance

BTS500801TEBAUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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