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MC32PF3000A7EPR2

NXP Semiconductors

MC32PF3000A7EPR2 by NXP Semiconductors

MC32PF3000A7EPR2 by NXP Semiconductors is a Power Management IC with 12 channels, operating voltage range of 2.8V to 4.5V, and industrial temperature grade. It features a square package shape, very thin profile, and quad terminal position suitable for power supply support circuits in various applications.

Median Price

$4.590

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 23 parts In-Stock

1+ parts

$4.590

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23

$4.590

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Chip Stock

USA . 11,500 parts In-Stock

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11,500

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Vyrian

USA . 8,644 parts In-Stock

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8,644

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Flip Electronics

USA . 8,000 parts In-Stock

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8,000

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Digiode

USA . 896 parts In-Stock

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896

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Anansix

USA . 171 parts In-Stock

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171

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 953 parts In-Stock

1+ parts

$1.500

100+ parts

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953

$1.500

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Semicontronic

India . 295 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

10k+ parts

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295

$2.500

$2.438

$2.425

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One Stop Electronics

USA . 851 parts In-Stock

1+ parts

$4.500

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851

$4.500

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Continental Prestige Electronics

USA . 269 parts In-Stock

1+ parts

$4.590

100+ parts

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$4.498

269

$4.590

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-

$4.498

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$6.549

100+ parts

$6.221

1k+ parts

$6.221

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5,000

$6.549

$6.221

$6.221

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AZTECH Wire

Italy . 192 parts In-Stock

1+ parts

$7.580

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192

$7.580

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Corohmni

South Africa . 42 parts In-Stock

1+ parts

$15.758

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42

$15.758

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Aztec Data Supply Inc.

USA . 3,641 parts In-Stock

1+ parts

$19.090

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3,641

$19.090

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Microchip USA

USA . 5,530 parts In-Stock

1+ parts

$28.880

100+ parts

$28.700

1k+ parts

$28.610

10k+ parts

$28.520

5,530

$28.880

$28.700

$28.610

$28.520

UNI Independent Distributors

Spain . 8,088 parts In-Stock

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8,088

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Argo Parts USA

USA . 4,083 parts In-Stock

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4,083

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Corphita

USA . 3,960 parts In-Stock

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3,960

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$4.498

1k+ parts

$4.361

10k+ parts

$4.269

50

-

$4.498

$4.361

$4.269

Overview

Elevate your power management solutions with the MC32PF3000A7EPR2 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-notch quality and reliability in their products. This Power Management IC is designed to meet the highest standards of performance, making it ideal for a wide range of applications. With its advanced features and innovative technology, customers can expect seamless integration, optimal efficiency, and exceptional functionality. Experience the value and benefits that the MC32PF3000A7EPR2 brings to your projects and elevate your power management capabilities today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on printed circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.6 V

Optimal supply voltage for efficient power management and performance.

No. of Terminals: 48

Provides flexibility and connectivity options for various components and peripherals.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Ideal for applications that require operation in extreme cold conditions.

Terminal Finish: TIN

Tin finish provides good solderability and corrosion resistance for robust connections.

Width (mm): 7 mm

Compact size allows for space-saving integration in constrained layouts.

Minimum Supply Voltage (Vsup): 2.8 V

Supports a wide range of input voltages for versatile power management capabilities.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures proper soldering during assembly process for reliable performance.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable high-density mounting for efficient use of board space.

Adjustable Threshold: YES

Allows for customization of threshold levels to suit specific application requirements.

Technical Specifications

Power Management ICs MC32PF3000A7EPR2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

12

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7 mm

Trade Compliance

MC32PF3000A7EPR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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