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MC32PF1550A3EP

NXP Semiconductors

MC32PF1550A3EP by NXP Semiconductors

MC32PF1550A3EP by NXP Semiconductors is a Power Management IC with 40 terminals, operating b/w -40 to 85°C. It has a nominal voltage of 3.6V and supports up to 7 channels. Ideal for power supply management circuits in applications requiring precise voltage thresholds and adjustable settings.

Median Price

$5.830

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 490 parts In-Stock

1+ parts

$5.630

100+ parts

$3.420

1k+ parts

$3.000

10k+ parts

$2.510

490

$5.630

$3.420

$3.000

$2.510

Mouser Electronics

USA . 490 parts In-Stock

1+ parts

$5.830

100+ parts

$3.720

1k+ parts

$3.420

10k+ parts

-

490

$5.830

$3.720

$3.420

-

DigiKey

USA . 440 parts In-Stock

1+ parts

$6.020

100+ parts

$3.867

1k+ parts

$3.481

10k+ parts

$3.368

440

$6.020

$3.867

$3.481

$3.368

Avnet

USA . 1,470 parts In-Stock

1+ parts

-

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1,470

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Distributors (In-Stock)

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Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$3.615

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550

$3.615

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Digiode

USA . 4,837 parts In-Stock

1+ parts

$4.798

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4,837

$4.798

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Flip Electronics

USA . 711 parts In-Stock

1+ parts

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711

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Anansix

USA . 307 parts In-Stock

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307

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Vyrian

USA . 264 parts In-Stock

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264

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Distributors (Availability)

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Argo Parts USA

USA . 4,023 parts In-Stock

1+ parts

$3.612

100+ parts

-

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4,023

$3.612

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Continental Prestige Electronics

USA . 2,711 parts In-Stock

1+ parts

$3.612

100+ parts

-

1k+ parts

-

10k+ parts

$3.540

2,711

$3.612

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-

$3.540

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.615

100+ parts

-

1k+ parts

$3.434

10k+ parts

$3.362

2,000

$3.615

-

$3.434

$3.362

Ampacity Inc.

Singapore . 504 parts In-Stock

1+ parts

$4.290

100+ parts

-

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504

$4.290

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Semicontronic

India . 73 parts In-Stock

1+ parts

$4.290

100+ parts

$4.183

1k+ parts

$4.161

10k+ parts

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73

$4.290

$4.183

$4.161

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Corphita

USA . 3,632 parts In-Stock

1+ parts

$4.545

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3,632

$4.545

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Corohmni

South Africa . 726 parts In-Stock

1+ parts

$14.673

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726

$14.673

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Aztec Data Supply Inc.

USA . 5,205 parts In-Stock

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$19.700

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$19.700

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Microchip USA

USA . 1,797 parts In-Stock

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$23.031

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1,797

$23.031

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Lixinc

USA . 9,439 parts In-Stock

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9,439

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Authorized Procurement Solutions

USA . 5,500 parts In-Stock

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5,500

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UNI Independent Distributors

Spain . 3,923 parts In-Stock

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3,923

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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900

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Overview

Discover the MC32PF1550A3EP by NXP Semiconductors, a high-quality Power Management IC designed to optimize performance and efficiency in various applications. With a focus on innovation and reliability, NXP Semiconductors delivers a product that not only meets but exceeds industry standards. This versatile chip carrier with a very thin profile offers customers the value of superior power supply management circuitry, ensuring stable operation and maximum efficiency. Whether you're looking to enhance your device's performance or streamline power consumption, the MC32PF1550A3EP provides unbeatable benefits and advantages for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for a variety of environments.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.6 V

Provides a stable and reliable power source for the device, ensuring consistent performance.

No. of Terminals: 40

Offers multiple connection points for various components, allowing for versatility in circuit design.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for applications that generate heat.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring a reliable connection over time.

Width (mm): 5 mm

Compact size enables the IC to fit in tight spaces, ideal for applications with limited board real estate.

Minimum Supply Voltage (Vsup): 2.5 V

Allows for operation in lower voltage scenarios, increasing flexibility in power supply options.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during manufacturing, ensuring proper soldering and assembly.

No. of Channels: 7

Multiple channels provide options for managing power distribution and monitoring, enhancing system control.

Technical Specifications

Power Management ICs MC32PF1550A3EP attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

7

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+6.5V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

5 mm

Trade Compliance

MC32PF1550A3EP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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